Complete 2026 guide to Doosan PCB materials: part numbers, specs, suffix codes, and selection advice for DS-7402, DS-7409D, DS-8502, FCCL, and thermal CCL series.

Every time I’ve had to spec a PCB laminate for a demanding application — automotive radar, server backplane, 5G base station, fine-pitch smartphone HDI — the shortlist of suppliers that can consistently deliver at volume keeps coming back to a handful of names. Doosan Electronics is almost always on it. They’ve been making copper clad laminates since 1974, and in the past decade the company’s material portfolio has broadened dramatically to cover everything from standard FR-4 through ultra-low-loss high-speed grades, IC package substrates, flexible CCL, and LED thermal management materials.

The challenge is navigating their catalog. The part numbering system isn’t always obvious, the suffix codes communicate important information that’s easy to miss, and the right material choice can look very different depending on whether your constraint is cost, Tg, Df, CTE, or halogen content. This guide covers the full Doosan PCB materials lineup as it stands in 2026: what each series does, what the part numbers mean, and how to select the right grade for your application.

Who Is Doosan Corporation Electro-Materials?

Established in 1974, Doosan Corporation Electro-Materials is a business group of Doosan Corporation, committed to constant innovation in electronic materials. The division — also referred to as Doosan Electro-Materials or DEM — focuses exclusively on CCL (Copper Clad Laminate), FCCL (Flexible CCL), prepreg, copper foil, and advanced substrate materials for PCBs.

Their facilities in South Korea, China, and Europe produce over 15 million square meters of laminate annually. Their vertical integration from resin synthesis to final laminate production gives them tighter control over material properties than many competitors who rely on third-party resin suppliers. For engineers, this translates to more predictable electrical performance and fewer surprises during impedance testing.

At IPC APEX EXPO 2024, Doosan unveiled various advanced CCL products including CCL for memory and system semiconductor packaging, CCL for communications networks, and flexible CCL for smart devices. The company’s product applications now span consumer devices, 5G/6G infrastructure, automotive ADAS, data center hardware, and industrial electronics.

Understanding the full Doosan PCB materials portfolio requires breaking the product line into its functional segments: standard and mid-range FR-4, high-speed and low-loss grades, IC substrate materials, flexible CCL, thermally enhanced products, and the specialty automotive/high-reliability grades. Each segment has its own part number logic.

Understanding Doosan’s CCL Part Number System

Before diving into individual products, it helps to understand how Doosan structures its part numbers. This isn’t documented cleanly in one place — you have to infer it from the product catalog patterns — but once you see the logic, the codes start making sense.

The base part number format is DS-XXXX, where the digits carry rough category meaning. The suffix letters that follow communicate important differentiation: resin system, halogen content, special characteristics, or processing variants. Here’s a summary of the most common suffix codes:

Suffix	Meaning
(no suffix)	Standard resin system, base version
V	Very low loss / low Df variant
N	Ultra-low-loss / halogen-free
JN+	Super low loss, next-generation resin
LC	Low CTE variant
SQ	SQ series (HDI/sequential lamination optimized)
BS	Build-up sheet / prepreg sheet format
DF	Dust-free property for PCB process
DFM	Dust-free + modified resin
DFL	Dust-free, low-loss
H	High Tg variant
HF	High-frequency optimized
(X)	Cross-linked / halogen-free variant
(C)	Customer-specific variant
(T)	Thin dielectric version
(NT)	Non-halogen + Thin

With these codes in hand, a part number like DS-7409DV(N) reads as: DS-series, 7409 product family, D-grade high Tg, V = low loss, N = non-halogen. That tells you quite a lot before you’ve even opened the datasheet.

Standard and Mid-Range FR-4: The DS-7402 Series

DS-7402 — The Workhorse General-Purpose Laminate

The DS-7402 is Doosan’s core general-purpose FR-4. If you’re building industrial controls, consumer electronics, telecom infrastructure at moderate frequencies, or anything where standard FR-4 is the specified material and you want a reliable, well-characterized supplier, DS-7402 is the entry point for the Doosan portfolio.

