1. Product Specifications
Core Architecture
- Device Family: Xilinx Virtex-E 1.8V FPGAs
- Part Number: XCV600E-7HQ240I
- Temperature Grade: Industrial (“I” suffix, -40ยฐC to +100ยฐC)
- System Gates: 985,882 gates
- Logic Gates: 186,624 gates
- Logic Cells: 15,552 cells
- Configurable Logic Blocks (CLBs): 3,456
- Maximum Internal Performance: 400MHz (-7 speed grade)
- Process Technology: 0.18ฮผm CMOS, 6-layer metal
Memory and Storage Resources
- Total RAM Bits: 294,912 bits
- Block RAM: Multiple embedded memory blocks
- Distributed RAM: Flexible memory implementation using CLBs
- Configuration: SRAM-based for unlimited reprogrammability
- Memory Controllers: Built-in memory interface capabilities
Package Information
- Package Type: 240-pin Heat-Sink Quad Flat Package (HQFP)
- Package Designation: HQ240
- Package Dimensions: 40mm x 40mm body size
- Pin Pitch: 0.8mm lead spacing
- Lead Count: 240 leads
- User I/O Pins: 158 user I/O pins
- Thermal Enhancement: Heat-sink compatible for improved thermal management
Electrical Characteristics
- Core Voltage: 1.8V ยฑ5% (1.71V to 1.89V)
- I/O Voltage Range: Multiple standards (1.5V to 3.3V)
- Operating Temperature: Industrial (-40ยฐC to +100ยฐC)
- Storage Temperature: -65ยฐC to +150ยฐC
- Speed Grade: -7 (400MHz maximum frequency)
- Junction Temperature: Up to +125ยฐC
- Power Consumption: Optimized for industrial applications
Industrial-Grade Features
- Extended Temperature Range: -40ยฐC to +100ยฐC operation
- Enhanced Reliability: Industrial qualification and screening
- Improved MTBF: Mean Time Between Failures for industrial use
- Thermal Cycling: Resistant to temperature fluctuations
- Vibration Resistance: Qualified for mechanical stress environments
- Humidity Tolerance: Enhanced moisture resistance specifications
Advanced FPGA Features
- Delay-Locked Loops (DLLs): 4 fully digital DLLs for clock management
- Clock Networks: Global and regional clock distribution
- Dedicated Carry Logic: High-speed arithmetic operations
- SelectI/O+ Technology: 16 high-performance I/O standards
- IEEE 1149.1 Boundary Scan: Complete test and debug support
- PCI Interface Support: Compatible with PCI bus standards
- On-Chip RAM: Configurable memory blocks for data storage
2. Pricing Information
Current Market Pricing (2025)
- Typical Market Range: $85 – $250 USD (varies by supplier and quantity)
- Industrial Premium: 20-40% higher than commercial grade equivalents
- Minimum Order Quantity: Usually 1 piece minimum
- Volume Pricing: Significant discounts for quantities >50 pieces
- Lead Time: 2-8 weeks depending on supplier and availability
Pricing Factors
- Industrial Qualification: Premium pricing for extended temperature range
- Speed Grade: -7 speed grade commands higher pricing than slower variants
- Package Type: HQFP package typically costs less than BGA alternatives
- Supply Constraints: Limited availability affects market pricing
- Supplier Type: Authorized vs. secondary market pricing variations
Current Availability Status
- Market Status: Limited availability due to obsolete product status
- Stock Sources: Secondary market and distributor excess inventory
- Quality Assurance: Industrial-grade screening and testing available
- Warranty Options: Varies by supplier (typically 1 year for new parts)
- Alternative Sources: Multiple distributors with varying stock levels
Cost Comparison with Alternatives
- XCV600E-7HQ240C: Commercial grade alternative (0ยฐC to +85ยฐC)
- XCV600E-6HQ240I: Lower speed grade option for cost savings
- Modern Equivalents: Migration to current FPGAs may reduce long-term costs
Note: The XCV600E-7HQ240I is now classified as obsolete by AMD (formerly Xilinx). Industrial-grade variants typically command premium pricing due to their extended qualification and limited availability through specialized distributors.
