4 Layer 5G Communication High Frequency RO4350B+TU768 Hybrid PCB
Material: RO4350B+TU768
Layers: 4 layers PCB
PCB thickness: 1.6±0.1mm
Minimum aperture: laser aperture 0.1mm, mechanical aperture 0.2mm.
Minimum line width/spacing: 0.35mm
Copper thickness: 1OZ for each inner and outer layer
Solder Resistance: Green oil with white characters
Surface technology: immersion gold
Application: High-end 5G signal test
5G Communication High Frequency Mixed Platen is a type of PCB used for 5G communication, which usually adopts a multilayer structure and is characterized by high frequency, high precision and high reliability. This mixed-compression board is made of materials with different dielectric constants stacked on top of each other to realize the transmission of different signal paths and signal processing.
During the production process, a variety of factors need to be taken into account, including the selection of substrate materials, determination of the number of layers, layout of metal layers, placement and connection of components, and so on. At the same time, due to the requirements of high-frequency signal transmission, parameters such as the dielectric constant and loss factor of the hybrid platen need to be strictly controlled.
5G communication high-frequency mixing platen is mainly used in the field of 5G communication, and can be applied to the following scenarios:
Wireless communication base station: 5G high-frequency mixing plate can be used to manufacture antennas, filters, power amplifiers and other key components of wireless communication base stations.
Mobile devices: 5G communication high-frequency mixing and pressing boards can also be used to manufacture high-frequency circuits and antennas in mobile devices such as smartphones, tablet PCs and laptops.
Internet of Things (IoT) devices: IoT devices require a large number of wireless communication functions, 5G communication high-frequency hybrid boards can be used to manufacture wireless communication modules and sensor modules in IoT devices.
Automotive electronics: automotive electronic systems need to realize a variety of wireless communication functions, 5G communication high-frequency hybrid boards can be used to manufacture wireless communication modules and navigation modules in automotive electronic systems.
Industrial automation: Industrial automation equipment needs to realize various wireless communication protocols, 5G high-frequency hybrid boards can be used to manufacture wireless communication modules and sensor modules in industrial automation equipment.