BeO PCB Substrate – Beryllium Oxide High Thermal Conductivity Circuit Board
Product Overview Our Beryllium Oxide (BeO) PCB substrates deliver exceptional thermal management performance for high-power electronic applications. With thermal conductivity up to 250 W/mKโnearly 10 times higher than standard aluminaโthese substrates provide superior heat dissipation while maintaining excellent electrical insulation properties.
Key Features
- Ultra-High Thermal Conductivity: 150-250 W/mK thermal conductivity enables efficient heat transfer from components to heat sinks
- Excellent Electrical Insulation: High dielectric strength (>10 kV/mm) with low dielectric loss for reliable signal integrity
- Superior Mechanical Properties: High flexural strength and low thermal expansion coefficient ensure dimensional stability across temperature cycles
- Wide Operating Temperature Range: Stable performance from -55ยฐC to +400ยฐC for demanding environments
- Low Dielectric Constant: Minimal signal delay and crosstalk in high-frequency applications
Technical Specifications
- Thermal Conductivity: 150-250 W/mK
- Dielectric Constant: 6.7 @ 1 MHz
- Dielectric Strength: >10 kV/mm
- Flexural Strength: 250-400 MPa
- Coefficient of Thermal Expansion: 7-9 ppm/ยฐC
- Available Thicknesses: 0.25mm – 3.0mm
- Standard Sizes: Custom dimensions available
Applications
- High-power LED modules and lighting systems
- RF and microwave amplifiers
- Power semiconductor packaging
- Laser diode submounts
- High-frequency communication devices
- Automotive power electronics
- Military and aerospace electronics
Manufacturing Capabilities We offer precision machining, metallization patterns, and custom circuit layouts to meet your specific design requirements. Our BeO substrates can be processed with gold, silver, or copper metallization for optimal connectivity and reliability.
Safety Note BeO substrates require proper handling procedures due to beryllium content. We provide comprehensive safety documentation and handling guidelines with all shipments.
Contact our technical team for design consultation and custom substrate solutions tailored to your thermal management challenges.
