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8 Layer ENIG PCB for Robot Industry

Original price was: $129.00.Current price is: $127.00.

1. Board Specifications

  • Layers: 8
  • Material: FR-4 High Tg (170°C or higher)
  • Thickness: 1.6mm ± 10%
  • Copper Weight: 1 oz (35μm) for outer layers, 0.5 oz (17.5μm) for inner layers
  • Minimum Trace Width/Spacing: 4/4 mil (0.1mm/0.1mm)
  • Minimum Hole Size: 0.2mm
  • Aspect Ratio: 10:1 maximum

2. Layer Stack-up

  1. Top Layer (Signal)
  2. Ground Plane
  3. Signal Layer
  4. Power Plane
  5. Power Plane
  6. Signal Layer
  7. Ground Plane
  8. Bottom Layer (Signal)

3. Surface Finish

  • Type: ENIG (Electroless Nickel Immersion Gold)
  • Nickel Thickness: 3-6 μm
  • Gold Thickness: 0.05-0.1 μm

4. Solder Mask

  • Type: Liquid Photoimageable Solder Mask
  • Color: Green (or as specified)
  • Sides: Both Top and Bottom

5. Silkscreen

  • Type: Non-conductive Ink
  • Color: White (or as specified)
  • Sides: Both Top and Bottom

6. Electrical Requirements

  • Impedance Control: ±10% on specified traces
  • Dielectric Strength: >1000V/mil
  • Insulation Resistance: >10^4 MΩ

7. Mechanical Requirements

  • Flexural Strength: >60,000 psi
  • Peel Strength: >8 lbs/in

8. Thermal Requirements

  • Glass Transition Temperature (Tg): >170°C
  • Decomposition Temperature (Td): >340°C

9. Testing and Quality Control

  • 100% Electrical Test
  • Impedance Testing
  • X-ray Inspection for Inner Layer Alignment
  • Microsection Analysis
  • Solderability Testing

10. Environmental Considerations

  • RoHS Compliant
  • REACH Compliant
  • Halogen-Free

11. Special Considerations for Robotics

  • High-density component placement areas for microprocessors and sensors
  • Separate power and ground planes for digital and analog circuits
  • Provisions for heat dissipation (e.g., thermal vias, copper pours)
  • EMI/EMC considerations (e.g., ground planes, controlled impedance routing)
  • Flexibility for future revisions (e.g., unpopulated footprints for potential additions)