Isola TerraGreen 400G delivers Dk 3.15 and Df 0.0017 in a halogen-free laminate for 5G, AI, and 400G+ data center PCBs. Complete guide covering full specs, HVLP3 copper, spread weave glass, processing parameters, family comparison (400G vs 400G2 vs 400GE), and cross-brand analysis.

Primary keyword: Isola TerraGreen 400G | ~3,000 words

When Isola Group launched the TerraGreen 400G series at DesignCon 2023, the pitch was specific and technically credible: a halogen-free laminate that outperforms the company’s own Tachyon® 100G on insertion loss at 28 GHz, processes on standard FR-4 equipment, and satisfies the tightening environmental compliance requirements that OEMs in Europe, Asia, and North America are increasingly pushing down to their PCB material specifications. For a generation of 5G infrastructure programs and AI compute hardware where halogen-free and ultra-low-loss were previously in tension, that combination mattered.

Isola TerraGreen 400G is the mid-performance member of the three-grade halogen-free 400G family, sitting between the cost-optimized 400GE and the premium 400G2. It delivers typical Dk of 3.15 and Df of 0.0017 at 5, 10, and 20 GHz — numbers that comfortably outperform the earlier generation TerraGreen standard laminate (Dk 3.45, Df 0.0031) and challenge materials that aren’t halogen-free at all. This guide covers the full electrical and mechanical specification, construction details, processing parameters, comparative positioning within the Isola lineup, and where the 400G earns its place in a real design.

What Exactly Is Isola TerraGreen 400G?

TerraGreen® 400G is Isola’s halogen-free material solution for next-generation 5G infrastructure, data center systems, high-end computing, wired and wireless communications, and AI applications. The “400G” designation references the 400 Gigabit per second data rate era that defines its target application space. The material is engineered for very high data rates of greater than 100 Gb/s with excellent cost-for-loss performance.

Three technology components define TerraGreen 400G’s signal performance: a novel halogen-free resin system developed specifically for the 400G family, ultra-smooth HVLP3 (VLP1) copper foil with surface roughness ≤1.1 µm Rz JIS, and first-generation low-Dk glass fabric in spread weave configuration. Removing any one of those three components would degrade the finished board’s channel performance — the design of the composite is specifically optimized to minimize loss from all three dominant contributors simultaneously.

The IPC classification is IPC-4101/134, and it carries UL File Number E41625 with full RoHS compliance. It meets UL94 V-0 flammability requirements.

The Halogen-Free Requirement: Why It Increasingly Matters

The push toward halogen-free PCB materials has been building for more than a decade, but it has accelerated significantly with the expansion of 5G infrastructure programs and next-generation data center builds. Historically, achieving low dielectric loss in an organic laminate required halogenated flame retardants — removing halogens often meant either a higher-polarity resin system that raised Dk and Df, or a thermal performance penalty.

Isola’s 400G resin system addresses that tradeoff directly. The TerraGreen 400G resin system has proven superior CAF performance on tight pitch testing, and CAF performance is enhanced by the resin system’s excellent interlaminar and bond line adhesion strength. The novel halogen-free resin architecture achieves both the environmental compliance and the electrical performance without the typical tradeoff between them. For OEMs targeting the European and Asian markets where IEC 61249-2-21 halogen-free compliance is a vendor qualification requirement, this makes 400G a drop-in candidate for programs that previously required using non-compliant high-performance materials.

Isola TerraGreen 400G Key Specifications

The specifications below are drawn from the official Isola datasheet (data developed using 55% RC rigid laminate). All dielectric measurements at the referenced frequencies were verified through testing after the July 2023 datasheet revision that corrected Dk and Df values to match actual test data.

Electrical and Thermal Properties

Property	Typical Value	Test Method / Notes
Dielectric Constant (Dk) @ 5 GHz	3.15	Spread weave glass
Dielectric Constant (Dk) @ 10 GHz	3.15	IPC-TM-650 / VNA extraction
Dielectric Constant (Dk) @ 20 GHz	3.15	Stable with frequency
Dk @ 30 GHz	Extracted	VNA coupled differential line measurement
Dissipation Factor (Df) @ 5 GHz	0.0017
Dissipation Factor (Df) @ 10 GHz	0.0017
Dissipation Factor (Df) @ 20 GHz	0.0017
Glass Transition Temperature (Tg)	200°C	DSC
Decomposition Temperature (Td)	>380°C	TGA, 5% weight loss
Z-Axis CTE (50–260°C, total)	1.8%	TMA
Moisture Absorption	<0.1%	IPC-TM-650
Peel Strength (after thermal stress)	0.7 N/mm (4.1 N/mm)	IPC-TM-650
IPC Specification	IPC-4101/134
UL Flammability	V-0	UL 94
UL File Number	E41625