PCB materials serve as the foundation of PCBs, and when fabricating a PCB it is important to select materials that suit the requirements of the intended application. DS-7402 covers the mainstream middle-Tg segment — a glass transition temperature around 150–170°C depending on specific product variant, which places it comfortably above lead-free assembly peak reflow temperatures with reasonable margin.

Parameter	DS-7402 Typical Value
Tg (DMA)	~150°C
Td	~300°C
CTE Z-axis (below Tg)	~60 ppm/°C
Dk @ 1 GHz	~4.6
Df @ 1 GHz	~0.020
Thermal Conductivity	~0.3 W/m·K
Flammability	UL 94 V-0

DS-7402LC — Low CTE Version for Multilayer Stack-Ups

The DS-7402LC adds controlled low CTE performance to the base DS-7402 material, specifically targeting designs with high via counts or fine-pitch BGAs where Z-axis expansion during thermal cycling would otherwise risk via barrel cracking. This is the variant you’d reach for when the design involves dense multilayer constructions with buried or blind vias and the operating environment involves meaningful temperature swing.

DS-7402BS (DF) and DS-7402BS (DFM) — Build-Up Sheet Variants

The DS-7402BS (DF) targets smart device applications — mobile and consumer electronics — with excellent thermal resistance, excellent dust-free property under PCB process, and halogen/antimony/red phosphorus-free composition. The BS designation indicates a prepreg sheet format optimized for build-up layer applications, while the DF suffix specifically certifies dust-free processing characteristics — important for the clean room environments used in smartphone HDI manufacturing.

The DFM variant includes a modified resin system that provides additional processing improvements for fine-pitch, high-density build-up applications.

DS-7402 Series Quick Reference

Part Number	Key Features	Target Application
DS-7402	Standard FR-4, mid-Tg	Consumer electronics, industrial
DS-7402LC	Low CTE version	Multilayer HDI, BGA-dense boards
DS-7402BS (DF)	Build-up, halogen-free, dust-free	Smartphone HDI, consumer devices
DS-7402BS (DFM)	Modified resin, build-up	Fine-pitch HDI build-up layers

High-Speed and Low-Loss CCL: The DS-7409D Series

This is the product family that has made Doosan’s name in high-speed PCB applications. The DS-7409D series spans a wide performance range — from mid-loss grades for network switches and server boards through ultra-low-loss variants for 5G base stations and high-frequency computing infrastructure.

DS-7409D includes Middle loss FR4 High Speed PCB Material DS-7409D(X), Low loss FR4 High Speed PCB Material DS-7409DV, Ultra low loss FR4 High Speed PCB Material DS-7409DV(N), and Super low loss FR4 High Speed PCB Material DS-7409DJN+.

DS-7409D(X) — Middle Loss High Speed

The base DS-7409D(X) is the entry point for the high-speed series. The (X) denotes halogen-free formulation. This grade delivers meaningfully lower Df than standard FR-4 at high frequencies — useful for network equipment, storage controllers, and computing boards running signals in the 1–10 Gbps range where standard FR-4 losses are problematic but the cost premium of premium low-loss materials isn’t justified.

Parameter	DS-7409D(X)
Tg (DMA)	~180°C
Td	~340°C
Dk @ 10 GHz	~3.7–3.9
Df @ 10 GHz	~0.010–0.013
CTE Z-axis	~3.0–3.5%
Water Absorption	~0.15%
Applications	10G/25G networking, storage, servers

DS-7409DV — Low Loss

The DS-7409DV is where the DS-7409D family gets genuinely competitive with mid-market materials from Isola and Panasonic. The Doosan DS-7409DV has a glass transition temperature (DMA) of 225 degrees Celsius and a decomposition temperature of 400 degrees Celsius. Its T-288 value is greater than 120 minutes. At the X, Y axis, it has a CTE of 16/16 ppm/°C. At the Z axis, the CTE is 45/270 ppm/°C. Its thermal conductivity is 0.4 W/m·K and Z expansion is 2.6%.

The DS-7409DV has a dielectric constant of 3.65, 3.51, 3.49, and 3.48 at 1 GHz, 2 GHz, 5 GHz, and 10 GHz respectively. That flat Dk-versus-frequency response is one of the key indicators of a genuinely good low-loss material — it means your impedance models hold up across the frequency range of your signals rather than drifting as you move into the GHz regime.

