XCV50E-7FG256C – Xilinx Virtex-E FPGA High-Performance 256-Pin Fine-Pitch Ball Grid Array

1. Product Specifications

Core Technical Specifications

• Part Number: XCV50E-7FG256C
• Manufacturer: AMD Xilinx (formerly Xilinx Inc.)
• Product Family: Virtex-E 1.8V Field Programmable Gate Arrays
• Technology Node: 0.18μm CMOS process
• Supply Voltage: 1.8V core voltage (1.71V ~ 1.89V)

Logic Resources

• System Gates: 71,693 system gates
• Logic Gates: 20,736K logic gates
• Logic Elements/Cells: 1,728 logic cells
• Configurable Logic Blocks (CLBs): 384 CLBs
• CLB Array Configuration: 16 x 24 CLB array
• Maximum Operating Frequency: 400MHz
• Total RAM Bits: 65,536 total RAM bits
• Distributed RAM Bits: 24,576 distributed RAM bits

Package Information

• Package Type: Fine-Pitch Ball Grid Array (FBGA)
• Pin Count: 256 pins
• Package Code: FG256C
• Package Dimensions: 256-FBGA (17×17mm)
• Speed Grade: -7 (High-performance grade)
• I/O Pins: 176 user I/O pins
• Mounting Type: Surface Mount

Environmental Specifications

• Operating Temperature Range: 0°C ~ 85°C (TJ)
• Product Status: Obsolete
• RoHS Compliance: RoHS non-compliant
• Packaging: Tray packaging
• Package Material: Fine-pitch ball grid array construction

Key Features

• High Logic Density: Optimal balance of logic resources and I/O density for complex applications
• Advanced Interconnect: 6-layer metal interconnect with optimized routing hierarchy
• Compact High-I/O Package: 256-pin FBGA maximizes I/O count in minimal footprint
• High-Speed Operation: 400MHz operation for demanding real-time applications
• Enhanced I/O Capability: 176 user I/O pins for extensive connectivity requirements
• Proven Architecture: Mature Virtex-E platform with established design methodologies
• SelectRAM+ Memory: Advanced on-chip memory architecture for data storage
• Clock Management: Robust clock distribution and management capabilities

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2. Pricing Information

Current Market Pricing

The XCV50E-7FG256C pricing varies due to its obsolete status and specialized FBGA package requirements. Real-time price monitoring available through electronic component search engines with frequent fluctuations based on market demand.

Stock Availability Examples

Current stock levels from select distributors:

• 13,276 pcs stock available from XI DA Electronics with 365 days warranty
• 1,000 pcs stock available from Xilinx-ADM distributor
• Large in-stock quantities reported from multiple distributors
• 14,276 pcs stock available from M2S1 with updated inventory

Market Characteristics

• Premium Package Pricing: FBGA package commands higher pricing than standard packages
• Legacy Product Premiums: Obsolete status affects pricing structure
• High I/O Value: 176 I/O pins provide cost-effectiveness for I/O-intensive applications
• Performance Positioning: Ideal for applications requiring 400MHz speed

Payment and Ordering Options

• Payment Methods: T/T (Bank wire), PayPal, Credit Cards, Western Union, Money Gram accepted
• Minimum Order Quantities: Starts from 1 piece for most distributors
• Warranty Options: Up to 365 days warranty from select suppliers
• Shipping Options: FedEx, DHL, UPS (4-5 days), registered airmail (14-38 days)

Value Proposition

• Cost-Effective I/O Density: High I/O count in compact package
• Proven Performance: Reliable 400MHz operation for demanding applications
• Design Investment Protection: Maintain existing Virtex-E design framework
• Legacy System Support: Ideal for sustaining critical applications

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3. Documents & Media

Technical Documentation

• Official Datasheet: Comprehensive XCV50E-7FG256C datasheet with complete electrical and timing specifications
• Virtex-E Family Documentation: Complete family data sheet including architectural overview and design guidelines
• Pin Configuration Guide: Detailed pinout for 256-FBGA package with comprehensive pin function descriptions
• Package Specifications: Mechanical drawings and assembly guidelines for 17×17mm FBGA package

Design Resources

• Application Notes: Proven design implementation guidelines and best practices for Virtex-E devices
• Reference Designs: Sample implementations demonstrating optimal utilization of 176 I/O pins
• Timing Models: Detailed timing specifications and constraints for 400MHz operation
• PCB Layout Guidelines: Board design recommendations for FBGA mounting and signal integrity

