Our advanced HDI (High Density Interconnect) PCB manufacturing delivers cutting-edge printed circuit boards engineered for today’s most demanding electronic applications. HDI technology enables exceptional miniaturization and performance through microvias, fine-pitch components, and multi-layer stackups that maximize routing density in minimal space.
Key Features:
- Microvia Technology: Laser-drilled microvias as small as 0.1mm diameter for ultra-dense interconnections
- Fine Line/Space Capability: Trace widths and spacing down to 2/2 mil (50/50 ฮผm) for maximum routing efficiency
- Advanced Layer Count: Support for 4-20+ layer constructions with sequential lamination
- Via-in-Pad Design: Direct component mounting on microvias for space optimization
- Blind and Buried Vias: Complex via structures enabling sophisticated routing architectures
Technical Specifications:
- Minimum via size: 0.1mm (4 mil)
- Maximum layer count: 20+ layers
- Minimum trace/space: 50/50 ฮผm (2/2 mil)
- PCB thickness range: 0.4mm – 3.2mm
- Surface finishes: HASL, ENIG, OSP, Immersion Silver
- Materials: FR4, Rogers, Polyimide, and other high-performance substrates
Applications: Perfect for smartphones, tablets, wearables, medical devices, aerospace electronics, and any application requiring maximum functionality in minimal footprint. Our HDI PCBs enable designers to achieve higher component density, improved signal integrity, and enhanced thermal management.
Quality Assurance: ISO 9001 certified manufacturing with comprehensive testing including electrical testing, cross-sectional analysis, and reliability validation. Every HDI PCB undergoes rigorous inspection to ensure consistent quality and performance.
Contact us today for custom HDI PCB solutions tailored to your specific requirements.