The DS-7409DV is halogen-free, free of halogen components, and a great choice for PCB manufacturing that is safe for the environment. This PCB material adheres to UL94 V-0 flammability specifications.

DS-7409DV(N) — Ultra Low Loss

The (N) suffix adds ultra-low-loss resin formulation on top of the base DV performance. This is the grade reaching for PCIe Gen 5, 100G/400G networking, and dense server backplanes where multi-meter differential pair routing requires insertion loss budgets that mid-loss materials can’t support. Dk sits around 3.4–3.5 and Df drops to the 0.005–0.007 range at 10 GHz depending on exact test conditions.

The DS-7409DV(NT) variant adds thin-core processing capability alongside the ultra-low-loss resin, for designs that need thinner dielectric layers in the HDI build-up construction.

DS-7409DV(T) and DS-7409DV(C) — Process-Specific Variants

The (T) denotes a thinner cured prepreg form factor for applications where reduced dielectric thickness is needed in the build-up stack. The (C) variant addresses specific customer requirements — typically a modified press profile, resin content adjustment, or surface texture specification requested by a major OEM or tier-1 board fabricator.

DS-7409DJN+ — Super Low Loss

DS-7409DJN+ is the Super low loss FR4 High Speed PCB Material in the DS-7409D series. This is Doosan’s flagship in the low-loss FR-4 space — targeting 5G mmWave antenna arrays, AI server fabrics, and high-frequency instrumentation where you’re working with signals in the 10–25+ GHz range and insertion loss in a 1-meter trace can be the difference between a working system and a marginal one. Dk at 10 GHz approaches 3.3 and Df drops below 0.004.

DS-7409D Series Comparison

Part Number	Loss Level	Dk @ 10 GHz	Df @ 10 GHz	Primary Application
DS-7409D(X)	Middle	~3.8–4.0	~0.010–0.013	10G/25G network switches
DS-7409DV	Low	~3.48–3.50	~0.007–0.009	100G networking, DDR5 servers
DS-7409DV(N)	Ultra-low	~3.4–3.5	~0.005–0.007	400G infrastructure, PCIe Gen5
DS-7409DJN+	Super low	~3.3–3.4	~0.003–0.005	5G mmWave, AI accelerators

DS-7409D features include: Low Dk & Df for high signal speed and signal integrity; High Tg and Low CTE; Excellent through hole reliability and thermal performance; and suitability for lead-free soldering processes. Applications include base stations, high speed computing, network equipment, high frequency modules, and measuring instruments.

High-Tg and Low-CTE Materials: The DS-8502 Series

While the DS-7409D series is about loss, the DS-8502 series is about thermal reliability and dimensional stability — specifically for applications where warpage control, thermal cycling survival, and extreme temperature resistance are primary requirements.

DS-8502LC — Ultra High Tg, Low CTE, Low Loss

The DS-8502LC targets Smart Device (Mobile), Smart Device (Consumer Electronics), Memory Module & SSD, and Automotive ECU/DCU/TCU applications. Its features include Ultra High Tg & Low CTE for warpage control, High Speed material (Low Dk / Low loss), and Halogen, antimony and red phosphorus free composition.

The Doosan DS-8502LC has a glass transition temperature (DMA) of 260 degrees Celsius. The decomposition temperature of this material is 430 degrees Celsius. Its T-288 value is greater than 120 minutes. At the X, Y axis, it has a CTE of 10/9 ppm/°C. At the Z axis, the CTE is 20/120 ppm/°C. Thermal conductivity is 0.6 W/m·K.

A Tg of 260°C DMA is extraordinarily high for an organic laminate. Most lead-free assembly processes peak around 260°C, meaning DS-8502LC maintains its mechanical properties right through the soldering process — critical for preventing warpage in large, thin substrates like the BGA interposers and SSD controller boards this material targets.