3. Documents & Media
Official Technical Documentation
- Primary Datasheet: Virtex-E 1.8V Field Programmable Gate Arrays (DS022-1 v2.3)
- Industrial Specifications: Extended temperature qualification data
- Package Documentation: HQ240 package mechanical drawings and specifications
- Pinout Information: Complete pin assignment and signal descriptions
- Thermal Characteristics: Junction-to-ambient thermal resistance data
Industrial Design Resources
- Thermal Design Guidelines: Heat-sink selection and thermal management
- PCB Layout Recommendations: High-reliability layout practices
- Environmental Testing: Temperature cycling and stress testing data
- Reliability Reports: MTBF calculations and failure rate analysis
- Industrial Application Notes: Design practices for harsh environments
Software and Development Tools
- ISE Design Suite: Legacy development environment with industrial support
- PACE Pinout Tool: Pin assignment and constraints editor
- Timing Analysis: Industrial temperature timing derating information
- Power Estimation: Industrial-grade power consumption calculations
- Configuration Tools: Programming and configuration for industrial use
Quality and Compliance Documentation
- Industrial Qualification: Temperature cycling and environmental testing
- Quality Certifications: ISO 9001 and industrial quality standards
- Reliability Data: Accelerated life testing and qualification reports
- RoHS Compliance: Environmental compliance documentation
- Conflict Minerals: Supply chain compliance reporting
Technical Support Resources
- Migration Guides: Upgrade paths to modern industrial FPGAs
- Thermal Simulation: Junction temperature calculation tools
- Industrial Design Methodology: Best practices for harsh environment designs
- Troubleshooting Guides: Industrial application specific issues and solutions
4. Related Resources
Temperature Grade Alternatives
- XCV600E-7HQ240C: Commercial grade (-0ยฐC to +85ยฐC)
- XCV600E-7HQ240M: Military grade (-55ยฐC to +125ยฐC) if available
- XCV600E-6HQ240I: Industrial grade with -6 speed grade (357MHz)
- XCV600E-8HQ240I: Industrial grade with -8 speed grade (if available)
Package Alternatives (Same Die, Industrial Grade)
- XCV600E-7BG432I: 432-pin BGA industrial package
- XCV600E-7BG560I: 560-pin BGA industrial package
- XCV600E-7FG680I: 680-pin FBGA industrial package
- XCV600E-7FG676I: 676-pin FBGA industrial package
Speed Grade Variants (HQ240 Package)
- XCV600E-6HQ240I: -6 speed grade (357MHz, industrial temperature)
- XCV600E-5HQ240I: -5 speed grade (lower performance, better availability)
- XCV600E-4HQ240I: -4 speed grade (cost-optimized option)
Modern Industrial FPGA Alternatives
- Artix-7 Industrial: XC7A100T-I, XC7A200T-I series
- Kintex-7 Industrial: Higher performance industrial options
- Spartan-7 Industrial: Cost-optimized modern alternatives
- Automotive-Grade FPGAs: AEC-Q100 qualified for automotive use
Industrial Development Platforms
- Industrial Evaluation Boards: Ruggedized development platforms
- Environmental Test Chambers: Temperature cycling test equipment
- Thermal Analysis Tools: Junction temperature monitoring equipment
- Industrial Connectors: Harsh environment connector systems
Industrial Applications and Markets
- Automotive Electronics: Engine control, safety systems, infotainment
- Aerospace and Defense: Avionics, radar systems, communications
- Industrial Automation: Process control, robotics, machine vision
- Telecommunications: Base stations, infrastructure equipment
- Medical Equipment: Imaging systems, patient monitoring, diagnostics
Technical Support Networks
- Industrial FPGA Specialists: Engineers experienced with harsh environment designs
- Thermal Management Consultants: Heat-sink and cooling system experts
- Reliability Engineers: Industrial qualification and testing specialists
- Component Lifecycle Management: Obsolescence planning and migration services
5. Environmental & Export Classifications
Industrial Environmental Compliance
- Operating Temperature Range: -40ยฐC to +100ยฐC (industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Junction Temperature: Up to +125ยฐC maximum
- Thermal Cycling: Qualified for -40ยฐC to +100ยฐC cycling
- Humidity Range: 5% to 95% relative humidity, non-condensing
- Vibration Resistance: MIL-STD-883 qualification standards
- Shock Resistance: Industrial-grade mechanical stress qualification
