XC5215PQ208: Xilinx XC5200 Family High-Density PQFP Field Programmable Gate Array

1. Product Specifications

Core Technical Specifications

• Part Number: XC5215PQ208
• Manufacturer: Xilinx Inc.
• Product Family: XC5200 FPGA Family
• Device Classification: Field Programmable Gate Array (FPGA)
• Logic Capacity: 23,000 gates equivalent (maximum XC5200 family capacity)
• Logic Cells: 1,936 configurable logic cells (CLBs)
• Maximum Operating Frequency: 83MHz (device capability)
• Process Technology: 0.5μm three-layer metal CMOS
• Supply Voltage: 5V ±5% (single supply operation)
• Package Type: 208-Pin PQ (Plastic Quad Flat Package)
• Temperature Grade: Standard commercial range available
• Speed Grades: Multiple speed options available (-4, -5, -6)

PQFP Package Specifications

• Package Designation: PQ208 (Plastic Quad Flat Package, 208 pins)
• Total Pin Count: 208 pins (high I/O density)
• User I/O Pins: Up to 164 user-configurable I/O pins
• Pin Pitch: 0.5mm (fine pitch for high density)
• Package Dimensions: 28mm x 28mm x 3.4mm (standard PQFP profile)
• Lead Style: Gull-wing leads for reliable surface mount assembly
• Package Material: Plastic molding compound with copper lead frame
• Package Weight: Approximately 2.0 grams
• Thermal Characteristics: Standard thermal performance for PQFP packages

Advanced Architecture Features

• VersaBlock Logic Architecture: Optimized for register-rich designs
• VersaRing I/O Interface: High-performance I/O with flexible standards
• SRAM-Based Configuration: Fast reconfiguration and in-system programming
• Hierarchical Interconnect: Multi-level routing for complex designs
• Distributed Memory: RAM and ROM capabilities within logic cells
• Clock Management: Global and local clock distribution networks
• Boundary Scan: IEEE 1149.1 JTAG compliance for testing and debug

Performance and Electrical Characteristics

• Propagation Delay: 5.6ns (typical logic delay, -5 speed grade)
• Setup Time: 3.0ns (typical register setup time)
• Clock-to-Output: 4.5ns (typical register to output pad)
• Maximum Toggle Rate: 167MHz (I/O switching frequency)
• Power Consumption: Optimized for 5V operation
• Input/Output Standards: TTL, CMOS, and ECL compatibility
• Drive Strength: Configurable output drive capability
• Slew Rate Control: Programmable for signal integrity optimization

Signal Integrity and I/O Features

• Programmable I/O Standards: Multiple voltage and logic standards
• Differential I/O Support: High-speed differential signaling capability
• Input Protection: ESD protection on all I/O pins
• Output Drive Options: Configurable drive strength settings
• Clock Input/Output: Dedicated clock pins and global distribution
• Power Distribution: Optimized power and ground pin placement
• Package Parasitics: Low inductance and capacitance for high-speed operation

2. Pricing

Competitive PQFP Pricing Structure

Price Category: High-Capacity FPGA – Authorized Distributors

• Single Unit Price: Contact authorized Xilinx distributors for current pricing
• Development Quantity (1-24 units): Standard development pricing
• Small Production (25-99 units): Volume pricing with setup considerations
• Production Volumes (100-499 units): Competitive production pricing
• High Volume (500+ units): Maximum volume discounts available
• Lead Time: 8-16 weeks (standard for legacy products)

PQFP Package Value Proposition

• Cost-Effective Assembly: PQFP offers lower assembly costs than BGA
• Proven Technology: Mature package with established supply chain
• Design Flexibility: Easier PCB routing compared to fine-pitch alternatives
• Rework Capability: Standard SMT rework procedures and equipment
• Testing Accessibility: Boundary scan and in-circuit test friendly

Market Positioning and Alternatives

• Legacy Product Advantage: Proven reliability and established design base
• Competitive Capacity: Maximum logic density in XC5200 family
• Package Alternatives: Compare with HQ208, BG352, and other variants
• Modern Equivalents: Current-generation alternatives for new designs
• Cost Comparison: Competitive pricing for equivalent logic capacity

