Our advanced rigid flex circuit boards combine the reliability of rigid PCBs with the flexibility of flex circuits, delivering innovative solutions for complex electronic applications. These hybrid boards feature rigid sections for component mounting and flexible interconnects that enable three-dimensional packaging and dynamic flexing capabilities.
Key Features:
- Hybrid Construction: Seamlessly integrates rigid and flexible sections in a single board design
- Space-Saving Design: Eliminates connectors and cables, reducing overall system size by up to 60%
- Enhanced Reliability: Fewer interconnection points minimize failure risks and improve signal integrity
- Dynamic Flex Capability: Flexible sections withstand repeated bending cycles for moving applications
- Multi-Layer Options: Available in 2-20 layer configurations to meet complex routing requirements
Technical Specifications:
- Flexible Materials: High-performance polyimide substrates with excellent thermal stability
- Rigid Materials: FR4, high-frequency laminates, and specialized materials for demanding applications
- Copper Weight: 0.5oz to 2oz copper thickness options
- Minimum Trace Width: Down to 0.075mm (3 mil) for high-density designs
- Via Technology: Micro vias, blind vias, and buried vias for complex interconnections
- Bend Radius: As tight as 1:1 ratio for dynamic flex applications
Applications:
- Medical devices and wearable electronics
- Aerospace and defense systems
- Automotive electronics and sensors
- Consumer electronics and mobile devices
- Industrial automation and robotics
- LED lighting and display systems
Manufacturing Capabilities: Our state-of-the-art facility employs advanced fabrication techniques including controlled impedance matching, fine-pitch component compatibility, and rigorous quality testing. We maintain ISO 9001 and IPC Class 3 certifications, ensuring consistent quality and reliability for mission-critical applications.
Custom Solutions Available: Our engineering team works closely with clients to optimize designs for manufacturability, cost-effectiveness, and performance requirements.
