1. Product Specifications
Core Technical Specifications
- Part Number: XC5215PQ160A
- Manufacturer: Xilinx Inc.
- Product Family: XC5200 FPGA Family
- Device Classification: Field Programmable Gate Array (FPGA)
- Logic Capacity: 23,000 gates equivalent (maximum XC5200 family capacity)
- Logic Cells: 1,936 configurable logic cells (CLBs)
- Maximum Operating Frequency: 83MHz (device performance capability)
- Process Technology: 0.5ฮผm three-layer metal CMOS
- Supply Voltage: 5V ยฑ5% (single supply operation)
- Package Type: 160-Pin PQ (Plastic Quad Flat Package)
- Package Variant: A designation (standard qualification)
- Temperature Range: Commercial temperature specifications
- Speed Grades: Multiple performance options available
Compact PQFP Package Specifications
- Package Designation: PQ160A (Compact 160-pin PQFP)
- Total Pin Count: 160 pins (optimal density-to-size ratio)
- User I/O Pins: Up to 120 user-configurable I/O pins
- Pin Pitch: 0.65mm (fine pitch for compact design)
- Package Dimensions: 28mm x 28mm x 3.4mm (space-efficient profile)
- Lead Style: Gull-wing leads for reliable surface mount assembly
- Package Material: Plastic molding compound with copper lead frame
- Package Weight: Approximately 1.8 grams
- Footprint Efficiency: Maximum logic density per board area
Advanced Architecture Features
- VersaBlock Logic Architecture: Optimized for maximum utilization in compact designs
- VersaRing I/O Interface: High-performance I/O with flexible standards support
- SRAM-Based Configuration: Fast reconfiguration and in-system programming
- Hierarchical Interconnect: Multi-level routing for complex signal paths
- Distributed Memory: Embedded RAM and ROM within configurable logic
- Clock Management: Global and regional clock distribution networks
- Boundary Scan: IEEE 1149.1 JTAG compliance for testing and debug
Performance and Electrical Characteristics
- Propagation Delay: 5.6ns (typical logic delay with standard speed grade)
- Setup Time: 3.0ns (typical register setup requirement)
- Clock-to-Output: 4.5ns (typical register to output timing)
- Maximum I/O Toggle Rate: 167MHz (high-speed I/O capability)
- Power Consumption: Optimized for 5V operation with power management
- Signal Integrity: Controlled impedance and minimal crosstalk
- EMI Performance: Programmable slew rates for electromagnetic compatibility
- Noise Immunity: Enhanced input thresholds and hysteresis
I/O and Interface Features
- Programmable I/O Standards: TTL, CMOS, and ECL compatibility
- Configurable Drive Strength: Adjustable output drive capability
- Input Protection: ESD protection on all I/O pins
- Differential I/O Support: High-speed differential signaling capability
- Clock Input/Output: Dedicated clock pins with global distribution
- Power Distribution: Optimized power and ground pin placement
- Package Parasitics: Minimized for high-speed operation
- Thermal Characteristics: Standard thermal performance for compact package
2. Pricing
Competitive Compact Package Pricing
Price Category: High-Density Compact FPGA – Authorized Distributors
- Single Unit Price: Contact authorized Xilinx distributors for current pricing
- Development Quantity (1-24 units): Standard development pricing for compact package
- Small Production (25-99 units): Volume pricing with space efficiency premium
- Production Volumes (100-499 units): Competitive pricing for high-density applications
- High Volume (500+ units): Maximum volume discounts available
- Lead Time: 8-16 weeks (standard for legacy products)
Compact Package Value Proposition
- Space Efficiency: Maximum logic density in minimal board area
- Cost-Effective Assembly: Standard PQFP assembly processes and equipment
- Design Flexibility: Compact form factor enables miniaturized designs
- Proven Reliability: Mature package technology with established track record
- Assembly Compatibility: Standard SMT rework and testing procedures
Market Positioning and Economics
- Density Leadership: Maximum XC5200 family logic in compact package
- Space-Constrained Solutions: Optimal for portable and embedded applications
- Cost Per Gate: Competitive logic density economics
- System Integration: Reduced board size and system costs
- Legacy Value: Proven technology for existing design bases
Alternative Package Considerations
- XC5215-PQ208: Higher pin count alternative with more I/O
- XC5215-HQ208: Enhanced thermal package option
- XC5215-BG352: Ball Grid Array maximum I/O option
- XC5215PQ160AKM: Enhanced thermal variant
- Modern Replacements: Current-generation compact alternatives
Total Cost Analysis
- Board Space Savings: Reduced PCB area and layer count requirements
- Assembly Costs: Standard SMT assembly equipment and processes
- Testing Efficiency: Boundary scan and in-circuit test compatibility
- System Miniaturization: Enables compact product designs
- Design Optimization: Space efficiency enables innovative form factors
Procurement Strategy
- Authorized Distribution: Established global supply chain
- Legacy Support: Mature product with predictable availability
- Volume Agreements: Long-term pricing for production applications
- Obsolescence Planning: Consider modern alternatives for new designs
- Technical Support: Complete documentation and design resources
Economic Advantage: The XC5215PQ160A provides maximum XC5200 family logic capacity in the most compact available package, delivering exceptional logic density per board area for space-constrained applications.
