ENIG (Electroless Nickel Immersion Gold) is a premium surface finish that provides exceptional performance and reliability for printed circuit boards. This two-layer metallic coating system consists of a nickel barrier layer topped with a thin gold layer, delivering superior electrical and mechanical properties for demanding electronic applications.
Key Features:
- Dual-layer protection: 3-6 ฮผm electroless nickel base with 0.05-0.2 ฮผm immersion gold top layer
- Flat, coplanar surface: Enables precise component placement and reliable solder joints
- Lead-free compatible: Fully compliant with RoHS regulations and lead-free soldering processes
- Extended shelf life: Maintains solderability for 12+ months with proper storage
- Fine pitch capability: Supports components with pitches down to 0.4mm and below
Technical Advantages: The nickel layer acts as an effective barrier against copper migration while providing excellent mechanical strength and wear resistance. The gold layer prevents oxidation of the nickel surface and ensures consistent solderability over time. This combination creates an ideal surface for both wire bonding and soldering applications.
Applications:
- High-frequency RF/microwave circuits
- Fine-pitch BGA and CSP assemblies
- Semiconductor packaging substrates
- Medical and aerospace electronics
- Industrial control systems
- Consumer electronics requiring long-term reliability
Process Benefits: ENIG finishing utilizes a chemical deposition process that provides uniform coverage across complex PCB geometries, including through-holes and tight spaces. The process is environmentally friendly compared to electroplated alternatives and offers excellent thickness control and consistency.
Ideal for manufacturers seeking a robust, reliable surface finish that combines excellent solderability with long-term stability and performance.