Development Environment

• ISE Design Suite: Primary development platform compatibility for Virtex-E family
• Legacy Tool Support: Specific ISE, Foundation™, and Alliance Series™ tool versions
• Programming Utilities: JTAG programming interfaces and configuration tools
• IP Core Libraries: Compatible intellectual property cores for accelerated development

FBGA Package Resources

• Assembly Guidelines: Surface mount assembly procedures for fine-pitch BGA
• Thermal Management: Thermal design considerations for FBGA package
• Signal Integrity: High-speed design guidelines for 400MHz operation
• Testing and Debug: Access methods and test strategies for BGA packages

Quality Documentation

• Manufacturing Data: Historical production specifications and test criteria
• Reliability Information: Long-term performance data and qualification reports
• Environmental Data: Operating conditions and storage specifications
• Package Integrity: BGA joint reliability and inspection procedures

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4. Related Resources

Legacy Development Tools

• ISE Design Suite: Primary development environment for Virtex-E family devices
• Foundation Series: Entry-level design tools for basic implementations
• Alliance Series: Advanced design tools for complex implementations
• ModelSim Integration: Simulation tool compatibility and project configuration

Family Alternatives and Package Variants

• XCV50E Package Options: Alternative configurations for different application needs
  • XCV50E-7PQ240I: 240-pin PQFP for through-hole assembly compatibility
  • XCV50E-7CS144C: 144-pin CSBGA for ultra-compact designs
  • XCV50E-7FG256I: Industrial temperature variant
• Speed Grade Variants: -6, -8 speed grades for different performance requirements
• Capacity Alternatives: XCV100E, XCV200E for higher logic density applications

Migration Pathways to Current Generation

• Spartan-7 Family: Contemporary cost-effective alternatives with enhanced features
• Artix-7 Family: Advanced performance and power efficiency improvements
• Kintex-7 Series: High-performance alternatives for demanding applications
• Zynq-7000 Series: System-on-chip alternatives with embedded ARM processing

Technical Support Resources

• Legacy Product Support: Limited manufacturer technical support for existing designs
• Community Resources: User forums and knowledge bases for troubleshooting
• Third-Party Services: Independent technical support and FBGA assembly services
• Design Migration Services: Professional migration assistance to current architectures

Primary Applications

Historical and Current Applications:

• Telecommunications Infrastructure: High-speed data processing and protocol handling requiring extensive I/O
• Industrial Automation: Complex control systems with multiple sensor and actuator interfaces
• Signal Processing Applications: Real-time digital signal processing with high I/O requirements
• Networking Equipment: Packet processing and traffic management with 400MHz performance
• Embedded Systems: High-performance embedded applications requiring extensive connectivity
• Test and Measurement: Instrumentation requiring high-speed data acquisition and processing
• Medical Imaging: Real-time image processing for diagnostic equipment
• Prototype Development: ASIC prototyping and custom logic circuit development

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5. Environmental & Export Classifications

Environmental Compliance Status

• RoHS Compliance: RoHS non-compliant (legacy product predating regulations)
• Material Composition: Standard semiconductor materials with lead-containing components
• Environmental Impact: Requires specialized electronic waste handling procedures
• Conflict Minerals: Predates current conflict mineral reporting requirements
• REACH Regulation: Subject to EU chemical safety requirements for legacy products

Package and Handling Specifications

• Package Type: 256-ball Fine-Pitch Ball Grid Array (FBGA) with 17×17mm dimensions
• Moisture Sensitivity: Standard semiconductor moisture precautions required
• ESD Protection: Electrostatic discharge protection essential during handling and assembly
• Storage Requirements: Controlled temperature and humidity environment
• Physical Protection: Anti-static packaging with proper cushioning for BGA protection

FBGA Assembly Considerations

• Surface Mount Technology: Requires professional SMT assembly capabilities
• Thermal Profile: Specific reflow soldering temperature profiles required
• Ball Grid Inspection: X-ray inspection recommended for solder joint quality verification
• Rework Capabilities: Specialized BGA rework equipment necessary for repairs
• Assembly Yield: High-precision placement equipment required for optimal yield

Thermal Management and Design Considerations

• Operating Temperature: 0°C ~ 85°C (TJ) commercial temperature range
• Thermal Design: FBGA package provides good thermal conduction to PCB
• Power Dissipation: 1.8V operation optimized for thermal efficiency
• Heat Spreading: PCB thermal design considerations for 400MHz operation
• Thermal Interface: Direct thermal path through package substrate