Parameter	DS-8502LC
Tg (DMA)	260°C
Td	430°C
T-288	>120 min
CTE X/Y	10/9 ppm/°C
CTE Z (below Tg)	20 ppm/°C
Thermal Conductivity	0.6 W/m·K
Halogen-free	Yes

DS-8502SQ — Sequential Lamination HDI Grade

The DS-8502SQ targets Smart Device, Consumer Electronics, Memory Module & SSD, and Automotive ECU/DCU/TCU. Its features include Low Dk & Df for high signal speed and signal integrity, High Tg and Low CTE value to reduce warpage, Excellent multi-lamination and thermal performance, and Halogen/antimony/red phosphorus free formulation.

The SQ suffix signals that this material is specifically engineered for sequential lamination HDI manufacturing — the multi-press-cycle fabrication process used for smartphone boards, laptop mainboards, and memory module substrates. The material has to survive repeated press cycles without degrading, which places demands on Td, T-288, and resin flow consistency that not all high-Tg laminates can meet.

Low Dk Materials: The DS-8402H Series

DS-8402H — Halogen-Free Low Dk FR-4

Doosan Low Dk DS-8402H is an FR-4 substrate material with low dielectric constant. This PCB material is halogen-free and features a high glass transition temperature. The Tg value of Doosan Low Dk DS-8402H is 190°C. The decomposition temperature is 380°C. It features 2.8% Z-axis expansion and low water absorption of 0.12%.

This PCB material is a cost-effective option for PCB fabrication. Doosan Low Dk DS-8402H is a flame retardant material that meets the UL-94 V-0 flammability standards. The electrical properties of this material are excellent, featuring a low dissipation factor and a very low dielectric constant, making it functional in high-frequency GHz range electronic applications.

The DS-8402H targets a specific niche: designs that need lower Dk than standard FR-4 (bringing it down toward 3.6–3.8 at 1 GHz) with the Tg needed for lead-free assembly, at a cost point that doesn’t jump into premium low-loss territory. This makes it useful for 5G sub-6 GHz boards, Wi-Fi 6E antenna systems, and radar modules where dielectric constant matters but loss tangent requirements aren’t at the extreme end.

DS-8402H BS (DFL) — Build-Up Sheet, Low Loss Variant

The DS-8402H BS (DFL) is a Copper Clad Laminate product available from Doosan Corporation Electro-Materials. The DFL suffix adds dust-free and low-loss properties to the build-up sheet format, targeting HDI applications where the DS-8402H’s lower Dk is valuable in the build-up dielectric layers alongside the low-loss processing requirements of fine-line fabrication.

DS-8402H Product Variants

Part Number	Format	Key Differentiation
DS-8402H	Core laminate	Low Dk, high-Tg, halogen-free
DS-8402H BS (DFL)	Build-up sheet	Low-loss, dust-free processing, HDI

The DS-7408 and DS-7409 Build-Up Sheet Series

In addition to the DS-7409D core laminate series, Doosan produces prepreg and build-up sheet variants of the 7408 and 7409 families for sequential lamination HDI fabrication.

The DS-7408 BS (DF), DS-7409 BS (DF), and DS-7402 BS (DF) represent the build-up sheet range within the corresponding CCL families. These materials are supplied in prepreg sheet format rather than laminate, formatted for the build-up layer press cycles in smartphone, wearable, and laptop HDI manufacturing.

The distinction from the core laminates is important: build-up sheet (BS) grades are formulated for lower resin flow during pressing (to control dielectric thickness uniformity), dust-free processing, and compatibility with laser microvia formation. If you’re specifying a DS-7409DV in an HDI stackup and the fabricator is using build-up layer construction, you’d likely be specifying DS-7409 BS (DF) for the prepreg portions of the stackup rather than the core laminate form factor.

IC Package Substrate Materials

The IC package substrate is used for high elastic modulus and low CTE to support reliable and thin products with excellent insulation, heat resistance, low permittivity, and stretch stability.

Doosan’s IC substrate materials represent their most technically demanding product category — materials for the interposer and BGA package substrate applications where fine-pitch copper redistribution layers (as fine as 2/2 µm line/space in advanced versions) and extreme dimensional stability requirements push the boundaries of what organic laminate chemistry can deliver.

