Revolutionary Heat Management Technology
Transform your high-performance electronics with our cutting-edge Liquid Cooling PCB system, engineered to deliver superior thermal management for demanding applications. This innovative solution integrates liquid cooling channels directly into the printed circuit board architecture, providing unprecedented heat dissipation capabilities for mission-critical components.
Key Features
Integrated Cooling Architecture Our proprietary design embeds micro-channels and cooling pathways directly within the PCB substrate, creating a seamless thermal management system that maintains optimal operating temperatures even under extreme loads.
Advanced Materials Engineering Constructed with high thermal conductivity substrates and specialized dielectric materials that maximize heat transfer while maintaining excellent electrical performance and signal integrity.
Scalable Design Options Available in multiple form factors and configurations to accommodate everything from compact embedded systems to large-scale server applications, with customizable channel layouts and flow patterns.
Superior Performance Metrics
- Thermal resistance as low as 0.1°C/W
- Operating temperature range: -40°C to +125°C
- Heat flux handling up to 500 W/cm²
- Pump-free operation options available
Applications
Data Centers & Server Infrastructure Ideal for high-density server racks, GPU clusters, and cryptocurrency mining operations where traditional air cooling falls short.
Automotive Electronics Perfect for electric vehicle power electronics, autonomous driving computers, and high-performance engine control units requiring reliable thermal management.
Industrial & Aerospace Designed to meet the rigorous demands of industrial automation, satellite systems, and defense applications where failure is not an option.
Gaming & Enthusiast Computing Enables extreme overclocking and sustained peak performance for gaming rigs, workstations, and high-end consumer electronics.
Technical Specifications
- PCB Thickness: 1.6mm – 6.0mm (customizable)
- Layer Count: 4-32 layers with integrated cooling
- Coolant Compatibility: Water, glycol mixtures, dielectric fluids
- Pressure Rating: Up to 10 bar (145 psi)
- Flow Rate: 0.1 – 5.0 L/min per channel
- Material Options: FR4-Enhanced, Polyimide, Ceramic substrates
Why Choose Our Liquid Cooling PCB?
Proven Reliability Extensively tested across temperature cycles, vibration, and long-term operation to ensure consistent performance in the most challenging environments.
Design Flexibility Our engineering team works closely with customers to optimize cooling channel placement, flow patterns, and thermal interfaces for maximum efficiency in your specific application.
Cost-Effective Solution Eliminates the need for bulky external cooling systems, reducing overall system size, weight, and manufacturing complexity while improving performance.
Future-Ready Technology Supports next-generation high-power semiconductors and emerging technologies that demand advanced thermal management solutions.
Get Started Today
Ready to revolutionize your thermal management strategy? Contact our engineering team for a custom consultation and discover how Liquid Cooling PCB technology can unlock new performance levels in your applications.
Transform heat from a limitation into a competitive advantage.