The Dk stability across frequency is a critical design parameter that datasheet numbers alone don’t fully convey. The three new TerraGreen circuit materials deliver outstanding stability with temperature and frequency, maintaining constant permittivity (Dk) and loss tangent (Df) at temperatures from -55 to +125°C. For outdoor 5G base station equipment that operates through extreme seasonal temperature swings, that thermal stability of Dk directly maps to consistent controlled impedance and predictable insertion loss across the full operating range — something that breaks channel link budgets when it isn’t present.

Product Availability and Construction Details

Parameter	Standard Offering
Laminate thickness	2 to 10 mil (0.05 to 0.25 mm)
Copper foil type	HVLP3 (VLP1), ≤1.1 µm Rz JIS
Copper weight	⅓ oz, ½ oz, 1 oz (12, 18, 35 µm)
Prepreg	Available (tooling of panels)
Glass fabric	Low-Dk, spread weave (both directions)
Constructions	Standard and alternate; all spread weave

One practical note on glass fabric: all TerraGreen 400G glass is spread weave in both directions. The spread weave construction is a deliberate signal integrity decision — it reduces fiber weave effect by distributing the glass fiber uniformly, which minimizes the localized Dk variation that causes timing skew between differential pairs. At SerDes data rates above 28 Gbaud, fiber weave effect is a real contribution to channel bit error rate if you’re unlucky with routing angle. Spread weave doesn’t eliminate the physics, but it significantly reduces its impact.

Performance Features and Processing Attributes at a Glance

Category	Attribute
Performance	CAF resistant
	Halogen free
	0.8 mm pitch capable
	Low moisture absorption
	6x 260°C reflow capable
	6x 288°C solder float capable
Processing	FR-4 process compatible
	Excellent fill and flow
	Multiple lamination cycles
	HDI technology compatible
	Sequential lamination capable
	Lead-free compatible
Compliance	UL 94 V-0 (File E41625)
	IPC-4101/134
	RoHS compliant

Understanding the Three-Part Signal Performance Equation

The way Isola engineered TerraGreen 400G around three coordinated technology choices is worth examining in detail, because it explains both the material’s performance and how to get that performance out of it in a finished board.

Novel Halogen-Free Resin System

The resin system is the thermal and chemical backbone of any laminate, and it’s where the halogen-free performance tradeoff lives. Conventional halogen-free approaches that simply substitute phosphorus-based flame retardants for bromine tend to increase resin polarity, which raises Df. Isola’s 400G resin system was engineered to avoid that degradation while maintaining the strong interlaminar adhesion that CAF resistance depends on.

The result is a material with CAF resistance verified at 0.8 mm pitch — relevant for the high via density that characterizes modern switch fabric and AI accelerator board designs. Tight via pitch with poor CAF resistance is an assembly defect that typically reveals itself months into field deployment under voltage bias and humidity load, not during incoming inspection. Qualifying a material with proven CAF resistance at the via pitch your design actually uses is non-negotiable for any product targeting 5+ year field service life.

HVLP3 Ultra-Smooth Copper Foil

At frequencies above 10 GHz, conductor loss from copper roughness begins competing with dielectric loss as the dominant loss mechanism. The skin depth in copper at 10 GHz is approximately 0.66 µm — meaning current is flowing almost entirely within the first micron of the surface at that frequency. Standard VLP copper runs surface roughness around 2 µm Rz JIS. At those frequencies, current must trace a longer path along the rough surface topology, increasing the effective resistance of the trace above what a flat-surface calculation would predict.

HVLP3 at ≤1.1 µm Rz JIS roughly halves that surface roughness compared to standard VLP. The practical impact on insertion loss at 20–30 GHz is measurable and design-significant. Specifying a halogen-free Df 0.0017 dielectric and pairing it with standard-roughness copper foil would leave a fraction of the material’s potential unrealized in the finished board. The HVLP3 specification in 400G is integral to achieving the datasheet performance on real channels, not just on test coupons.