Chemical and Material Compliance
- RoHS Compliance: Available in both lead-free and tin/lead variants
- Lead-Free Status: Pb-free options for modern environmental requirements
- REACH Compliance: European chemical safety regulation compliance
- Conflict Minerals: Full supply chain traceability and reporting
- Halogen-Free: Available in halogen-free package variants
- Material Composition: Complete material declaration available
Export Control and Trade Classifications
- ECCN: 3A991.d (Export Control Classification Number)
- HTS Code: 8542.39.0001 (Harmonized Tariff Schedule)
- USHTS: 8542390001 (US Harmonized Tariff Schedule)
- TARIC: 8542399000 (EU Integrated Tariff)
- Country of Origin: Varies by manufacturing location and date code
- Export Licensing: May require export permits for certain destinations
- Dual-Use Technology: Subject to international trade regulations
Industrial Quality and Reliability Standards
- Quality Level: Industrial grade with enhanced qualification
- Qualification Standards: MIL-STD-883, JEDEC, and Xilinx industrial standards
- Reliability Testing: Extended temperature cycling, HTOL, and stress testing
- MTBF Calculations: Industrial-grade Mean Time Between Failures data
- Lot Traceability: Complete manufacturing history and test data
- Quality Certifications: ISO 9001, ISO 14001 manufacturing compliance
Package and Handling Requirements
- ESD Sensitivity: Class 1 (โค1000V Human Body Model)
- Moisture Sensitivity: MSL-3 (Moisture Sensitivity Level 3)
- Baking Requirements: 125ยฐC for 24 hours if MSL exceeded
- Anti-Static Protection: ESD protection required throughout handling
- Storage Conditions: Controlled temperature and humidity environment
- Shipping Requirements: Anti-static packaging and environmental protection
Industrial Assembly and Manufacturing
- Solder Process Compatibility: Lead-free and eutectic solder processes
- Reflow Temperature Profile: Industrial-grade temperature cycling
- Rework Capability: Supports standard HQFP rework procedures
- Quality Inspection: AOI and functional testing for industrial applications
- Heat-Sink Mounting: Compatible with standard heat-sink attachment methods
- Thermal Interface Materials: TIM compatibility for enhanced thermal management
Key Benefits of XCV600E-7HQ240I
Industrial-Grade Reliability
- Extended Temperature Operation: -40ยฐC to +100ยฐC for harsh environments
- Enhanced MTBF: Industrial qualification ensures reliable long-term operation
- Thermal Cycling Resistance: Qualified for temperature fluctuation environments
- Vibration and Shock Tolerance: Suitable for mobile and industrial applications
Compact HQFP Package Advantages
- Space Efficiency: 240-pin HQFP package optimizes board space utilization
- Thermal Management: Heat-sink compatible package for enhanced cooling
- Assembly Friendly: Standard HQFP assembly processes and equipment
- Cost-Effective: Lower assembly costs compared to BGA packages
Performance and Functionality
- High-Speed Operation: 400MHz internal performance for demanding applications
- Substantial Logic Capacity: Nearly 1 million system gates for complex designs
- Flexible I/O: 158 user I/O pins with industrial-grade drive capability
- Robust Clock Management: Multiple DLLs for industrial timing requirements
Industrial Application Suitability
- Automotive Systems: AEC-Q100 style qualification for automotive applications
- Aerospace and Defense: Suitable for avionics and military systems
- Industrial Control: Process control and automation system compatibility
- Infrastructure: Telecommunications and base station applications
Design and Development Benefits
- Proven Technology: Mature platform with extensive design resources
- Legacy Support: Maintains compatibility with existing industrial designs
- Migration Path: Clear upgrade options to modern industrial FPGAs
- Technical Support: Specialized industrial FPGA design expertise available
For detailed specifications, current availability, or pricing information regarding the XCV600E-7HQ240I industrial-grade FPGA, please contact specialized industrial component distributors or Xilinx-certified suppliers. Due to the obsolete status of this product, we recommend evaluating modern industrial FPGA alternatives for new designs while ensuring continued support for existing industrial systems requiring this specific component.
