Revolutionary Integration for Next-Generation Electronics
Our System in Package (SiP) PCB technology represents the pinnacle of miniaturization and performance optimization in modern electronics. By integrating multiple semiconductor dies, passive components, and interconnects into a single compact package, SiP PCBs deliver unprecedented functionality density while maintaining superior electrical performance.
Key Features:
Ultra-High Integration Density – Combine processors, memory, RF components, sensors, and passive elements in a single package, reducing footprint by up to 70% compared to traditional multi-chip solutions.
Advanced Substrate Technology – Built on high-performance organic substrates with fine-pitch routing capabilities, supporting trace widths down to 15μm and via sizes as small as 50μm for maximum routing efficiency.
Superior Electrical Performance – Minimized signal paths reduce parasitic effects, improving signal integrity and enabling higher operating frequencies with lower power consumption.
Flexible Architecture – Supports heterogeneous integration of different process technologies, allowing optimal die selection for each function within the system.
Enhanced Thermal Management – Integrated thermal solutions including embedded heat spreaders and thermal vias ensure reliable operation under demanding conditions.
Applications:
Our SiP PCB solutions excel in space-constrained, high-performance applications including 5G/6G wireless infrastructure, IoT devices, wearable electronics, automotive radar systems, and advanced mobile computing platforms. The technology is particularly valuable for applications requiring mixed-signal integration, where analog, digital, and RF functions must coexist with minimal interference.
Manufacturing Excellence:
Produced in ISO 9001 certified facilities using state-of-the-art assembly processes including precision die attach, wire bonding, flip-chip technology, and advanced molding compounds. Comprehensive testing and validation ensure 99.9% reliability standards.
Transform your next-generation designs with SiP PCB technology that delivers maximum functionality in minimum space.
