1. Product Specifications
Core Architecture
- Part Number: XCV600E-6FG680I
- Manufacturer: Xilinx (now AMD)
- Product Family: Virtex-E 1.8V FPGAs
- Speed Grade: -6 (Balanced performance grade)
- Temperature Grade: Industrial (I-temp: -40ยฐC to +100ยฐC)
- Logic Elements: 15,552 logic cells
- Configurable Logic Blocks (CLBs): 3,456 CLBs
- System Gates: 186.624K gates
Performance Specifications
- Maximum Clock Frequency: 357MHz
- Internal Performance: Up to 357MHz operation
- Process Technology: 0.18ฮผm CMOS technology
- Core Voltage: 1.8V ยฑ 5%
- Total RAM: 294,912 RAM bits
- Silicon Efficiency: Optimized architecture for place-and-route efficiency
Package Information
- Package Type: 680-Pin Fine-pitch Ball Grid Array (FBGA)
- Package Designation: FG680I (Industrial)
- Package Dimensions: 27mm ร 27mm (approximate)
- I/O Count: 512 user I/O pins (maximum in Virtex-E series)
- Pin Configuration: 680 total pins
- Mounting Type: Surface Mount Technology (SMT)
Industrial-Grade Features
- Extended Temperature Range: -40ยฐC to +100ยฐC operational
- Maximum I/O Connectivity: 512 I/O pins for extensive system integration
- Enhanced Reliability: Industrial qualification and testing standards
- Proven Architecture: Mature Virtex-E platform with comprehensive support
- Legacy Product Status: Obsolete/discontinued (Mouser lifecycle status)
- RoHS Status: Non-compliant (contains lead)
2. Pricing Information
Current Market Pricing (2025)
Distributor Stock Availability:
- IC-Components: 2,639 units available (new original)
- Xilinx-ADM: 2,639 units in stock
- SILITECH: 116 units available
- Mouser Electronics: Discontinued/Obsolete status
Market Characteristics:
- Industrial Premium: I-grade commands significant premium over commercial variants
- Maximum I/O Value: 680-pin package with 512 I/O represents highest connectivity
- Obsolete Product: Discontinued status affects pricing and long-term availability
- RFQ Required: Most suppliers require quotation for current pricing
Pricing Considerations:
- Industrial temperature range adds 20-30% premium over commercial grade
- Maximum I/O count (512 pins) justifies premium positioning
- Legacy/obsolete status may create pricing volatility
- Limited long-term availability affects strategic sourcing
Supply Chain Status:
- Multiple distributors maintain current inventory
- New, original factory-sealed components available
- Lead times may vary due to discontinued status
- Alternative sourcing recommended for new designs
Note: XCV600E-6FG680I pricing reflects industrial-grade specifications and maximum I/O connectivity. Contact multiple suppliers for competitive quotations due to obsolete product status.
3. Documents & Media
Technical Documentation
- Virtex-E Industrial Datasheet: Complete specifications for I-temp operation
- FG680I Package Specifications: Industrial-grade mechanical and thermal characteristics
- Maximum I/O Design Guidelines: 512 I/O pin utilization and routing strategies
- Speed Grade -6 Analysis: Timing specifications and performance optimization
Design Resources
- High I/O Count PCB Design: Layout guidelines for 680-pin industrial packages
- Signal Integrity Analysis: Managing 512 I/O pins in industrial environments
- Thermal Management: Heat dissipation for maximum I/O industrial applications
- Power Distribution: Multi-rail power design for 680-pin packages
Development Tools
- Xilinx ISE Design Suite: Primary development environment (legacy support)
- Industrial Design Flow: Temperature-aware timing analysis and constraints
- High I/O Optimization: Pin assignment and routing for maximum connectivity
- Legacy Migration Tools: Upgrade paths to modern FPGA families
Application Documentation
- Maximum I/O Applications: Design strategies for high-connectivity systems
- Industrial Infrastructure: Telecommunications and control system implementations
- Legacy System Support: Maintenance and upgrade documentation
- Obsolescence Planning: Alternative component selection and migration strategies
Quality Documentation
- Industrial Qualification: Extended temperature testing and reliability analysis
- Obsolescence Documentation: Product discontinuation and lifecycle information
- Reliability Standards: MTBF calculations for industrial environments
- Component Sourcing: Long-term availability and alternative sourcing strategies
4. Related Resources
Development Platforms
- Legacy Evaluation Boards: Virtex-E development platforms (limited availability)
- FG680 Breakout Systems: Industrial-grade access to all 512 I/O pins
- High I/O Reference Designs: Maximum connectivity application examples
- Educational Resources: Historical design methodology and best practices
Compatible Products & Alternatives
- Speed Grade Variants:
- XCV600E-7FG680I (Higher performance, industrial, limited availability)
- XCV600E-6FG680C (Commercial temperature: 0ยฐC to +85ยฐC)
- XCV600E-8FG680I (Maximum performance, extremely limited availability)
- Package Alternatives:
- XCV600E-6FG676I (Industrial, 676-pin, 444 I/O)
- XCV600E-6BG560I (Industrial, 560-pin, reduced I/O)
- XCV600E-6BG432I (Industrial, 432-pin, compact footprint)
- Migration Options:
- Modern AMD/Xilinx FPGA families with equivalent I/O count
- Pin-compatible newer generation devices
- Performance-equivalent contemporary solutions with migration support
Design Tools & Software
- Legacy Development:
- Xilinx ISE Design Suite (versions 10.1-14.7)
- Archived tool downloads and comprehensive documentation
- Legacy IP core libraries and design examples
- High I/O Design Tools:
- Advanced pin assignment and routing utilities
- Signal integrity analysis for maximum I/O applications
- Thermal analysis tools for industrial environments
- Migration Support:
- Design migration utilities to modern FPGA platforms
- I/O mapping and performance analysis tools
- Architecture comparison for upgrade planning
Technical Support Resources
- Legacy Product Support: AMD/Xilinx archived documentation and resources
- Industrial Applications: Specialized support for harsh environment designs
- Maximum I/O Consultation: Expert guidance for high-connectivity applications
- Obsolescence Management: Professional services for component lifecycle planning
Supply Chain Support
- Authorized Distributors: Network of certified legacy component suppliers
- Inventory Management: Real-time stock monitoring and availability forecasting
- Quality Verification: Counterfeit detection and component authentication
- Lifecycle Planning: Long-term availability assessment and alternative sourcing
5. Environmental & Export Classifications
Environmental Specifications
- Industrial Temperature Grade (I-temp):
- Operating Temperature: -40ยฐC to +100ยฐC
- Junction Temperature: Up to +125ยฐC maximum
- Storage Temperature: -65ยฐC to +150ยฐC
- Enhanced thermal qualification for industrial environments
- Extended Environmental Conditions:
- Humidity: 5% to 95% relative humidity, non-condensing
- Altitude: Up to 5,000 meters operational
- Thermal Shock: Qualified for rapid temperature transitions
- Vibration: Industrial-grade mechanical stress resistance
Physical Characteristics
- Industrial Package Specifications:
- Package Type: 680-FBGA (27mm ร 27mm approximate)
- Package Height: 2.8mm maximum
- Weight: Approximately 4.0 grams
- Ball Count: 680 solder balls
- Ball Pitch: Fine-pitch configuration for maximum density
- Thermal Performance:
- Thermal Resistance (ฮธJA): 12ยฐC/W (still air, typical)
- Enhanced thermal performance with proper heatsink design
- Industrial temperature optimization across full range
- Thermal interface requirements for sustained high-temperature operation
Power Requirements
- Supply Specifications:
- Core Voltage: 1.8V ยฑ 5% (industrial tolerance)
- I/O Voltages: Variable by bank (1.2V to 3.3V)
- Enhanced power supply rejection for industrial environments
- Maximum I/O power considerations for 512-pin connectivity
- Power Consumption:
- Speed grade -6 optimized for balanced power efficiency
- Temperature-dependent power characteristics across -40ยฐC to +100ยฐC
- Industrial power management for sustained operation
- Dynamic power scaling for maximum I/O utilization
Compliance & Certifications
- Industrial Standards:
- IEC 61000 electromagnetic compatibility
- Industrial electronics qualification standards
- Extended temperature testing and validation procedures
- Vibration and mechanical shock resistance certification
- Environmental Compliance:
- RoHS Status: Non-compliant (contains lead and restricted substances)
- REACH Regulation: EU chemical safety compliance with restrictions
- WEEE Directive: Electronic waste disposal guidelines and procedures
- Conflict Minerals: Industry standard reporting and compliance
Export Control Information
- Enhanced Export Classification:
- ECCN: 3A991.d (subject to Export Administration Regulations)
- USHTS: 8542390001 (U.S. Harmonized Tariff Schedule)
- TARIC: 8542399000 (EU tariff classification)
- Industrial Use: Standard commercial export procedures with enhanced documentation
- Documentation Requirements:
- Industrial export documentation and end-use certification
- Maximum I/O applications may require additional scrutiny
- Compliance with international trade regulations and restrictions
- Industrial supply chain verification and traceability
Quality & Reliability Standards
- Industrial Qualification:
- Extended temperature cycling: -65ยฐC to +150ยฐC (1000+ cycles)
- Industrial reliability testing across full temperature range
