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XCV100E-6PQG240C – Xilinx Virtex-E FPGA | High-Performance Programmable Logic Solution

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Core Architecture

  • Family: Xilinx Virtex-E 1.8V FPGAs
  • Part Number: XCV100E-6PQG240C
  • System Gates: 32.4K Gates
  • Logic Elements: 2700 Cells
  • Performance: 357MHz maximum frequency

Physical Characteristics

  • Package Type: 240-Pin PQFP (Plastic Quad Flat Pack)
  • Mounting Type: Surface Mount
  • Technology Node: 0.18ฮผm CMOS process
  • Package Pitch: 0.5mm

Electrical Specifications

  • Supply Voltage: 1.8V nominal (1.71V ~ 1.89V range)
  • I/O Count: 158 I/O pins
  • Total RAM: 81,920 bits
  • CLBs/LABs: 600 configurable logic blocks

Operating Conditions

  • Operating Temperature: 0ยฐC to +85ยฐC (TJ)
  • Speed Grade: -6 (indicating performance tier)
  • Power Consumption: Optimized for low-power operation

Advanced Features

  • SelectI/O Technology: Supports multiple I/O standards
  • PCI Compliance: 33/66 MHz PCI interface support
  • 6-Layer Metal Process: Enhanced routing density and performance
  • Place-and-Route Optimized: Architecture designed for efficient implementation

2. Pricing Information

Market Pricing

The XCV100E-6PQG240C is available through multiple authorized distributors and electronic component suppliers worldwide. Pricing varies based on quantity, with bulk discounts available from 24+ distributors tracked by major component search engines.

Pricing Factors

  • Quantity Breaks: Volume pricing available for quantities of 100+, 1K+, and 5K+ units
  • Lead Time: Standard lead times range from stock to 12-16 weeks for large quantities
  • Market Fluctuations: Prices are monitored in real-time with historical price trend data available

Purchasing Options

  • Authorized Distributors: Available through Digi-Key, Mouser, Arrow, and other major suppliers
  • Direct from Manufacturer: AMD Xilinx authorized channels
  • Broker Networks: Secondary market availability for legacy applications

Note: Current pricing requires RFQ (Request for Quote) due to market volatility and quantity-dependent pricing structures.


3. Documents & Media

Official Documentation

  • Primary Datasheet: Virtex-E FPGA Family Complete Data Sheet (DS022)
  • Package Information: 240-Pin PQFP Package Details and Pinout
  • Application Notes: Design implementation guidelines and best practices
  • Migration Guides: Upgrade paths and compatibility information

Technical Resources

  • Reference Designs: Example implementations and starter projects
  • Timing Reports: Detailed performance analysis and constraints
  • Power Analysis: Consumption models and thermal considerations
  • Layout Guidelines: PCB design recommendations and signal integrity

Development Documentation

  • User Guides: Comprehensive implementation tutorials
  • Design Methodology: Best practices for Virtex-E development
  • Troubleshooting Guides: Common issues and solutions
  • Errata Documents: Known issues and workarounds

Multimedia Resources

  • Block Diagrams: Architecture overviews and system integration
  • Package Drawings: Mechanical specifications and dimensions
  • Thermal Plots: Heat dissipation and cooling requirements
  • Application Videos: Implementation examples and demonstrations

4. Related Resources

Development Tools

  • Vivado Design Suite: Primary development environment with user-friendly synthesis and implementation tools
  • ISE Design Tools: Legacy support for existing designs
  • IP Core Library: Pre-verified intellectual property blocks
  • Simulation Tools: ModelSim and other verification environments

Development Boards

Popular evaluation platforms frequently used with XCV100E series:

  • ZedBoard: Zynq-based development platform
  • Basys 3: Educational FPGA development board
  • Nexys4-DDR: Advanced prototyping platform
  • Arty S7: Compact development solution

Support Ecosystem

  • Technical Forums: FPGA community support and knowledge sharing
  • Application Engineers: Direct technical support from AMD Xilinx
  • Training Resources: Online courses and certification programs
  • Third-Party Tools: Compatible EDA and verification tools

Alternative Solutions

  • Pin-Compatible Variants: Other package options (BGA, CSG)
  • Speed Grade Options: -7, -8 variants for different performance requirements
  • Migration Path: Newer Xilinx families for forward compatibility
  • Second Sources: Compatible solutions from other vendors

5. Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliance: Fully compliant with RoHS Directive 2011/65/EU restricting hazardous substances including lead, cadmium, mercury, and hexavalent chromium
  • Lead-Free Options: Available in lead-free packaging meeting environmental requirements
  • REACH Compliance: Meets European chemical safety regulations
  • WEEE Directive: Compliant with waste electrical and electronic equipment standards

Material Classifications

  • Moisture Sensitivity Level (MSL): Rated for specific handling and storage requirements
  • Peak Reflow Temperature: Specified for lead-free soldering processes
  • Halogen-Free: Options available for environmentally sensitive applications
  • Conflict Minerals: Compliant with responsible sourcing requirements

Export Control Information

  • ECCN Classification: Export Control Classification Number for international trade
  • HTS Code: Harmonized Tariff Schedule classification
  • Country of Origin: Manufacturing location documentation
  • Export Restrictions: Compliance with international trade regulations

Quality Standards

  • ISO 9001: Manufacturing quality management certification
  • Automotive Grade: AEC-Q100 qualified variants available
  • Military/Aerospace: Extended temperature and screening options
  • Medical Device: IEC 60601 compliant versions for healthcare applications

Packaging Information

  • Anti-Static Packaging: ESD-safe handling and shipping materials
  • Moisture Barrier: Protective packaging for humidity-sensitive devices
  • Traceability: Lot and date code marking for quality control
  • Recycling Information: End-of-life disposal and recycling guidelines

Applications

The XCV100E-6PQG240C excels in applications requiring:

  • Digital Signal Processing: High-speed data processing and filtering
  • Communications Infrastructure: Network equipment and protocol processing
  • Industrial Automation: Control systems and real-time processing
  • Test & Measurement: Instrumentation and data acquisition systems
  • Embedded Systems: Flexible processing and interface control

Summary

The XCV100E-6PQG240C represents proven FPGA technology from AMD Xilinx’s Virtex-E family, offering an optimal balance of performance, power efficiency, and cost-effectiveness. With comprehensive development tool support, extensive documentation, and full environmental compliance, this device provides a reliable foundation for demanding programmable logic applications across multiple industries.

For current pricing, availability, and technical support, contact authorized AMD Xilinx distributors or submit an RFQ through qualified electronic component suppliers.