Low-Dk Spread Weave Glass Reinforcement

The glass fabric in TerraGreen 400G is mechanically spread, low-Dk glass — one generation behind the 2nd-generation Ultra Low Dk (L2) glass used in the premium 400G2 grade. That choice defines the positioning: 400G uses a more broadly available glass supply chain, which supports better pricing and higher fabricator availability than 400G2, while still delivering meaningfully better Dk and Df than the standard e-glass grades used in 400GE and conventional laminates.

The spread weave construction matters independent of the glass Dk value. Even with standard e-glass, mechanically spreading the weave reduces the peak-to-trough Dk variation caused by alternating glass bundle and resin-rich zones. For mixed-signal boards where some layers carry differential data at 50+ Gbps and other layers carry lower-speed signals or power, the spread weave glass on the high-speed layers provides better skew control without requiring exotic routing compensations.

Isola TerraGreen 400G Processing Guidelines

TerraGreen 400G is designed to process on standard PCB fabrication equipment without specialized tooling. That compatibility is a genuine advantage when qualifying a new material — existing press cycles, desmear lines, and imaging equipment need calibration rather than replacement. Several process details deserve specific attention.

Lamination

TerraGreen laminates are fully cured and ready for processing. It has been the experience of most fabricators that stress relief bake cycles are not effective in reducing any movement of high-performance laminates such as TerraGreen. The recommended approach is to characterize the movement of unbaked laminate and apply appropriate artwork compensation factors. Most of the movement will be in the grain direction of the laminate.

Use the full press cycle for both subassembly and final lamination for assemblies ≥3.2 mm (0.125 inch). Sequential lamination is fully supported — this is critical for HDI designs that require multiple lamination cycles to build up the required layer count.

Drilling

TerraGreen 400G drilling parameters require lower chiploads and cutting speeds than standard FR-4 processing. Undercut drill geometries and high-helix tools are recommended to assure effective removal of resin debris during drilling. For high-layer-count and thicker overall board thicknesses, peck drilling parameters may be necessary. Using e-glass or standard FR-4 drill parameters as a direct starting point will typically result in rough hole wall quality and debris buildup — TerraGreen 400G’s optimized resin system behaves differently from standard epoxy during the cutting action.

Removal of Flash

Removal of TerraGreen flash should be performed by routing rather than shearing to minimize crazing along the panel edges. Crazing creates stress concentration points that can propagate during thermal cycling. This is a process detail that many shops miss on first run when transitioning from standard FR-4 handling.

Chemical Desmear

Chemical desmear using parameters established for standard FR-4 is recommended as the baseline. Permanganate desmear is compatible. For high-reliability or high-aspect-ratio designs, two desmear passes are generally recommended. Plasma desmear is also compatible and can be used as an alternative or supplement to permanganate.

Prepreg Handling

Handle all prepreg using clean gloves. TerraGreen prepreg will absorb moisture if not handled properly, which will depress Tg, affect cure, and alter flow during lamination. Upon receipt, all prepreg should be moved immediately from the receiving area to a controlled environment. A first-in-first-out inventory management system should be used, and all prepreg should be used as soon as possible after opening the packaging.

Board Packaging and Storage

For printed boards requiring a long shelf life before high-temperature lead-free assembly, Isola recommends packaging using a Moisture Barrier Bag with a Humidity Indicator Card and adequate drying desiccant inside the MBB to prevent moisture absorption during shipment and long-term storage. Upon opening the MBB, boards should be processed within 168 hours at shop floor conditions of ≤30°C/60% RH.

TerraGreen 400G vs. the Isola Halogen-Free Family

The TerraGreen 400G family is internally tiered. Knowing where each grade fits helps you select the right one without over-specifying.

Isola TerraGreen 400G Family Comparison

Grade	Dk (5/10/20 GHz)	Df (5/10/20 GHz)	Glass Type	Copper Foil	Relative Cost
TerraGreen 400G2	3.10	0.0015	2nd gen Ultra-Low Dk (L2)	HVLP3 ≤1.1 µm	Highest
TerraGreen 400G	3.15	0.0017	1st gen Low-Dk	HVLP3 ≤1.1 µm	Mid
TerraGreen 400GE	3.29	0.0026	E-glass	RTF3 <2.5 µm	Lowest

The Df delta between 400G and 400G2 (0.0017 vs 0.0015) is driven entirely by the glass upgrade. The resin system and copper foil are identical. Whether that delta is worth the material cost and supply chain complexity of L2 glass depends entirely on your channel loss budget. For designs where Df 0.0017 provides adequate margin, 400G delivers nearly all of 400G2’s performance with better fabricator availability and lower cost. For designs that genuinely need every unit of Df reduction to hit link budget, 400G2 is the answer.

