Precision Engineering for Next-Generation Electronics
Our Fine Pitch PCB Assembly service delivers exceptional micro component placement capabilities for the most demanding electronic applications. Specializing in ultra-precise component placement with pitches as fine as 0.3mm, we enable the development of compact, high-performance electronic devices across industries including medical devices, aerospace, telecommunications, and consumer electronics.
Key Capabilities
Ultra-Fine Pitch Expertise: Handle components with lead pitches down to 0.3mm (0.012″), including 01005 chip components, micro BGAs, and ultra-fine QFPs. Our advanced placement equipment ensures accurate positioning with tolerances of ยฑ25ฮผm.
Micro Component Mastery: Expert placement of the smallest available components including 01005 resistors and capacitors, micro inductors, ultra-miniature connectors, and embedded components. We manage component sizes as small as 0.4mm x 0.2mm with consistent reliability.
High-Density Assembly: Maximize board real estate efficiency with component densities exceeding 10,000 components per square inch. Our precision placement capabilities enable complex routing in minimal space while maintaining signal integrity.
Advanced Inspection Systems: State-of-the-art AOI (Automated Optical Inspection) and AXI (Automated X-ray Inspection) systems verify placement accuracy, solder joint quality, and detect potential defects invisible to standard inspection methods.
Technical Specifications
- Minimum component size: 01005 (0.4mm x 0.2mm)
- Placement accuracy: ยฑ25ฮผm @ 3ฯ
- Fine pitch capability: Down to 0.3mm lead pitch
- BGA pitch capability: 0.4mm minimum
- Component height range: 0.1mm to 15mm
- Board thickness: 0.1mm to 6.4mm
Quality Assurance
Every assembly undergoes rigorous multi-stage inspection including pre-placement component verification, real-time placement monitoring, post-reflow AOI, and final functional testing. Our ISO 9001:2015 and IPC Class 3 certified processes ensure consistent quality and reliability.
Applications
Ideal for medical implants, hearing aids, smartphones, wearable devices, IoT sensors, military electronics, and any application requiring maximum functionality in minimal space. Our fine pitch assembly capabilities enable breakthrough product miniaturization while maintaining performance and reliability standards.
Ready to push the boundaries of miniaturization? Contact our engineering team to discuss your fine pitch PCB assembly requirements.
