Our Thermal Via LED PCBs represent the cutting edge of heat dissipation technology, specifically engineered to address the critical thermal challenges in high-power LED applications. By incorporating strategically placed thermal vias throughout the circuit board design, these PCBs deliver exceptional heat transfer capabilities that extend LED lifespan and maintain optimal performance.
Key Features
Advanced Thermal Via Architecture
- Micro-vias filled with thermally conductive materials create direct heat transfer pathways
- High-density via placement beneath LED mounting areas for maximum thermal coupling
- Multi-layer thermal spreading design distributes heat across the entire board surface
Superior Heat Dissipation Performance
- Thermal resistance as low as 0.5°C/W depending on configuration
- Reduces LED junction temperatures by up to 30% compared to standard PCBs
- Maintains consistent light output and color temperature under high-power operation
Professional-Grade Construction
- High thermal conductivity substrates including aluminum-core and copper-core options
- Precision-drilled vias with consistent fill quality and minimal voids
- IPC-compliant manufacturing standards ensure reliability and consistency
Technical Specifications
- Thermal Conductivity: Up to 8.0 W/mK depending on substrate selection
- Via Diameter: 0.1mm to 0.5mm with customizable spacing
- Layer Count: 1 to 8 layers available
- Operating Temperature Range: -40°C to +150°C
- Dielectric Breakdown: >3000V minimum
Applications
Perfect for demanding LED applications including architectural lighting, automotive headlights, industrial illumination, grow lights, and high-bay fixtures where thermal management is critical for performance and longevity.
Available in custom sizes and configurations to meet your specific thermal and electrical requirements.
Contact our engineering team for thermal modeling and design optimization services.