The 400GE uses standard e-glass and slightly rougher RTF3 copper foil. The resulting Dk/Df degradation versus 400G is significant enough that it belongs in a different application segment — cost-sensitive designs where halogen-free compliance is required but the absolute loss performance of 400G is not justified by the channel data rate.

Isola TerraGreen 400G Also Offers an RF/MW Variant

Beyond the standard high-speed digital version, Isola offers a TerraGreen 400G (RF/MW) variant specifically characterized for RF and microwave applications. TerraGreen 400G (RF/MW) is Isola’s halogen-free material solution for next-generation 5G infrastructure and mmWave applications, with Dk approximately 3.07 and Df approximately 0.0018 in the z-axis at high frequencies. For halogen-free designs requiring RF performance above 5 GHz — sub-6 GHz 5G NR radio units, mmWave feed networks, or mixed-signal boards with both digital and RF layers — this variant provides a characterized starting point.

How Isola TerraGreen 400G Stacks Up Against the Broader Market

Cross-Brand Comparison: High-Speed Digital and Low-Loss Laminates

Material	Manufacturer	Dk (10 GHz, typ)	Df (10 GHz, typ)	Halogen-Free	Tg
TerraGreen 400G	Isola	3.15	0.0017	Yes	200°C
TerraGreen 400G2	Isola	3.10	0.0015	Yes	200°C
TerraGreen 400GE	Isola	3.29	0.0026	Yes	200°C
TerraGreen (standard)	Isola	3.45	0.0031	Yes	~200°C
Tachyon® 100G	Isola	3.02	0.0021	No	215°C
I-Tera® MT40	Isola	3.45	0.0031–0.0034	No	200°C
Astra® MT77	Isola	3.00	0.0017	No	200°C
Megtron 7	Panasonic	3.37	0.0020	No	185°C
Ventec VT-901HF	Ventec	~3.35	~0.0025	No	200°C

The comparison with Tachyon 100G requires specific commentary. The new TerraGreen circuit materials are capable of even less loss than Tachyon 100G at 28 GHz — a benchmark that mattered commercially because Tachyon 100G had been the reference design material for high-speed digital since its introduction. TerraGreen 400G at Df 0.0017 does beat Tachyon 100G at Df 0.0021 on the loss tangent dimension. However, Tachyon 100G offers a slightly lower Dk (3.02 vs 3.15) and a higher Tg (215°C vs 200°C). For programs where Tg margin and Dk control are more important than absolute loss, Tachyon 100G remains competitive — but it is not halogen-free.

TerraGreen 400G laminates and prepregs exhibit lower Dk of 3.05 in the z-axis at 10 GHz and lower Df of 0.0018 at 10 GHz for outstanding performance in ultra-high-speed digital circuits requiring halogen-free circuit materials. The z-axis Dk figure quoted in RF/microwave context versus the in-plane Dk figure can differ slightly; use the test method and direction specification from the datasheet when running controlled impedance simulations.

Astra MT77 at Dk 3.00 and Df 0.0017 sits in a comparable Df range to TerraGreen 400G, but Astra MT77 is not halogen-free and is positioned primarily for RF/microwave rather than high-speed digital. The thermal compatibility between Astra MT77 and Tachyon 100G makes them good hybrid build partners — Isola specifically designed them with similar CTE values. TerraGreen 400G occupies the space where that combination’s halogen-free equivalent is needed.

Target Applications for Isola TerraGreen 400G

The application positioning of TerraGreen 400G flows directly from its two defining characteristics: Df 0.0017 at multi-gigahertz frequencies, and halogen-free composition.

5G Radio Access Network (RAN) Hardware: Distributed Unit (DU) and Radio Unit (RU) boards for O-RAN compatible systems, Massive MIMO radio heads, 5G NR sub-6 GHz and mid-band base station radio PCBs. The Dk stability from -55 to +125°C aligns directly with outdoor RAN equipment operating ranges. The halogen-free compliance supports CE marking and increasingly common carrier environmental procurement requirements.