- Enhanced quality assurance for harsh environment applications
- Maximum I/O pin reliability testing and validation
- Reliability Metrics:
- MTBF: Enhanced calculations for industrial environments
- FIT Rate: Industrial environment specifications across temperature range
- Quality Standards: Industrial electronics industry requirements
- Failure Analysis: Industrial environment failure modes and prevention
Environmental Impact
- Sustainable Design:
- Long operational life reduces replacement frequency in industrial applications
- Energy-efficient CMOS technology optimized for industrial environments
- Recyclable packaging materials and responsible disposal procedures
- Industrial lifecycle optimization for extended service life
Moisture Sensitivity
- MSL Rating: Moisture Sensitivity Level 3
- Floor Life: 168 hours at 30ยฐC/60% RH
- Enhanced moisture barrier packaging for industrial storage
- Baking Requirements: 125ยฐC for 24 hours if MSL exceeded
- Industrial handling procedures and environmental controls
Applications
The XCV600E-6FG680I excels in industrial applications requiring maximum I/O connectivity:
Telecommunications Infrastructure:
- Central office switching equipment with maximum connectivity requirements
- Base station control systems requiring extensive I/O interfaces
- High-capacity routers and switching systems in harsh environments
- Outdoor telecommunications equipment in extreme climates
Industrial Automation & Control:
- Large-scale manufacturing automation systems with extensive sensor networks
- Process control systems requiring maximum I/O connectivity
- Multi-axis motion control systems with complex interfacing requirements
- Industrial monitoring and data acquisition across multiple subsystems
Aerospace & Defense:
- Avionics systems requiring maximum I/O for comprehensive sensor integration
- Radar and communication systems with extensive signal processing
- Flight control systems with redundant I/O requirements
- Ground support equipment in extreme environmental conditions
Transportation Systems:
- Railway signaling and control systems with extensive track interfacing
- Traffic management systems requiring maximum connectivity
- Marine navigation and control systems in harsh maritime environments
- Airport ground support equipment with comprehensive I/O requirements
Legacy System Integration:
- Replacement components for existing high I/O count designs
- System upgrades requiring maximum connectivity preservation
- Long-term support for critical infrastructure applications
- Bridge solutions for transitioning to modern FPGA architectures
Design Considerations
Maximum I/O Advantages:
- 512 I/O pins provide highest connectivity in Virtex-E family
- Proven architecture for high I/O count applications
- Industrial temperature range ensures reliable operation in harsh environments
- Extensive legacy support and documented design methodologies
Industrial Temperature Benefits:
- Reliable operation from -40ยฐC to +100ยฐC for extreme environments
- Enhanced qualification testing for industrial applications
- Proven performance in telecommunications and aerospace applications
- Cost-effective solution for extended temperature requirements
Obsolescence Considerations:
- Discontinued product status requires careful lifecycle planning
- Limited long-term availability necessitates strategic inventory management
- Migration planning to modern FPGA families recommended for new projects
- Alternative sourcing strategies essential for long-term sustainability
Implementation Guidelines:
- Industrial-grade PCB materials and assembly processes for 680-pin package
- Advanced thermal management for maximum I/O utilization in extreme temperatures
- Robust power distribution design for 512 I/O pins across temperature range
- Signal integrity considerations for high-speed, high I/O count applications
Conclusion
The XCV600E-6FG680I provides the ultimate solution for industrial applications requiring maximum I/O connectivity and extended temperature operation. With its 512 I/O pins, proven 357MHz performance, and industrial-grade -40ยฐC to +100ยฐC qualification, this Virtex-E FPGA represents the pinnacle of connectivity and reliability for demanding industrial applications. While representing an obsolete product requiring careful lifecycle management, its established architecture, maximum I/O capability, and extensive documentation ensure continued viability for critical industrial systems requiring proven performance in harsh environments. Strategic migration planning to modern FPGA families is recommended for new designs while leveraging this device for maintaining and upgrading existing high-connectivity industrial systems.
