Product Specifications
Core Architecture Features
- Device Family: Xilinx Virtex-E Series
- Part Number: XCV50E-FG256
- System Gates: 50,000 equivalent gates
- Configurable Logic Blocks (CLBs): 576 logic cells
- User I/O Pins: 176 available I/O pins
- Package Type: FG256 (Fine-Pitch Ball Grid Array)
- Package Size: 17mm x 17mm compact footprint
- Ball Pitch: 1.0mm fine-pitch array
Memory Architecture
- Block RAM: 32 Kbits total embedded block memory
- Block RAM Modules: 4 dedicated memory blocks
- Distributed RAM: User-configurable from CLB resources
- Configuration Storage: SRAM-based for fast reconfiguration
- Memory Interface: Dual-port capability for enhanced performance
Performance Characteristics
- Maximum System Frequency: Up to 180 MHz (design dependent)
- Core Voltage: 2.5V internal logic supply
- I/O Voltage: 3.3V standard (multiple standards supported)
- Propagation Delay: Optimized for high-speed applications
- Power Consumption: Low-power design for extended operation
Advanced Features
- Clock Management: Integrated Delay Locked Loop (DLL)
- I/O Standards: Support for LVDS, LVCMOS, GTL, SSTL, and more
- Boundary Scan: IEEE 1149.1 JTAG compliance
- Carry Chain Logic: Dedicated arithmetic processing
- Routing Resources: Advanced interconnect architecture
- Hot-Swap Support: Live insertion/removal capability
Pricing Information
Current Market Pricing for XCV50E-FG256
Quantity-Based Pricing Tiers:
- Single Units (1-9 pieces): Premium pricing for prototyping
- Small Batch (10-49 units): Development quantity discounts
- Medium Volume (50-249 units): Production quantity pricing
- Large Volume (250+ units): Maximum volume discounts available
Authorized Distribution Channels
- Digi-Key Electronics: Comprehensive inventory and fast shipping
- Mouser Electronics: Technical support and design resources
- Arrow Electronics: Volume pricing and supply chain solutions
- Avnet: Design services and technical consultation
- Newark/Farnell: Global distribution network
Pricing Factors
- Market demand and silicon availability
- Package and speed grade variations
- Lead times and delivery requirements
- Geographic location and import duties
For current XCV50E-FG256 pricing quotes, contact authorized distributors directly with your specific quantity and delivery requirements.
Documents & Media
Technical Documentation Package
- Product Datasheet: Complete electrical and timing specifications
- User Guide: Comprehensive design implementation manual
- Application Notes: Design methodologies and best practices
- Errata Documentation: Known issues and recommended workarounds
- Migration Guide: Upgrade paths and compatibility information
Design Support Resources
- Pin-out Files: Detailed package and signal assignments
- IBIS Models: Signal integrity simulation and analysis
- Package Models: Thermal and mechanical characteristics
- PCB Layout Guidelines: Board design recommendations
- Power Analysis Tools: Consumption estimation utilities
Software and Development Tools
- Xilinx ISE Design Suite: Professional FPGA development environment
- WebPACK Edition: Free development tools for education and small projects
- ChipScope Pro: Real-time debugging and signal analysis
- System Generator: MATLAB/Simulink integration platform
- EDK (Embedded Development Kit): Embedded processor design tools
Video and Training Materials
- Design Tutorial Videos: Step-by-step implementation guides
- Webinar Recordings: Technical deep-dives and best practices
- Training Courses: Comprehensive FPGA design education
- Conference Presentations: Latest technology updates and trends
Related Resources
Development and Evaluation Platforms
- Xilinx Virtex-E Evaluation Boards: Ready-to-use development platforms
- Third-Party Development Kits: Compatible evaluation and prototyping systems
- Reference Design Boards: Application-specific implementation examples
- Breadboard-Compatible Modules: Rapid prototyping solutions
Compatible Product Ecosystem
- XCV100E-FG256: Pin-compatible higher-capacity alternative
- XCV300E Series: Expanded logic resources for complex designs
- Spartan-II Family: Cost-optimized solutions for volume applications
- Configuration Devices: XC18V series PROM and Flash solutions
IP Core Library
- DSP Cores: Digital signal processing building blocks
- Communication Cores: Protocol stacks and interface controllers
- Memory Controllers: DDR, SDRAM, and SRAM interfaces