Data Center Switch Fabric: 400GbE and 800GbE switch line cards and backplanes where channel loss must be controlled across the full board assembly temperature range. For programs where halogen-free is specified at the system level, TerraGreen 400G replaces Tachyon 100G with a better Df number while satisfying the environmental requirement.

AI and HPC Interconnect: AI training cluster leaf-spine switches, GPU interconnect boards, and high-bandwidth memory (HBM) interface substrates. SerDes channel data rates on these boards are pushing 112 Gbps PAM4 and beyond — Df 0.0017 at 28 GHz provides meaningful link budget headroom that Df 0.003 FR-4-class materials cannot.

Telecom Transport Equipment: Coherent DWDM and OTN transport line cards, aggregation router backplanes, and DSP-based transponder PCBs where halogen-free compliance increasingly appears in tier-1 telecom OEM material specifications.

Wired Communications and High-End Computing: 100G/400G Ethernet NICs and host interface cards, high-performance workstation and server PCBs, and PCIe 6.0 channel designs where dielectric loss at multi-gigahertz frequencies limits channel reach.

For fabrication and material sourcing support on programs using ISOLA PCB laminates including TerraGreen 400G, working with a fabricator experienced in ultra-low-loss laminate processing ensures the material’s electrical performance is fully realized in the finished board.

Design Considerations When Specifying Isola TerraGreen 400G

A few practical notes that save engineering cycles when first bringing 400G into a design:

Impedance modeling: Use the actual Dk value from the datasheet at your operating frequency rather than a nominal FR-4 value. The 3.15 Dk means trace widths for a given impedance target will be slightly narrower than equivalent FR-4 constructions. Run controlled impedance calculations with the 400G-specific value from the start to avoid re-spinning stack-up geometry late in the design cycle.

Hybrid builds: TerraGreen 400G is thermally compatible with other Isola high-performance materials, enabling hybrid builds where 400G handles the high-speed digital layers and a dedicated RF material (Astra MT77, for example) handles the RF layers. Verify CTE matching between materials in your specific stack-up configuration before committing to production panel design.

Dk at 30 GHz and above: The 30 GHz Dk for TerraGreen 400G is extracted based on VNA measurements of coupled differential lines rather than direct capacitance measurements. For designs with signal energy extending above 20 GHz, request the Dk/Df tables PDF from Isola to get the characterization data at your specific frequency of interest.

Panel orientation and artwork compensation: Net dimensional movement after etch, oxide, and lamination is typically shrinkage, primarily in the grain direction of the laminate. Characterize the specific movement for your panel configuration at your fabricator before finalizing artwork compensation factors. The stress relief bake that works for FR-4 is not effective for TerraGreen, so measurement-based compensation is the correct approach.

Useful Resources and Data Downloads

Resource	Type	Link
TerraGreen 400G Official Product Page	Isola product page	isola-group.com/terragreen-400g
TerraGreen 400G Datasheet PDF	Official datasheet	isola-group.com (PDF)
TerraGreen General Processing Guide	Fabrication guide PDF	isola-group.com (Processing PDF)
TerraGreen 400G RF/MW Variant	Product page	isola-group.com/terragreen-400g-rfmw
TerraGreen 400G2 Product Page	Premium variant	isola-group.com/terragreen-400g2
TerraGreen 400GE Product Page	Entry variant	isola-group.com/terragreen-400ge
Tachyon 100G Product Page	Comparison material	isola-group.com/tachyon-100g
IsoDesign Impedance Tools	Online design tool	isola-group.com/design-tools
IPC-4101/134 Specification	IPC Standard	ipc.org
UL Product iQ (File E41625)	UL Certification DB	iq.ul.com
Isola IMS2023 Technical Article	Technical article	mwrf.com/isola-ims2023
Signal Integrity Journal — Isola DesignCon 2023	Technical article	signalintegrityjournal.com

Frequently Asked Questions About Isola TerraGreen 400G

1. What is the practical difference between TerraGreen 400G and standard TerraGreen laminate?

Standard TerraGreen is a general-purpose halogen-free laminate with Dk approximately 3.45 and Df approximately 0.0031 at 10 GHz. TerraGreen 400G is an advanced formulation using first-generation low-Dk glass, HVLP3 copper foil, and a novel resin system designed for the 400G data rate generation. The result is Dk 3.15 and Df 0.0017 — a roughly 45% reduction in loss tangent at 10 GHz compared to standard TerraGreen. That difference is design-significant for channels operating above 10 Gb/s per lane and substantial for anything at 50+ Gbps. Standard TerraGreen remains appropriate for lower-speed halogen-free designs where meeting the environmental requirement is the primary driver and loss performance is not the binding constraint.