3. Documents & Media
Primary Technical Documentation
- Official Datasheet: XC5200 Field Programmable Gate Array Family Complete Specification
- Package Specification: PQ160 mechanical drawings and dimensional data
- User Manual: XC5215 comprehensive implementation and programming guide
- Pin Assignment Reference: Complete compact package pinout and signal definitions
- Application Notes: Compact package design guidelines and space optimization
- Layout Guidelines: PCB design recommendations for space-constrained applications
Compact Design Resources
- Miniaturization Guidelines: Space-efficient PCB layout and routing techniques
- Thermal Management: Heat dissipation strategies for compact designs
- Signal Integrity: High-density routing and crosstalk minimization
- Power Distribution: Compact power delivery and decoupling strategies
- Assembly Procedures: SMT placement and inspection for compact packages
- Testing Strategies: Boundary scan and functional testing in space-constrained designs
Development Software Suite
- Primary IDE: Xilinx ISE (Integrated Software Environment)
- Compact Design Tools: Space-aware place and route optimization
- Legacy Support: Foundation Series and Alliance development packages
- Design Entry Methods:
- ABEL: Hardware description language synthesis
- Schematic Capture: Graphical design entry with compact package support
- VHDL: IEEE-standard hardware description language
- Verilog HDL: Industry-standard HDL synthesis and simulation
- Implementation Tools: Compact package-aware optimization algorithms
- Analysis Tools: Timing and power analysis for space-constrained designs
Design Optimization Resources
- Utilization Maximization: Techniques for achieving maximum logic density
- Pin Assignment Optimization: Efficient I/O allocation for compact packages
- Routing Strategies: High-density interconnect optimization
- Performance Tuning: Speed optimization within compact constraints
- Power Optimization: Low-power design techniques for compact applications
- Thermal Considerations: Heat management in space-limited environments
Quality and Manufacturing Documentation
- Package Qualification: Compact package reliability testing and results
- Assembly Standards: SMT assembly requirements for compact packages
- Quality Control: Testing and inspection procedures
- Reliability Data: Long-term performance and failure analysis
- Manufacturing Guidelines: Production assembly and quality requirements
- Traceability: Complete manufacturing and test documentation
4. Related Resources
XC5200 Family Compact Package Portfolio
- XC5202PQ100A: Entry-level compact package (3,000 gates, 256 cells)
- XC5204PQ160A: Medium-density compact option (6,000 gates, 484 cells)
- XC5206PQ160A: High-density compact variant (9,000 gates, 784 cells)
- XC5210PQ160A: Advanced compact option (16,000 gates, 1,296 cells)
- XC5215PQ160A: Maximum capacity compact package
Package Family Comparison
- XC5215PQ208: Extended pin count PQFP alternative
- XC5215HQ208: High-density QFP with enhanced thermal
- XC5215BG352: Ball Grid Array maximum I/O option
- XC5215TQ144: Ultra-compact thin QFP package
- XC5215PQ160AKM: Enhanced thermal compact variant
Compact Design Ecosystem
- Miniaturization Tools: PCB design software for compact layouts
- Component Libraries: Compact component footprints and models
- Assembly Services: Contract manufacturers specializing in compact designs
- Testing Solutions: Compact test fixtures and boundary scan equipment
- Thermal Solutions: Heat management for space-constrained applications
Application Domains for Compact Designs
- Portable Electronics: Battery-powered and handheld devices
- Embedded Systems: Space-constrained industrial applications
- IoT Devices: Internet of Things edge computing nodes
- Medical Devices: Compact diagnostic and monitoring equipment
- Automotive Electronics: In-vehicle compact control modules
- Aerospace/Defense: Size and weight-critical military applications
Design Support and Services
- Miniaturization Consulting: Specialized compact design services
- Technical Support: Xilinx application engineering for compact applications
- Training Programs: Space-efficient FPGA design methodology
- Design Reviews: Compact design optimization and validation
- Community Resources: Compact design forums and user groups
Technology Evolution and Migration
- Legacy Compact Support: Maintaining space-critical XC5200 systems
