Product Overview
Rogers RT/duroid 6035HTC is a premium ceramic-filled PTFE (polytetrafluoroethylene) composite laminate specifically engineered for demanding high-power RF and microwave applications. This advanced circuit board material delivers exceptional thermal management capabilities combined with outstanding electrical performance, making it the ideal choice for applications where heat dissipation and signal integrity are critical.
Key Features & Benefits
Superior Thermal Performance
- High Thermal Conductivity: 1.44 W/m/ยฐK – approximately 2.4 times higher than standard RT/duroid 6000 series materials
- Enhanced Heat Dissipation: Enables significantly lower operating temperatures in high-power applications
- Excellent Long-Term Thermal Stability: Maintains performance characteristics under sustained high-temperature conditions
Outstanding Electrical Properties
- Low Dielectric Constant: 3.50 ยฑ 0.05 (process), 3.60 (design) at 10 GHz
- Ultra-Low Loss Tangent: 0.0013 at 10 GHz for minimal signal loss
- Excellent Temperature Stability: Thermal coefficient of dielectric constant: -66 ppm/ยฐC
- High Volume Resistivity: 1ร10โธ Mohm for superior insulation
Advanced Manufacturing Benefits
- Superior Drillability: Rogers’ advanced filler system eliminates hard alumina fillers, significantly reducing drilling costs and extending tool life
- Excellent Dimensional Stability: Low coefficient of thermal expansion (X: 19 ppm/ยฐC, Y: 19 ppm/ยฐC, Z: 39 ppm/ยฐC)
- Strong Copper Adhesion: 7.9 lbs/in. peel strength with ED copper foil
- Lead-Free Process Compatible: Suitable for RoHS-compliant manufacturing
Technical Specifications
| Property | Value | Test Condition |
|---|---|---|
| Dielectric Constant | 3.50 ยฑ 0.05 | 10 GHz |
| Dissipation Factor | 0.0013 | 10 GHz |
| Thermal Conductivity | 1.44 W/m/ยฐK | 50ยฐC, ASTM D5470 |
| Thermal Coefficient ฮตr | -66 ppm/ยฐC | -50ยฐC to 150ยฐC |
| Water Absorption | 0.06% | D48/50% |
| Density | 2.2 gm/cmยณ | – |
| Flammability Rating | V-0 | UL94 |
| Volume Resistivity | 1ร10โธ Mohm | Typical |
Primary Applications
High-Power RF & Microwave Systems
- Power amplifiers for cellular base stations
- High-power RF amplifiers
- Radar and satellite communication systems
- Military and aerospace electronics
Circuit Components
- Couplers and power dividers
- High-power filters and combiners
- Microwave antennas
- Power distribution networks
Industrial Applications
- Automotive radar systems
- Wireless infrastructure equipment
- Medical RF equipment
- High-frequency test equipment
Why Choose Rogers 6035HTC?
Thermal Management Excellence: The enhanced thermal conductivity allows for effective heat dissipation in high-power applications, preventing component overheating and extending system reliability.
Cost-Effective Manufacturing: Unlike traditional high thermal conductivity laminates that use alumina fillers, the 6035HTC’s advanced filler system provides excellent machinability, reducing drilling costs and manufacturing complexity.
Proven Reliability: Part of Rogers’ renowned RT/duroid family with decades of proven performance in demanding applications worldwide.
Design Flexibility: Available in various thicknesses to accommodate different design requirements and impedance specifications.
Quality & Compliance
- IPC-Class-2 Standard: Meets rigorous industry quality standards
- UL94 V-0 Flammability Rating: Ensures safety in critical applications
- RoHS Compliant: Lead-free process compatible for environmental compliance
- ISO Certified Manufacturing: Consistent quality and reliability
Rogers RT/duroidยฎ 6035HTC represents the pinnacle of high-temperature, high-frequency circuit board technology, delivering unmatched performance for the most demanding RF and microwave applications where thermal management and electrical performance are paramount.