2. Can TerraGreen 400G be used in sequential lamination HDI designs?

Yes. TerraGreen 400G is specifically rated as sequential lamination capable and HDI technology compatible. The novel resin system supports multiple lamination cycles without degradation of electrical or adhesion properties. Fabricators experienced with high-layer-count sequential lamination on materials like FR408HR or Tachyon 100G will find the 400G process transition straightforward, with the main attention areas being artwork compensation (using dimensional characterization rather than bake cycles), drilling parameter adjustment (lower chipload and cutting speeds than standard FR-4), and flash removal by routing rather than shearing.

3. Is TerraGreen 400G suitable for designs with lead-free assembly, including HASL-free finishes?

Yes — TerraGreen 400G is lead-free compatible, 6x 260°C reflow capable, and 6x 288°C solder float capable. The 200°C Tg provides margin above the 260°C peak reflow temperatures used in standard lead-free SAC305 assembly profiles. For boards that will see multiple assembly passes or rework cycles, the 6-pass rating at 288°C gives meaningful process margin. Surface finishes including ENIG, ENEPIG, and OSP are all compatible. For boards requiring long shelf life before high-temperature assembly, use Moisture Barrier Bag packaging with a Humidity Indicator Card.

4. How does the Dk stability of TerraGreen 400G perform across the -55 to +125°C operating range?

The three TerraGreen 400G family materials deliver outstanding stability with temperature and frequency, maintaining constant permittivity (Dk) and loss tangent (Df) at temperatures from -55 to +125°C. This thermal stability of the dielectric constant is important for any product deployed in outdoor environments — 5G base station radio units, outdoor industrial equipment, automotive telematics — where ambient temperature variation is a design load case. Materials with Dk that drifts significantly with temperature cause controlled impedance to drift, which affects channel insertion loss and return loss in a frequency-dependent way. The 400G resin system’s stable Dk across this thermal range is a direct reliability advantage for outdoor and automotive applications.

5. What are the halogen-free compliance standards that TerraGreen 400G meets, and how is compliance verified?

TerraGreen 400G is halogen-free per IEC 61249-2-21, the international standard for halogen-free materials used in PCB fabrication. This standard limits chlorine to <900 ppm, bromine to <900 ppm, and total halogens (Cl + Br) to <1500 ppm by weight. The material is also RoHS compliant, restricting the six substances regulated under EU Directive 2011/65/EU (and its 2015/863/EU amendment). Compliance documentation is available from Isola and authorized distributors in the form of a Material Safety Data Sheet, Certificate of Conformance, RoHS declaration, and halogen-free declaration. Request the current declarations for your specific lot when preparing environmental compliance documentation for EU or Asian market submissions.

Engineering Summary: When TerraGreen 400G Is the Right Specification

Isola TerraGreen 400G occupies a specific and defensible position in the PCB materials landscape: it is the halogen-free option for high-speed digital designs operating above 25 Gb/s per lane, where Df 0.0017 at 10 GHz is sufficient for the channel loss budget and the broader glass fabric availability of first-generation low-Dk glass is a supply chain advantage over the premium 400G2.

The spec decision framework is straightforward. Start with the environmental requirement: if halogen-free is not required, Tachyon 100G delivers better absolute Df (0.0021 with higher Tg). If halogen-free is required and your channel loss budget tolerates Df 0.0017, TerraGreen 400G is the right choice with better fabricator availability than 400G2. If your loss budget demands Df 0.0015, move to 400G2 and accept the L2 glass availability constraint. If cost optimization within the halogen-free family is the priority, 400GE with e-glass covers designs where Df 0.0026 is sufficient.

What TerraGreen 400G adds to every design it enters is the ability to say both things simultaneously: the board meets the environmental compliance requirement, and the signal channel is engineered to the loss performance that next-generation data rates demand.

For sourcing, fabrication consultation, and stack-up engineering with Isola laminates including TerraGreen 400G, visit RayPCB’s ISOLA PCB resource page.