These materials aren’t typically on an engineer’s shelf-stock shortlist; they’re qualified through a collaboration between Doosan, the OSAT (outsourced semiconductor assembly and test) facility, and the chip vendor. The key properties are elastic modulus (Young’s modulus higher than standard FR-4, to resist substrate warpage), ultra-low CTE (to match silicon and copper’s expansion), and low dielectric loss for signal integrity at package-level frequencies.

Doosan produces IC substrate materials: ultra-thin materials with 25–50 µm core for package substrates supporting fine-pitch flip-chip designs.

Flexible CCL (FCCL): The DSflex Series

FCCL is an abbreviation for flexible copper clad laminate. FCCL is a key material of flexible printed circuit board (FPCB) and is manufactured by laminating copper foil onto polyimide film (PI). FPCB, unlike rigid PCB, makes it possible to realize product design with bending, folding, and sliding features.

Doosan’s DSflex series covers flexible CCL for smartphone, wearable, laptop, and automotive applications where the circuit must flex or fold in the final assembly. The DSflex-900 is the key product in this line.

DSflex-900

The DSflex-900 is a standard polyimide-based flexible CCL targeting smart device applications. Polyimide substrate provides high thermal stability (Tg well above 250°C), good dielectric properties for flex circuit routing, and the mechanical flexibility needed for continuous bending applications in phone hinges, camera modules, and wearable device fold zones.

The FX series supports designs requiring controlled impedance in flexible sections — increasingly important for wearables and medical devices.

Flexible CCL Selection Considerations

When specifying Doosan FCCL for your design, the key parameters to align between material spec and design requirement are: minimum bend radius (cycling vs. static installation), adhesive vs. adhesiveless construction (adhesiveless offers better high-frequency and thermal performance), copper weight and type (electrolytic vs. rolled annealed — RA copper is essential for high-cycle bending), and polyimide film thickness.

LED Lighting and Power Module Substrate Materials

Doosan Electronics develops LED and power module substrate materials for lighting and power module applications, including High Thermal Conductivity, High Reliability, and High Tg & High Thermal Conductivity metal-base copper clad laminates.

This product segment covers metal-base and thermally enhanced laminates for high-power LED lighting, motor drive modules, and power electronics applications where the PCB dielectric must efficiently transfer heat to an aluminum or copper base plate.

Doosan’s Thermally Enhanced Laminates include metal-core and ceramic-filled variants for LED lighting and power module applications where heat dissipation is the primary design constraint.

The standard thermal conductivity range for these materials typically runs 1.0–3.0 W/m·K, with higher thermal conductivity achieved through increased ceramic filler loading. The tradeoff is that heavier filler loading increases Dk and complicates laser drilling, so the specific grade selection depends on whether the design uses through-holes (no laser drilling concern) or microvias.

Automotive and High-Reliability Materials

The automotive sector has driven significant development at Doosan, particularly for ADAS (Advanced Driver Assistance Systems) applications. Their RF-500 and EM-888HF materials see heavy use in 77 GHz radar modules where signal integrity directly impacts safety-critical functions. For powertrain and body electronics, the EM-827 and EM-891 series handle the thermal cycling and vibration requirements specified in AEC-Q100 testing. Several Tier 1 automotive suppliers have standardized on Doosan materials for new platform designs.

Automotive qualification for CCL involves considerably more documentation and lot-to-lot consistency verification than standard commercial PCB material procurement. Doosan maintains the relevant automotive certifications (IATF 16949 quality management system), and their automotive-grade CCL products carry the material traceability documentation that tier-1 suppliers require for both initial qualification and ongoing production audits.

Doosan maintains certifications that include IATF 16949, UL recognition, and halogen-free certifications. These certifications represent audit trails and process controls that reduce risk when designing products for automotive, medical, or aerospace applications.

High-CTI Materials for Power Electronics

Doosan produces High-CTI Materials (EM-CTI Series) with Comparative Tracking Index ratings above 600V for power electronics where creepage distances are tight. High CTI ratings are critical for mains-connected power electronics — motor drives, EV chargers, industrial inverters — where the PCB surface may have high-voltage copper traces at close proximity and the laminate material must resist tracking failures in contaminated or humid environments.

