1. Product Specifications
Core Architecture Details
- Device Family: Xilinx Virtex-E Series
- Part Number: XCV1000E-8FG680C
- System Gates: 1,000,000 equivalent gates
- Speed Grade: -8 (premium performance grade)
- Package Type: FG680 (680-pin Fine-pitch Ball Grid Array)
- Temperature Grade: Commercial (0ยฐC to +85ยฐC)
Logic Resources
- Configurable Logic Blocks (CLBs): 3,456 CLBs
- Logic Cells: Approximately 27,648 equivalent logic cells
- Flip-Flops: 55,296 D-type flip-flops
- 4-input Look-Up Tables (LUTs): 27,648 LUTs
- Maximum User I/O Pins: 512 user I/O pins
- Differential I/O Pairs: 256 differential pairs
Advanced Features
- Block RAM: 320 Kbits total embedded block RAM
- Distributed RAM: Configurable through CLB LUTs
- Dedicated Multipliers: 18×18 signed multiplier blocks
- Digital Clock Managers (DCMs): Up to 8 DCM units
- Global Clock Networks: 16 global clock lines
Performance Specifications
- Maximum System Frequency: 200+ MHz (design dependent)
- Core Voltage: 1.8V ยฑ5%
- I/O Voltage: 1.2V to 3.3V (selectable by bank)
- Power Consumption: Varies by utilization and frequency
- Propagation Delay: Sub-nanosecond internal routing
Package Characteristics
- Pin Count: 680 pins total
- Ball Pitch: 1.0mm
- Package Dimensions: 27mm x 27mm
- Thermal Resistance: ฮธJA = 15ยฐC/W (with heat sink)
2. Price Information
The XCV1000E-8FG680C pricing varies based on market conditions, order quantities, and supplier relationships:
Pricing Structure
- Single Unit Price: Contact authorized distributors
- Volume Pricing: Significant discounts available for 25+ units
- Annual Contract Pricing: Custom pricing for high-volume customers
- Educational Pricing: Special rates for academic institutions
Availability Information
- Standard Lead Time: 12-20 weeks ARO (After Receipt of Order)
- Expedited Options: Rush delivery available with premium
- Stock Programs: Some distributors maintain inventory
- End-of-Life Status: Contact Xilinx for product lifecycle information
Pricing is dynamic and subject to market conditions. Contact authorized Xilinx distributors for current quotes and availability.
3. Documents & Media
Technical Documentation
- Complete Data Sheet: Electrical specifications and timing parameters
- User Guide: Comprehensive design implementation manual
- Package/Pinout Information: Detailed pin assignments and mechanical drawings
- Migration Guide: Design porting instructions from other Virtex devices
- Characterization Reports: Performance validation data
- Quality and Reliability Reports: Long-term reliability studies
Design Resources
- Application Notes: Best practices and design techniques
- Reference Designs: Proven implementation examples
- White Papers: Advanced design methodologies
- Video Tutorials: Step-by-step implementation guides
- Webinar Recordings: Expert-led technical presentations
Simulation Models
- IBIS Models: Signal integrity simulation models
- SPICE Models: Detailed electrical circuit models
- Timing Models: Setup and hold time specifications
- Power Models: Dynamic and static power estimation
Software Documentation
- ISE Design Suite Guide: Tool-specific documentation
- Constraints Guide: Timing and placement constraint examples
- Libraries Guide: Available IP core documentation
4. Related Resources
Development Environment
- Xilinx ISE Design Suite: Primary FPGA development platform
- Vivado Design Suite: Next-generation design tools (migration path)
- ChipScope Pro: Integrated logic analyzer for debugging
- System Generator: MATLAB/Simulink integration tools
- EDK (Embedded Development Kit): Embedded processor design tools
Evaluation and Development Boards
- ML310 Development Board: Complete Virtex-E development platform
- Custom Carrier Boards: Application-specific development solutions
- Prototyping Platforms: Rapid proof-of-concept development
- Socket Boards: Device programming and testing solutions
Compatible IP Cores
- Communication Cores: Ethernet, PCI, USB, and serial protocols
- DSP Cores: FFT, FIR filters, and signal processing functions
- Memory Controllers: DDR, SRAM, and Flash memory interfaces
- Processor Cores: Soft-core and hard-core processor options
- Video Processing: Image and video processing IP blocks
Support Services
- Technical Support Portal: 24/7 online support access
- Application Engineering: Direct engineering consultation
- Training Services: Comprehensive FPGA design courses
- Design Review Services: Expert design validation
- Hotline Support: Phone-based technical assistance
Partner Ecosystem
- Certified Design Partners: Verified service providers
- Tool Partners: Third-party EDA tool integration
- IP Partners: Additional intellectual property providers
- Board Partners: Custom PCB design services
5. Environmental & Export Classifications
Environmental Compliance Standards
- RoHS Directive Compliant: Lead-free manufacturing processes
- WEEE Directive Compliant: Waste electrical equipment regulations
- REACH Regulation: EU chemical substance compliance
- Conflict Minerals Compliant: Responsible sourcing certified
- Green Product Classification: Environmentally conscious manufacturing
Operating Environmental Conditions
- Commercial Temperature Range: TJ = 0ยฐC to +85ยฐC
- Industrial Temperature Range: Extended options available
- Storage Temperature: -65ยฐC to +150ยฐC
- Operating Humidity: 10% to 95% non-condensing
- Altitude: Sea level to 2000 meters operational
Export Control Classifications
- ECCN (Export Control Classification Number): Verify current classification
- Schedule B Number: 8542.31.0001
- Country of Origin: Check device marking for specific origin
- Export License Requirements: Varies by destination country
- Dual-Use Technology: Subject to export administration regulations
Quality and Reliability Standards
- ISO 9001:2015: Quality management system certified
- ISO 14001: Environmental management system
- IATF 16949: Automotive quality management (where applicable)
- AS9100D: Aerospace quality standard compliance
- IPC Standards: PCB assembly and soldering compliance
Package and Handling Classifications
- Moisture Sensitivity Level (MSL): MSL 3 classification
- Bake Conditions: 125ยฐC for 24 hours if required
- ESD Classification: Class 1C (>1000V HBM)
- Latch-up Rating: Class II (>100mA)
- Handling Precautions: Standard ESD protection required
Regulatory Certifications
- FCC Part 15: Electromagnetic compatibility
- CE Marking: European conformity standards
- UL Recognition: Safety standard compliance
- CSA Certification: Canadian safety standards
The XCV1000E-8FG680C delivers exceptional performance and flexibility for advanced FPGA applications, providing designers with the resources needed to implement complex digital systems efficiently. With its robust feature set and comprehensive support ecosystem, this device represents an excellent choice for demanding applications requiring high logic capacity and superior performance.
For the most current technical specifications, compliance information, and pricing, consult official Xilinx documentation and authorized distributors.
