XCV50E-6CS144C – Xilinx Virtex-E FPGA | Compact 144-Pin CSBGA Field Programmable Gate Array

1. Product Specifications

Core Technical Specifications

Part Number: XCV50E-6CS144C
Manufacturer: AMD Xilinx (formerly Xilinx)
Product Family: Virtex-E 1.8V FPGAs
Package Type: 144-Pin Chip Scale Ball Grid Array (CSBGA)
Speed Grade: -6 (6ns pin-to-pin delay)
Temperature Grade: Commercial (0°C to +85°C TJ)
Status: Obsolete – Legacy component for maintenance applications

Detailed Performance Parameters

• System Gates: 71,693 total system gates
• Logic Cells: 1,728 configurable logic blocks (CLBs)
• CLBs/LABs: 384 configurable logic blocks organized efficiently
• Maximum Operating Frequency: Up to 357 MHz
• User I/O Pins: 94 I/O pins available
• Total RAM Bits: 65,536 bits (64kB distributed memory)
• Core Voltage: 1.8V (1.71V ~ 1.89V range)
• I/O Voltage: 2.5V/3.3V SelectI/O+ compatible

Advanced Architecture Features

• Process Technology: 0.18μm 6-layer metal CMOS process
• Package Dimensions: 144-LCSBGA (12×12mm)
• Mounting Type: Surface Mount Technology (SMT)
• Memory System: SelectRAM+ distributed and block RAM architecture
• Clock Management: Digital Clock Manager (DCM) with multiple DLLs
• Configuration: JTAG, SelectMAP, and Serial programming modes
• Performance: System performance up to 200 MHz, 66-MHz PCI compliant

Package and Pinout Characteristics

• Package Type: 144-pin Low-profile Chip Scale Ball Grid Array (LCSBGA)
• Package Size: 12×12mm compact footprint
• Ball Pitch: Fine-pitch BGA for high-density routing
• Thermal Design: Enhanced thermal characteristics for compact applications
• Pin Assignment: 94 dedicated user I/O pins optimized for small form factor
• Routing Efficiency: Optimized pin arrangement for PCB layout efficiency

2. Pricing Information

Legacy Component Pricing

Important Status: The XCV50E-6CS144C is marked as OBSOLETE by AMD Xilinx and is no longer manufactured. This device is available only for legacy system maintenance and replacement applications.

Current Market Pricing

Legacy/Obsolete Component Pricing:

• Limited Availability: Available primarily from specialty distributors and surplus inventory
• Premium Pricing: Expect significant premium over original pricing due to obsolete status
• Minimum Quantities: Often require minimum order quantities due to limited stock
• Lead Times: Extended lead times of 6-16 weeks depending on availability

Supply Chain Considerations

Stock Status and Availability:

• Primary Sources: Authorized distributors with remaining inventory
• Secondary Market: Independent distributors and surplus component suppliers
• Broker Network: Specialty obsolete component brokers
• OEM Stock: Some OEMs may have dedicated inventory for legacy support

Procurement Strategies:

• Life-time Buy: Consider purchasing long-term requirements due to obsolete status
• Alternative Sourcing: Multiple supplier quotes recommended
• Quality Verification: Enhanced incoming inspection recommended for obsolete components
• Migration Planning: Evaluate modern alternatives for new designs

Note: Due to obsolete status, pricing is highly variable and dependent on remaining inventory. Contact multiple specialty distributors for current availability and pricing.

3. Documents & Media

Official Technical Documentation

Legacy Documentation Archive:

• Datasheet: Virtex-E FPGA family comprehensive datasheet (PDF format)
• User Guide: Virtex-E FPGA configuration and implementation guide
• Application Notes: Legacy application-specific documentation
• Migration Guide: Recommendations for transitioning to current FPGA families

Design Resources and CAD Files:

• Symbol Libraries: Available for legacy EDA tools (Altium Designer, Eagle, KiCad, OrCAD)
• PCB Footprints: 144-CSBGA package layout files optimized for compact designs
• 3D Models: STEP and IGES models for mechanical design verification
• IBIS Models: Signal integrity simulation models for high-speed compact designs
• Reference Designs: Compact system implementations and space-constrained applications