- Processor Cores: Soft-core CPU implementations
- Interface Cores: PCI, USB, Ethernet, and serial communication
Technical Support Services
- Xilinx Community Forums: Peer-to-peer technical discussions
- Application Engineering: Direct technical support and consultation
- Design Services Network: Certified partner design assistance
- Training and Certification: Professional development programs
Design Tools and Utilities
- Synthesis Tools: Logic optimization and implementation
- Simulation Software: Functional and timing verification
- Hardware Debuggers: In-system debugging capabilities
- Performance Analysis: Timing and resource utilization tools
Environmental & Export Classifications
Environmental Compliance Standards
- RoHS Directive Compliance: Lead-free package options available
- WEEE Regulation: Electronic waste management compliance
- REACH Compliance: Chemical safety requirements satisfied
- Conflict Minerals: Responsible sourcing certification
- Green Manufacturing: Environmentally conscious production processes
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- Schedule B Number: 8542.39.0001 for US exports
- HTS (Harmonized Tariff Schedule): 8542.39.0001 for imports
- Country of Origin: Varies by manufacturing facility location
- Export License Requirements: Destination-dependent restrictions
Quality and Reliability Standards
- Manufacturing Quality: ISO 9001:2015 certified facilities
- Temperature Grade: Commercial (0ยฐC to +85ยฐC) standard
- Moisture Sensitivity Level: MSL 3 per JEDEC J-STD-020
- Qualification Standards: AEC-Q100 automotive grade available
- Reliability Testing: Comprehensive stress and burn-in procedures
Package and Handling Information
- ESD Sensitivity: Class 1 electrostatic discharge sensitive
- Storage Conditions: Controlled temperature and humidity requirements
- Shelf Life: Moisture barrier bag protection for extended storage
- Packaging Options: Anti-static tray and tape & reel formats
- Lead-Free Compatibility: Compatible with lead-free soldering processes
International Certifications
- CE Marking: European conformity declaration
- FCC Part 15: Electromagnetic interference compliance
- IC (Industry Canada): Canadian electromagnetic compatibility
- VCCI (Japan): Voluntary Control Council for Interference
- CCC (China): China Compulsory Certification where applicable
Key Applications
The XCV50E-FG256 delivers exceptional performance across diverse application domains:
Communications and Networking
- Wireless base station processing
- Network packet classification and filtering
- Protocol processing and conversion
- Software-defined radio implementations
Industrial and Automation
- Real-time control systems
- Machine vision and image processing
- Sensor interface and data acquisition
- Motor control and power management
Consumer and Multimedia
- Digital video processing and compression
- Audio signal processing and enhancement
- Gaming and entertainment systems
- Set-top box and multimedia applications
Test and Measurement
- High-speed data acquisition systems
- Signal generation and analysis equipment
- Automated test equipment (ATE)
- Laboratory instrumentation
Why Choose XCV50E-FG256?
Technical Advantages
- Proven Architecture: Time-tested Virtex-E platform reliability
- Optimal Gate Count: Perfect balance for mid-complexity designs
- Compact Package: Space-efficient 17mm x 17mm footprint
- Flexible I/O: 176 pins supporting multiple interface standards
- Cost-Effective: Excellent price-performance ratio
Design Benefits
- Rapid Prototyping: Fast design iteration and verification
- Field Upgradeable: In-system reconfiguration capability
- Design Security: Configuration encryption options
- Long-Term Support: Established product with reliable supply chain
- Comprehensive Tools: Complete development ecosystem support
Technical Support and Ordering
For detailed technical specifications, current pricing, and ordering information for the XCV50E-FG256, contact your regional Xilinx authorized distributor or visit the official Xilinx product documentation portal for the most up-to-date resources and support materials.
This comprehensive product overview covers the essential aspects of the XCV50E-FG256 FPGA. For the latest technical updates, design resources, and support information, refer to official Xilinx documentation and authorized distribution partners.