- Modern Compact Alternatives: Current-generation space-efficient devices
- Miniaturization Trends: Advanced packaging and integration technologies
- Performance Scaling: Higher performance in smaller form factors
- Future Technologies: Next-generation compact FPGA solutions
5. Environmental & Export Classifications
Environmental Operating Specifications
- Operating Temperature Range: 0ยฐC to +85ยฐC (Commercial grade)
- Storage Temperature: -65ยฐC to +150ยฐC (non-operating conditions)
- Junction Temperature: 125ยฐC maximum (with proper thermal design)
- Humidity Tolerance: 5% to 95% RH (non-condensing conditions)
- Altitude Performance: Sea level to 10,000 feet operation
- Vibration Resistance: Standard electronic component specifications
- Mechanical Shock: JEDEC standards for surface mount components
Environmental Compliance Standards
- RoHS Directive: Compliance status verification required for specific lots
- REACH Regulation: Compliant with European chemical safety requirements
- Conflict Minerals: Xilinx responsible sourcing policies and declarations
- Package Materials: Standard plastic molding compound composition
- Lead Content: Traditional Pb/Sn solder finish (lead-free variants available)
- Recycling Compliance: Electronic waste management standards
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Technology Classification: Dual-use semiconductor technology
- Export License Requirements: Subject to U.S. Export Administration Regulations (EAR)
- Wassenaar Arrangement: Controlled under international dual-use agreements
- Country Restrictions: Review BIS Commerce Country Chart for destination compliance
Quality and Manufacturing Standards
- Manufacturing Quality: ISO 9001:2015 certified production facilities
- Package Quality: IPC-A-610 Class 2 (general electronics applications)
- Assembly Standards: J-STD-020 moisture sensitivity guidelines
- Qualification Testing: JEDEC standards for plastic package reliability
- Statistical Process Control: Advanced manufacturing process monitoring
- Supplier Quality: Qualified vendor programs and auditing
Compact Package-Specific Specifications
- Moisture Sensitivity Level: MSL 3 per IPC/JEDEC J-STD-020
- Package Coplanarity: 0.10mm maximum (per JEDEC standards)
- Lead Finish: Hot solder dip or electroplated finishes
- Package Material: Flame-retardant plastic molding compound
- Lead Frame: Copper alloy with appropriate surface finish
- Marking Requirements: Permanent laser or ink marking with traceability
Shipping and Storage Requirements
- Anti-Static Packaging: ESD-protective packaging and handling procedures
- Moisture Protection: Dry pack packaging for moisture-sensitive components
- Storage Conditions: Controlled temperature and humidity environment
- Shelf Life: 12 months minimum in moisture barrier packaging
- Handling Guidelines: Standard ESD-safe handling procedures for compact packages
- Baking Procedures: Moisture recovery baking if exposure limits exceeded
Assembly and Reliability Considerations
- Compact Assembly: Specialized SMT placement for high-density packages
- Soldering Profile: Standard reflow processes compatible with compact designs
- Thermal Interface: Standard thermal design practices for compact packages
- Mechanical Stress: Package design optimized for thermal cycling reliability
- Lead Integrity: Gull-wing lead design for assembly reliability in compact applications
- Inspection Methods: Automated optical inspection (AOI) for compact packages
Compact Design Leadership: The XC5215PQ160A represents the optimal balance of logic capacity and package size within the XC5200 family, providing maximum functionality in minimal board space for space-constrained applications.
Space Efficiency Advantage: The compact PQ160 package delivers exceptional logic density per board area, enabling miniaturized designs and cost-effective system integration in space-critical applications.
Legacy Technology Value: While representing mature technology, the XC5215PQ160A provides proven reliability and established design methodologies for applications requiring maximum logic density in compact form factors.
Design Considerations: The compact package requires careful attention to thermal management, signal integrity, and power distribution to achieve optimal performance in space-constrained environments.
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