Software and Development Tools

Legacy Development Environment:

• ISE Design Suite: Primary development platform (Foundation Series™ or Alliance Series™)
• Design Entry: Support for schematic capture and HDLs (VHDL/Verilog)
• Simulation Tools: ModelSim integration for functional and timing verification
• Programming: iMPACT configuration software with CSBGA package support

Important Tool Considerations:

• ISE Versions: Supported in ISE versions 6.x through 14.x
• Vivado Compatibility: NOT supported in current Vivado Design Suite
• Legacy Software: Original development tools remain available for download
• ChipScope Pro: On-chip debugging capabilities for legacy designs

Configuration and Programming Options

Programming Methods:

• JTAG: IEEE 1149.1 compliant boundary scan for debug and configuration
• SelectMAP: High-speed parallel configuration interface
• Serial Configuration: Standard serial programming for simple applications
• Master/Slave: Flexible configuration topology support

Compact Design Considerations:

• Thermal Management: Enhanced heat dissipation for compact 12×12mm package
• Signal Integrity: Careful PCB design required for 94 I/O in compact form factor
• Power Distribution: Optimized power delivery for small package size

4. Related Resources

Legacy Applications and Use Cases

Primary Legacy Applications:

• Embedded Systems: Space-constrained embedded control applications
• Communications Equipment: Compact networking and protocol processing
• Industrial Control: Small form factor automation and control systems
• Medical Devices: Portable and handheld medical equipment
• Test Equipment: Compact measurement and analysis instruments

Design Support and Maintenance

Legacy System Support:

• Replacement Parts: Sourcing for existing legacy system maintenance
• Design Documentation: Archived technical resources and design guides
• Application Support: Limited legacy application engineering support
• Migration Services: Professional services for transitioning to current FPGAs

Design Resources:

• IP Cores: Legacy IP cores compatible with Virtex-E architecture
• Reference Designs: Proven implementations for compact applications
• Layout Guidelines: PCB design best practices for 144-CSBGA package
• Thermal Analysis: Thermal management strategies for compact designs

Migration Path and Alternatives

Current Generation Alternatives:

• Artix-7 Family: Modern replacement with improved performance and lower power
• Spartan-7 Family: Cost-effective alternative for space-constrained applications
• Zynq-7000 Family: System-on-chip alternatives with ARM processors
• Kintex-7 Family: Higher performance alternatives for demanding applications

Migration Considerations:

• Pin Compatibility: Different package options may require PCB redesign
• Tool Migration: ISE to Vivado design tool transition required
• IP Migration: Legacy IP cores may need updating for current architectures
• Performance Analysis: Timing closure verification in new architecture

Technical Support and Resources

Legacy Support Options:

• AMD Xilinx Archive: Maintained documentation library for legacy devices
• Community Support: FPGA forums and user communities for legacy designs
• Third-party Services: Specialized legacy FPGA consulting and support
• Training Resources: Archived training materials for Virtex-E family

Professional Services:

• Migration Consulting: Expert guidance for transitioning to current FPGAs
• Legacy Maintenance: Specialized support for maintaining existing systems
• Component Sourcing: Professional obsolete component sourcing services
• Design Recovery: Reverse engineering services for legacy systems

Design Considerations for Compact Applications

Mechanical Constraints:

• Package Size: 12×12mm LCSBGA optimized for space-constrained designs
• Height Profile: Low-profile package suitable for thin form factor applications
• Thermal Considerations: Enhanced thermal design required for compact package
• Assembly Considerations: Fine-pitch BGA assembly requirements

Electrical Design:

• I/O Planning: 94 I/O pins require careful planning for optimal utilization
• Power Distribution: Compact power delivery network design
• Signal Integrity: High-density routing considerations for 144-pin package
• EMI/EMC: Electromagnetic compatibility in compact designs

5. Environmental & Export Classifications

Environmental Compliance and Standards

RoHS and Environmental Compliance:

• ✅ Legacy RoHS Status: Original RoHS compliance status maintained
• ✅ Lead-Free Compatible: Supports lead-free soldering processes (verify with supplier)
• ✅ WEEE Directive: Compliant with European waste electrical equipment regulations
• ⚠️ Current Compliance: Verify current environmental status due to obsolete manufacturing

Operating Specifications:

• Operating Temperature: 0°C to +85°C (TJ) junction temperature
• Storage Temperature: -65°C to +150°C
• Humidity Tolerance: Up to 95% non-condensing
• Thermal Cycling: Qualified for commercial temperature cycling
• Compact Package Considerations: Enhanced thermal management required

Quality and Reliability Standards

Legacy Quality Certifications:

• ISO 9001: Original quality management system certified manufacturing
• JEDEC Standards: Compliance with JEDEC reliability standards at time of manufacture
• IPC Standards: PCB assembly and soldering process compliance
• Legacy Qualification: Original device qualification testing completed

Reliability Metrics for Legacy Components:

• MTBF: >1M hours under original specified conditions
• ESD Protection: Standard Human Body Model (HBM) protection
• Latch-up Immunity: Per JEDEC standard at time of manufacture
• Configuration Endurance: >10,000 reconfiguration cycles
• Data Retention: >20 years at maximum operating temperature
• Age Considerations: Factor in component age for reliability calculations

Export and Trade Classifications

Export Control and Compliance:

• Legacy ECCN: Original Export Control Classification Number applies
• Current Status: Verify current export requirements for obsolete components
• Country of Origin: Original Xilinx manufacturing facilities
• End-of-Life Status: Consider export implications of obsolete components

International Trade Considerations:

• Obsolete Component Status: Special considerations for obsolete component trade
• Documentation Requirements: Enhanced documentation for legacy components
• Supply Chain Verification: Verify authenticity and chain of custody
• Anti-Counterfeiting: Critical importance for obsolete components

Handling and Storage for Legacy Components

Enhanced ESD Protection:

• ESD Sensitivity: Class 1 ESD sensitive device requiring enhanced protection
• Aging Considerations: Potentially increased sensitivity due to component age
• Handling Procedures: Enhanced ESD precautions for legacy components
• Storage Requirements: Climate-controlled storage for long-term inventory

Moisture Sensitivity and Aging:

• MSL Rating: Original Moisture Sensitivity Level 3 per JEDEC J-STD-020
• Age-Related Changes: Consider potential changes in moisture sensitivity
• Baking Requirements: May require enhanced baking procedures
• Package Integrity: Verify package condition for aged components

Legacy Component Assembly:

• Soldering Profile: Verify compatibility with current assembly processes
• Inspection Requirements: Enhanced optical and X-ray inspection
• Testing Protocols: Comprehensive testing for aged components
• Traceability: Critical importance for obsolete component tracking

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Why Choose XCV50E-6CS144C for Legacy Applications?

The XCV50E-6CS144C FPGA represents a proven solution for maintaining critical legacy systems requiring compact form factor and reliable performance. While obsolete for new designs, this device provides essential continuity for existing applications.

Legacy System Benefits:

• ✅ Compact Form Factor: 12×12mm package ideal for space-constrained legacy designs
• ✅ Proven Reliability: Field-tested technology with established performance history
• ✅ Drop-in Replacement: Direct replacement for existing XCV50E-6CS144C implementations
• ✅ 94 I/O Pins: Sufficient I/O capability in compact package for most legacy applications
• ✅ Legacy Tool Support: Compatible with existing ISE design environments

Important Considerations:

• ⚠️ Obsolete Status: No longer manufactured – limited availability
• ⚠️ Premium Pricing: Expect higher costs due to limited supply
• ⚠️ Migration Planning: Consider alternatives for new designs and long-term support
• ⚠️ Supply Chain Risk: Limited sources require careful inventory management

Maintenance Applications:

• ✅ Repair and Replacement: Essential for maintaining existing legacy systems
• ✅ Limited Production: Small volume production runs for legacy products
• ✅ Field Service: Replacement parts for field service and maintenance
• ✅ End-of-Life Extensions: Extending life of critical legacy systems

For legacy system support, obsolete component sourcing, and migration planning, contact specialized distributors and AMD Xilinx legacy support programs.