Two-layer PCB nickel plating is a crucial process in the manufacturing of printed circuit boards, enhancing their durability, conductivity, and overall performance. This technique involves depositing a thin layer of nickel onto the copper traces and pads of a two-layer PCB. The nickel layer serves as a barrier between the copper and subsequent surface finishes, such as gold or tin, preventing copper diffusion and improving solderability.
The plating process typically begins with cleaning and preparing the PCB surface. Next, an electroless nickel plating method is employed, which doesn’t require an external power source. This results in a uniform nickel layer across the board, including within plated through-holes. The nickel coating provides excellent corrosion resistance, extends the shelf life of the PCB, and enhances its ability to withstand multiple soldering cycles.
Two-layer PCB nickel plating is particularly beneficial for applications requiring high reliability, such as automotive electronics, aerospace systems, and industrial equipment. It also improves the board’s resistance to wear and tear, making it ideal for devices subject to frequent handling or harsh environments.