5G and mmWave Communication Materials

The 5G rollout has created demand for low-loss materials that can handle frequencies from sub-6 GHz to mmWave bands. Doosan PCB substrates appear in base station antenna arrays, beamforming networks, and backhaul equipment where insertion loss budgets are tight. The company’s ability to supply consistent material in high volumes has made them a preferred supplier for telecommunications OEMs who can’t afford material shortages during infrastructure buildouts.

Doosan’s 5G/6G communication materials are needed to transfer high volumes of data in the 5G/6G communications setting. High-reliable PCB board allows chipsets and network boards to operate stably at Sub-6, mmWave and even Sub-THz.

For 5G applications, material selection follows frequency range. Sub-6 GHz antenna array PCBs can often use DS-7409DV or DS-7409DV(N) depending on exact insertion loss budget and antenna element count. mmWave beamforming modules at 28 GHz or 39 GHz require the DS-7409DJN+ or dedicated RF-grade materials, where Df at 28 GHz is the critical specification rather than bulk FR-4 low-frequency Dk.

Complete Doosan PCB Materials Part Number Reference Table

This table consolidates the primary CCL product families. For full specifications, always pull the current datasheet from Doosan’s official product page — specs can be updated between product revisions.

Part Number	Series	Tg (DMA)	Dk @ 10 GHz	Df @ 10 GHz	Halogen-Free	Primary Application
DS-7402	Standard FR-4	~150°C	~4.5	~0.020	No	Consumer, industrial
DS-7402LC	Standard FR-4	~150°C	~4.5	~0.020	No	Multilayer HDI, BGA boards
DS-7402BS (DF)	Build-up	~155°C	~4.4	~0.019	Yes	Smartphone HDI layers
DS-7402BS (DFM)	Build-up	~155°C	~4.4	~0.018	Yes	Fine-pitch HDI build-up
DS-7409D(X)	High-speed	~180°C	~3.8–4.0	~0.010–0.013	Yes	10G/25G networking
DS-7409DV	Low loss	~225°C	~3.48–3.50	~0.007–0.009	Yes	100G, DDR5, servers
DS-7409DV(N)	Ultra-low loss	~220°C	~3.4–3.5	~0.005–0.007	Yes	400G, PCIe Gen5
DS-7409DV(T)	Thin, low loss	~220°C	~3.4–3.5	~0.006–0.008	Yes	HDI build-up, thin core
DS-7409DJN+	Super low loss	~210°C	~3.3–3.4	~0.003–0.005	Yes	5G mmWave, AI fabrics
DS-7408 BS (DF)	Build-up sheet	~180°C	~3.8	~0.011	Yes	HDI build-up layers
DS-7409 BS (DF)	Build-up sheet	~220°C	~3.5	~0.008	Yes	Low-loss HDI build-up
DS-8402H	Low Dk FR-4	~190°C	~3.6–3.8	~0.010	Yes	Sub-6 GHz RF, Wi-Fi 6E
DS-8402H BS (DFL)	Build-up sheet	~190°C	~3.6	~0.009	Yes	Low-Dk HDI layers
DS-8502LC	Ultra-high Tg	260°C	~3.5	~0.008	Yes	SLP, SSD, automotive ECU
DS-8502SQ	Sequential HDI	260°C	~3.5	~0.008	Yes	Smartphone, laptop HDI
DSflex-900	Flex CCL	>250°C	~3.4	~0.010	Yes	FPC, wearables, cameras
LED/Power Thermal	Metal-base CCL	>170°C	~4.8–5.5	~0.018	Yes	LED drivers, power modules

Dk/Df values are approximate based on available datasheet data and published characterizations. Always reference the current official Doosan datasheet for your specific variant and test conditions before finalizing impedance calculations.

How to Select the Right Doosan PCB Material for Your Application

Here’s the decision framework that covers most design scenarios:

Step 1: Identify Your Frequency Ceiling

Signal Speed / Frequency	Starting Material
DC to 1 GHz / below 1 Gbps	DS-7402, DS-7402LC
1–10 GHz / 1–25 Gbps	DS-7409D(X) or DS-8402H
10–28 GHz / 25–100 Gbps	DS-7409DV or DS-7409DV(N)
28–40 GHz / 100–400 Gbps	DS-7409DJN+
mmWave above 40 GHz	DS-7409DJN+ or RF-grade variant

Step 2: Evaluate Thermal and Reliability Requirements

Lead-free assembly compatibility requires Tg above 170°C at a minimum (150°C is marginal). For multiple reflow cycles, automotive applications, or Class 3 reliability requirements, target Tg ≥ 200°C and verify T-260 and T-288 values. IC package substrates and SSD boards typically need Tg ≥ 250°C for warpage control during assembly.