Total Cost Analysis

• Development Costs: Standard PCB design tools and methodologies
• Assembly Costs: Conventional SMT assembly equipment and processes
• Testing Costs: Standard boundary scan and functional testing
• Rework Costs: Conventional SMT rework stations and procedures
• Thermal Management: Standard heat sinking and thermal design

Procurement Considerations

• Authorized Distributors: Established global distribution network
• Supply Chain: Mature product with predictable availability
• Documentation: Complete technical documentation and support
• Lifecycle: Legacy product with long-term availability considerations
• Replacement Planning: Consider modern alternatives for new designs

Value Assessment: The XC5215PQ208 offers maximum XC5200 family capacity in a cost-effective, assembly-friendly package. While legacy technology, it provides proven performance for applications requiring substantial logic resources with conventional assembly requirements.

3. Documents & Media

Primary Technical Documentation

• Official Datasheet: XC5200 Field Programmable Gate Array Family Complete Specification
• Package Specification: PQ208 mechanical drawings and thermal characteristics
• User Manual: XC5215 comprehensive implementation and programming guide
• Pin Assignment Reference: Complete PQFP pinout diagrams and signal definitions
• Application Notes: PQFP design guidelines and PCB layout recommendations
• Errata Documentation: Known issues, limitations, and workaround solutions

PQFP Design Resources

• PCB Design Guidelines: PQFP layout rules and thermal considerations
• Assembly Procedures: SMT placement, reflow, and inspection guidelines
• Thermal Design: Heat dissipation recommendations and thermal management
• Signal Integrity: High-speed design considerations for PQFP packages
• Testing Procedures: Boundary scan, in-circuit test, and functional testing
• Rework Guidelines: Component removal and replacement procedures

Development Software Suite

• Primary IDE: Xilinx ISE (Integrated Software Environment)
• Legacy Support: Foundation Series and Alliance development packages
• Design Entry Methods:
  • ABEL: Hardware description language synthesis
  • Schematic Capture: Graphical design entry with symbol libraries
  • VHDL: IEEE-standard hardware description language
  • Verilog HDL: Industry-standard HDL synthesis and simulation
• Implementation Tools: Place and route optimization for PQFP packages
• Programming Tools: iMPACT configuration and boundary scan utilities

Technical Reference Materials

• Design Methodologies: Best practices for XC5200 family implementation
• Timing Analysis: Static timing analysis procedures and constraints
• Power Analysis: Power consumption estimation and optimization
• Package Models: SPICE and IBIS models for simulation accuracy
• Reference Designs: Example implementations and application circuits
• Migration Guides: Upgrade paths to current-generation devices

Quality and Manufacturing Documentation

• Manufacturing Specifications: PQFP assembly and quality requirements
• Test Procedures: Acceptance testing and quality assurance protocols
• Reliability Data: Package reliability testing and qualification results
• Environmental Testing: Temperature cycling and stress test reports
• Failure Analysis: Package integrity and performance analysis procedures
• Traceability: Manufacturing lot tracking and quality documentation

4. Related Resources

XC5200 Family Product Portfolio

• XC5202PQ: Entry-level PQFP option (3,000 gates, 256 cells)
• XC5204PQ: Small-scale PQFP applications (6,000 gates, 484 cells)
• XC5206PQ: Medium-density PQFP variant (9,000 gates, 784 cells)
• XC5210PQ: High-capacity PQFP option (16,000 gates, 1,296 cells)
• XC5215PQ208: Maximum capacity PQFP configuration

Package Family Comparison

• XC5215HQ208: High-density QFP alternative (enhanced thermal)
• XC5215BG352: Ball Grid Array maximum I/O option
• XC5215PQ160: Reduced pin count PQFP alternative
• XC5215PQ240: Extended pin count PQFP variant
• XC5215TQ144: Thin QFP compact package option

PQFP Development Ecosystem

• Development Boards: XC5200 family evaluation and prototyping platforms
• Reference Designs: PQFP-optimized application examples
• Design Tools: PCB layout and thermal analysis software
• Assembly Services: Contract manufacturers with PQFP expertise
• Testing Solutions: Boundary scan and automated test equipment

