Our Fine Pitch Flex PCBs deliver exceptional miniaturization capabilities with ultra-narrow trace widths and spacing, enabling high-density interconnect solutions for space-constrained applications. These flexible printed circuits feature advanced manufacturing precision with trace/space geometries as fine as 25ฮผm (1 mil) and smaller via diameters for maximum routing density.
Key Features:
- Ultra-Fine Pitch Design: Trace widths and spacing down to 25ฮผm for maximum component density
- High Layer Count: Multi-layer constructions up to 8+ layers with microvias and blind/buried vias
- Superior Flexibility: Polyimide substrate maintains excellent bend performance even with dense circuitry
- Precise Registration: Advanced manufacturing ensures tight tolerances for fine-pitch connector compatibility
- Impedance Control: Controlled impedance lines for high-speed signal integrity
Technical Specifications:
- Minimum trace width/spacing: 25ฮผm (1 mil)
- Via diameter: As small as 50ฮผm (2 mil)
- Copper thickness: 9-35ฮผm (0.25-1 oz)
- Bend radius: 1-3x total thickness
- Operating temperature: -55ยฐC to +125ยฐC
- Dielectric materials: High-performance polyimide films
Applications: Perfect for smartphones, tablets, wearable devices, medical implants, aerospace electronics, and any application requiring maximum circuit density in minimal space. Ideal for camera modules, LCD/OLED displays, hard disk drives, and advanced sensor assemblies.
Quality Standards: Manufactured to IPC-6013 Class 3 standards with comprehensive electrical testing, impedance verification, and mechanical stress testing to ensure reliable performance in demanding applications.
Contact us for custom fine pitch flex PCB solutions tailored to your specific density and performance requirements.
