1. Board Specifications
- Layers: 8
- Material: FR-4 High Tg (170°C or higher)
- Thickness: 1.6mm ± 10%
- Copper Weight: 1 oz (35μm) for outer layers, 0.5 oz (17.5μm) for inner layers
- Minimum Trace Width/Spacing: 4/4 mil (0.1mm/0.1mm)
- Minimum Hole Size: 0.2mm
- Aspect Ratio: 10:1 maximum
2. Layer Stack-up
- Top Layer (Signal)
- Ground Plane
- Signal Layer
- Power Plane
- Power Plane
- Signal Layer
- Ground Plane
- Bottom Layer (Signal)
3. Surface Finish
- Type: ENIG (Electroless Nickel Immersion Gold)
- Nickel Thickness: 3-6 μm
- Gold Thickness: 0.05-0.1 μm
4. Solder Mask
- Type: Liquid Photoimageable Solder Mask
- Color: Green (or as specified)
- Sides: Both Top and Bottom
5. Silkscreen
- Type: Non-conductive Ink
- Color: White (or as specified)
- Sides: Both Top and Bottom
6. Electrical Requirements
- Impedance Control: ±10% on specified traces
- Dielectric Strength: >1000V/mil
- Insulation Resistance: >10^4 MΩ
7. Mechanical Requirements
- Flexural Strength: >60,000 psi
- Peel Strength: >8 lbs/in
8. Thermal Requirements
- Glass Transition Temperature (Tg): >170°C
- Decomposition Temperature (Td): >340°C
9. Testing and Quality Control
- 100% Electrical Test
- Impedance Testing
- X-ray Inspection for Inner Layer Alignment
- Microsection Analysis
- Solderability Testing
10. Environmental Considerations
- RoHS Compliant
- REACH Compliant
- Halogen-Free
11. Special Considerations for Robotics
- High-density component placement areas for microprocessors and sensors
- Separate power and ground planes for digital and analog circuits
- Provisions for heat dissipation (e.g., thermal vias, copper pours)
- EMI/EMC considerations (e.g., ground planes, controlled impedance routing)
- Flexibility for future revisions (e.g., unpopulated footprints for potential additions)