“We’ve trusted Rayming with multiple PCB orders, and they’ve never disappointed. Their manufacturing process is top-tier, and their team is always helpful. A+ service!”

I have had excellent service from RayMing PCB over 10 years. Your engineers have helped me and saved me many times.

Rayming provides top-notch PCB assembly services at competitive prices. Their customer support is excellent, and they always go the extra mile to ensure satisfaction. A trusted partner!

RAYMING Laser Drilled Via PCB – Precision Micro Vias

Original price was: $44.00.Current price is: $43.00.

Advanced Microvias for High-Density Interconnect Applications

Our Laser Drilled Via PCBs feature precision-engineered micro vias created using state-of-the-art laser drilling technology. These ultra-small interconnects enable exceptional routing density and signal integrity for today’s most demanding electronic applications.

Key Features

Precision Manufacturing

  • Via diameters as small as 25-100 microns with exceptional accuracy
  • Aspect ratios up to 1:1 for reliable plating and filling
  • Clean, debris-free holes with smooth sidewalls
  • Tight positional tolerances (±25 microns typical)

High-Density Capabilities

  • Support for HDI (High Density Interconnect) designs
  • Multiple stacked microvia configurations
  • Via-in-pad technology for maximum space utilization
  • Compatible with fine-pitch BGA and CSP packages

Superior Performance

  • Low inductance and capacitance for high-speed signals
  • Excellent signal integrity with minimal crosstalk
  • Reliable electrical connections with consistent impedance
  • Enhanced thermal management through optimized via placement

Applications

  • Mobile Devices: Smartphones, tablets, wearables
  • Computing: Processors, memory modules, graphics cards
  • Telecommunications: 5G infrastructure, network equipment
  • Automotive Electronics: ADAS systems, infotainment
  • Medical Devices: Implantables, diagnostic equipment
  • Aerospace: Avionics, satellite communications

Technical Specifications

  • Via Diameter Range: 25-150 microns
  • Drill Depth: Up to 200 microns per layer
  • Layer Support: 4-20+ layers
  • Substrate Materials: FR-4, polyimide, PTFE, ceramic
  • Plating Options: Copper, gold, silver finishes available
  • Design Rules: Compatible with IPC-2226 standards

Manufacturing Advantages

Our laser drilling process ensures consistent quality and repeatability while maintaining cost-effectiveness for both prototype and production volumes. The non-contact drilling method eliminates mechanical stress and enables complex via geometries not possible with traditional drilling methods.

Quality Assurance: Each PCB undergoes comprehensive electrical testing and visual inspection to guarantee via integrity and performance reliability.

Contact our engineering team for custom specifications and design consultation to optimize your HDI PCB requirements.