Product Overview
Our BGA (Ball Grid Array) Rework PCB service provides precision repair and component replacement for modern electronics featuring high-density ball grid array packages. Using advanced rework stations and specialized techniques, we restore functionality to damaged or failed BGA components on your printed circuit boards.
Key Features
Precision Component Removal & Installation
- Hot air and infrared reflow technology for controlled heating
- Accurate temperature profiling to prevent board damage
- Support for various BGA package sizes from micro-BGAs to large array formats
Advanced Reballing Services
- Complete solder ball replacement using factory-specification alloys
- Stencil-based reballing for consistent ball placement and sizing
- Lead-free and leaded solder options available
Board-Level Repairs
- Pad repair and reconstruction for damaged landing areas
- Via repair and trace restoration
- Underfill removal and reapplication
Quality Assurance
- X-ray inspection to verify proper solder joint formation
- Electrical testing to confirm component functionality
- Visual inspection under high-magnification optics
Applications
- Graphics cards and GPU repairs
- Motherboard component replacement
- Gaming console main board repairs
- Industrial control systems
- Telecommunications equipment
- Medical device circuit boards
- Automotive ECU repairs
Supported Components
- CPU and processor packages
- GPU and graphics processors
- Memory controllers and chipsets
- FPGA and microcontroller arrays
- Power management ICs
- Custom ASIC packages
Service Benefits
- Cost-effective alternative to complete board replacement
- Quick turnaround with most repairs completed within 24-48 hours
- Professional grade equipment ensuring reliable, long-lasting repairs
- Experienced technicians with specialized BGA training
- Warranty coverage on all rework services
Technical Specifications
- Temperature accuracy: ยฑ2ยฐC across heating zones
- Package support: 0.4mm to 1.5mm ball pitch
- Board thickness: Up to 3mm PCB compatibility
- Component size: Up to 45mm x 45mm BGA packages
- Solder types: SAC305, SnPb, and custom alloys
Transform your failed electronics back to working condition with our professional BGA rework services. Contact us for a quote and technical consultation on your specific repair requirements.