Step 3: Check Halogen-Free and Regulatory Status

Almost all modern Doosan CCL products in the high-performance segment are halogen-free (antimony and red phosphorus-free as well). If your product requires IEC 61249-2-21 halogen-free certification, confirm the specific part number carries that certification — not all variants in a product family are automatically halogen-free.

Step 4: Confirm CTE Budget for Your Via Structure

High via aspect ratio designs, HDI with stacked microvias, and large BGA arrays all benefit from low-CTE laminates to minimize Z-axis expansion during thermal cycling. DS-8502LC’s 20 ppm/°C Z-axis CTE (below Tg) is exceptionally low; DS-7409DV’s 45 ppm/°C is good for a standard high-speed FR-4 grade.

Step 5: Discuss Fabrication-Specific Variants With Your Board Shop

Several Doosan materials have customer-specific variants (C suffix) or thin-core versions (T suffix) that may be carried by a specific fabricator under negotiated supply agreements. Your board shop may have access to optimized press profiles and specific material revisions that aren’t listed on the public product page — worth asking.

Doosan PCB Materials vs. Key Competitors

Understanding how Doosan competes with Isola, Panasonic, TUC, and Shengyi helps when you’re making a sourcing decision or looking for a validated substitute.

Doosan Material	Loss Level	Comparable Isola	Comparable Panasonic	Comparable TUC
DS-7402	Standard FR-4	IS410	R-1566W	TU-768
DS-7409D(X)	Middle loss	370HR	R-1577	TU-872 SLK
DS-7409DV	Low loss	IS415	Megtron 4	TU-883
DS-7409DV(N)	Ultra-low loss	FR408HR	Megtron 6	TU-883 SP
DS-7409DJN+	Super low loss	Tachyon 100G	Megtron 7	—
DS-8502LC	Ultra-high Tg, low CTE	IS500	—	TU-862 HF

In the field of high-speed PCB materials, the main manufacturers include ISOLA (370HR, FR408, IS410, IS620), Panasonic of Japan (Megtron4 and Megtron6 are the most classic), TUC of Taiwan (the 893 series are highly competitive), and Doosan of South Korea (DS-7409D series is cost-effective).

The cost-effectiveness note on the DS-7409D series is real and widely acknowledged in the industry. Where Panasonic Megtron 6 commands a significant premium due to brand recognition and long qualification history, the DS-7409DV(N) routinely competes on specification for 100G/400G networking boards at a lower material cost. For volume production where qualification cost is amortized, this is a meaningful difference.

Useful Resources for Engineers Working With Doosan PCB Materials

Resource	Description	Access
Doosan Official Product Catalog	Complete CCL lineup with product search by application and property	doosanelectromaterials.com/en/product
Doosan CCL All Properties PDF	Full Tg, Td, CTE, Dk, Df data across product families	doosanelectromaterials.com/download section
CircuitData Material Database	Open-source material DB with Doosan entries, API access	materials.circuitdata.org
Z-zero Z-planner	Stackup design tool with Doosan laminate library integration	z-zero.com/pcb-materials
IPC-4101 Standard	Base material qualification and slash sheet specifications	ipc.org
IPC-TM-650 Test Methods	Tg, Td, CTE, Dk/Df measurement methodology	ipc.org
Doosan MSDS Downloads	Material Safety Data Sheets for all CCL products	doosanelectronics.com/en/product/CCL_tech_support04
Altium Z-Planner with Doosan Library	Impedance stackup design incorporating Doosan material Dk/Df	altium.com / z-zero.com
MCL PCB Doosan Datasheets	DS-7402 and DS-7409 datasheets in PDF	mclpcb.com/doosan

Frequently Asked Questions About Doosan PCB Materials

Q1: What is the difference between DS-7409DV and DS-7409DV(N)?