Export Control Classifications

• ECCN Classification: Subject to US Export Administration Regulations
• Technology Category: Standard programmable logic device classification
• End-Use Applications: General-purpose programmable logic applications
• Documentation Requirements: Standard export documentation for international shipments
• Destination Verification: Verify current export restrictions for specific countries

Quality and Manufacturing Standards

• Legacy Manufacturing: Produced under ISO quality management systems
• Test Coverage: Comprehensive functional and parametric testing
• Package Quality: BGA ball attach and substrate reliability verification
• Lot Traceability: Manufacturing lot identification for quality control
• Field History: Proven reliability through extensive commercial deployment

Packaging and Distribution Standards

• Component Protection: Specialized anti-static packaging for BGA components
• Physical Handling: Careful handling procedures to protect fine-pitch balls
• Identification: Clear part marking and date code for inventory management
• Documentation: Technical documentation and quality certificates
• Shipping Protection: Appropriate packaging for mechanical protection during transport

Disposal and Recycling Considerations

• E-Waste Classification: Electronic component recycling through certified facilities
• Material Recovery: Semiconductor and precious metal recovery programs
• Environmental Responsibility: Proper disposal per local environmental regulations
• Lead Content Disclosure: Environmental disclosure for lead-containing materials
• Component Recycling: Specialized recycling procedures for BGA packages

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Legacy Product Management Considerations

FBGA Package Advantages

• High I/O Density: 176 I/O pins in compact 17×17mm footprint
• Signal Integrity: Excellent electrical performance for high-speed applications
• Thermal Performance: Superior heat dissipation compared to traditional packages
• Space Efficiency: Minimal PCB real estate for given I/O count
• Electrical Performance: Short interconnect paths for optimal signal quality

Design and Assembly Challenges

• Assembly Complexity: Requires specialized SMT equipment and expertise
• Testing Access: Limited physical access for traditional probing methods
• Rework Difficulty: Complex procedures for component replacement
• Inspection Requirements: X-ray inspection necessary for quality verification
• Cost Considerations: Higher assembly and testing costs compared to traditional packages

Migration Benefits to Modern Alternatives

• Enhanced Logic Density: Significantly higher logic capacity in current generations
• Advanced I/O Standards: Support for latest high-speed interface protocols
• Power Efficiency: Dramatic power reduction with advanced process technologies
• Package Evolution: Modern packages with improved thermal and electrical characteristics
• Tool Integration: Enhanced design productivity with current development environments

Obsolescence Management Strategy

• Critical Application Assessment: Evaluate importance of existing designs using XCV50E-7FG256C
• Supply Chain Planning: Strategic inventory management for critical systems
• Alternative Evaluation: Assessment of modern FBGA alternatives with similar I/O density
• Migration Timeline: Development of transition plan to current-generation devices
• Cost-Benefit Analysis: Comparison of sustaining costs versus migration investment

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Summary

The XCV50E-7FG256C represents a high-performance, entry-level FPGA solution from Xilinx’s proven Virtex-E family, featuring 71,693 system gates, 1,728 logic cells, 176 I/O pins, and 400MHz operation in a compact 256-pin FBGA package. With its optimized 0.18μm CMOS technology and 1.8V operation, this device provides exceptional programmable logic capabilities for demanding applications requiring high I/O density and reliable performance.

Key advantages include the space-efficient FBGA packaging that maximizes I/O count in a minimal 17×17mm footprint, proven Virtex-E architecture reliability, and robust 400MHz performance for time-critical applications. The device’s 176 user I/O pins and advanced interconnect architecture make it particularly suitable for telecommunications infrastructure, industrial automation, signal processing, and embedded systems requiring extensive connectivity.

While this obsolete device offers proven performance characteristics and high I/O density for maintaining existing designs, its legacy status, RoHS non-compliance, and FBGA assembly complexity limit applicability for new commercial projects. Organizations utilizing the XCV50E-7FG256C should implement comprehensive obsolescence management strategies, including supply chain planning and migration timeline development.

For new designs, AMD Xilinx’s current FPGA families provide superior performance, advanced features, significantly higher logic density, and modern packaging options. The Spartan-7, Artix-7, and Kintex-7 families offer excellent migration paths with enhanced I/O capabilities, power efficiency, and comprehensive development tool support, ensuring optimal solutions for contemporary programmable logic requirements while providing long-term product support and advanced features for next-generation applications.