HDI (High Density Interconnect) PCBs represent the cutting edge of printed circuit board technology, delivering unparalleled miniaturization and performance for today’s most demanding electronic applications. These advanced boards utilize microvias, buried vias, and sequential lamination techniques to achieve component densities and routing capabilities impossible with traditional PCB manufacturing.
Key Features & Capabilities:
Our HDI PCB manufacturing process supports complex multilayer constructions with via-in-pad technology, allowing for extremely tight component spacing and reduced board footprints. We manufacture boards with line widths and spacing as fine as 50μm, microvia diameters down to 100μm, and layer counts exceeding 20 layers while maintaining exceptional signal integrity and thermal management.
Advanced Manufacturing Technologies:
Our state-of-the-art facility employs laser drilling for precise microvia formation, sequential build-up (SBU) processes for complex layer stacking, and advanced plating techniques ensuring reliable interconnections throughout the board structure. We utilize automated optical inspection (AOI) and electrical testing at every critical stage to guarantee consistent quality and reliability.
Applications & Industries:
HDI PCBs are essential for smartphones, tablets, wearable devices, medical implants, aerospace systems, and high-performance computing applications where space constraints and signal integrity are critical. These boards enable the miniaturization trends driving modern electronics while supporting high-speed digital signals, RF applications, and mixed-signal designs.
Quality & Compliance:
All HDI PCBs are manufactured to IPC Class 2 and Class 3 standards with full traceability and comprehensive testing protocols. We maintain ISO 9001, ISO 14001, and IATF 16949 certifications, ensuring consistent quality for automotive, medical, and aerospace applications.
Custom Solutions:
We work closely with design engineers to optimize HDI stackups for specific applications, providing design-for-manufacturing (DFM) guidance and rapid prototyping services to accelerate time-to-market for innovative products requiring advanced PCB technology.