Both are low-loss grades in the DS-7409D series, but the (N) suffix indicates a halogen-free resin formulation on top of the DV low-loss base chemistry. The (N) grade typically has Df values 10–20% lower than the base DV, and it meets IEC 61249-2-21 halogen-free requirements. For designs that don’t need halogen-free certification and where the base DV meets the insertion loss budget, DS-7409DV is the more economical choice. For designs requiring halogen-free compliance — most automotive, medical, and consumer electronics sold in the EU — DS-7409DV(N) is the correct specification.

Q2: Can I substitute Doosan DS-7409DV for Panasonic Megtron 4 without re-qualifying the board?

In a strict IPC Class 3 or automotive program, any laminate change requires at least a material qualification review and potentially a full re-qualification depending on the program’s material control plan. However, from a technical specification standpoint, DS-7409DV and Megtron 4 are in the same performance class — similar Dk, similar Df, similar Tg. For Class 2 commercial products, many design teams do a controlled first article build with the substituted material and run it through incoming electrical test and cross-sectional analysis rather than full re-qual. Confirm with your customer or quality plan before switching.

Q3: Does Doosan supply datasheets and process guidelines in English?

Yes. Doosan’s official website at doosanelectromaterials.com has an English-language interface with product pages, RoHS documentation, and MSDS downloads. Full technical datasheets with Tg, Td, CTE, Dk, and Df tables are available via the technical support section or through authorized distributors and board fabricators. For advanced processing guides and press profiles, contact Doosan’s regional technical sales team — these documents are available on request but aren’t always posted publicly.

Q4: Which Doosan material is best for 77 GHz automotive radar PCBs?

At 77 GHz, you’re at the upper limit of what organic FR-4-class laminates can realistically support. Doosan RF-500 and EM-888HF materials see heavy use in 77 GHz radar modules where signal integrity directly impacts safety-critical functions. The DS-7409DJN+ is at the high-performance end of the DS-7409D family but for serious 77 GHz antenna board applications, consult Doosan’s RF-grade or EM-888HF materials specifically. Material loss at 77 GHz for any organic laminate is significantly higher than at 10 GHz — the total board loss budget and antenna element dimensions at that frequency typically require dedicated RF laminate grades rather than enhanced FR-4.

Q5: How should I store Doosan CCL and prepreg to maintain material properties?

Standard industry storage guidelines apply to Doosan materials. Laminate cores and prepreg sheets should be stored sealed in moisture-barrier packaging, at temperatures below 23°C and humidity below 50% RH. Doosan laminates ship vacuum-sealed with moisture indicators. For fine-pitch designs or high humidity environments, standard pre-bake procedures apply before lamination. Prepreg materials have a defined shelf life (typically 3–6 months from manufacture date when stored correctly) — always check the manufacture date on the roll label and confirm remaining shelf life with your board fabricator. Material that has exceeded shelf life should be re-tested for resin flow characteristics before use; expired prepreg can produce voids, delamination, and inconsistent dielectric thickness in the finished board.

Conclusion

Navigating the Doosan PCB materials catalog is a lot more manageable once you understand the product family logic and suffix code system. The DS-7402 series handles standard applications; the DS-7409D family spans a performance range from mid-loss to super-low-loss for high-speed designs; the DS-8502 series delivers ultra-high Tg and CTE control for advanced packaging and automotive; DS-8402H fills the low-Dk FR-4 segment; DSflex covers flexible CCL; and the LED/thermal grades handle power electronics.

For engineers sourcing material for production programs, the most important takeaway is this: Doosan maintains consistent batch-to-batch material properties, supports volume supply at scale, and backs their product line with English-language technical documentation and regional engineering support. For high-volume projects where material availability and traceability matter as much as headline specifications, that combination is what makes Doosan PCB materials a practical choice at every tier from standard FR-4 through advanced low-loss high-speed substrates.

Keep this guide bookmarked and verify current specs against the official Doosan datasheet for any production design — part number variants can evolve, and the specific Tg, Dk, and Df values that matter to your design need to come from the current, released product datasheet rather than a reference table.