Application Domains and Use Cases

• Digital Signal Processing: Real-time filtering and signal transformation
• Telecommunications: Protocol processing and interface bridging
• Industrial Control: Automation and process control applications
• Instrumentation: Data acquisition and measurement systems
• Communications: Network processing and switching applications
• Consumer Electronics: High-performance digital processing

Design Support and Services

• Technical Support: Xilinx application engineering and customer support
• Design Consultation: Authorized design partners and consultants
• Training Programs: XC5200 family design methodology courses
• Community Forums: User communities and technical discussion groups
• Documentation Library: Complete technical resource repository

Migration and Modernization

• Legacy Support: Maintaining existing XC5200-based systems
• Modern Alternatives: Current-generation FPGA families
• Design Migration: Tools and procedures for modernization
• Performance Upgrades: Enhanced capability with newer devices
• Long-term Strategy: Product lifecycle and obsolescence management

5. Environmental & Export Classifications

Environmental Operating Specifications

• Operating Temperature Range: 0°C to +85°C (Commercial grade standard)
• Storage Temperature: -65°C to +150°C (non-operating conditions)
• Junction Temperature: 125°C maximum (with proper thermal design)
• Humidity Tolerance: 5% to 95% RH (non-condensing conditions)
• Altitude Performance: Sea level to 10,000 feet operation
• Vibration Resistance: Standard electronic component specifications
• Mechanical Shock: JEDEC standards for surface mount components

Environmental Compliance Standards

• RoHS Directive: Compliance status varies by manufacturing date
• REACH Regulation: Compliant with European chemical safety requirements
• Conflict Minerals: Xilinx responsible sourcing policies and declarations
• Halogen Content: Standard package materials (non-halogen-free)
• Lead Content: Traditional Pb/Sn solder finish (lead-free variants available)
• Recycling Compliance: Electronic waste management standards

Export Control Classifications

• ECCN (Export Control Classification Number): 3A001.a.7
• HTS (Harmonized Tariff Schedule): 8542.31.0001
• Technology Classification: Dual-use semiconductor technology
• Export License Requirements: Subject to U.S. Export Administration Regulations (EAR)
• Wassenaar Arrangement: Controlled under international dual-use agreements
• Country Restrictions: Review BIS Commerce Country Chart for destination compliance

Quality and Manufacturing Standards

• Manufacturing Quality: ISO 9001:2015 certified production facilities
• Package Quality: IPC-A-610 Class 2 (general electronics applications)
• Assembly Standards: J-STD-020 moisture sensitivity guidelines
• Qualification Testing: JEDEC standards for plastic package reliability
• Statistical Process Control: Advanced manufacturing process monitoring
• Supplier Quality: Qualified vendor programs and auditing

PQFP-Specific Environmental Specifications

• Moisture Sensitivity Level: MSL 3 per IPC/JEDEC J-STD-020
• Package Coplanarity: 0.10mm maximum (per JEDEC standards)
• Lead Finish: Hot solder dip or electroplated finishes
• Package Material: Flame-retardant plastic molding compound
• Lead Frame: Copper alloy with appropriate surface finish
• Marking Requirements: Permanent laser or ink marking with traceability

Shipping and Storage Requirements

• Anti-Static Packaging: ESD-protective packaging and handling procedures
• Moisture Protection: Dry pack packaging for moisture-sensitive components
• Storage Conditions: Controlled temperature and humidity environment
• Shelf Life: 12 months minimum in moisture barrier packaging
• Handling Guidelines: Standard ESD-safe handling procedures
• Baking Procedures: Moisture recovery baking if exposure limits exceeded

Assembly and Reliability Considerations

• Soldering Profile: Compatible with standard SMT reflow processes
• Thermal Interface: Standard thermal design practices for PQFP
• Mechanical Stress: Package design for thermal cycling reliability
• Lead Integrity: Gull-wing lead design for assembly reliability
• Inspection Methods: Automated optical inspection (AOI) compatibility
• Rework Procedures: Standard SMT rework with appropriate thermal profiles

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Legacy Product Status: The XC5215PQ208 represents mature, proven technology from Xilinx’s XC5200 FPGA family. While suitable for existing design support and applications requiring this specific functionality, new projects should evaluate current-generation Xilinx FPGA families for enhanced performance, lower power consumption, and modern features.

Package Advantages: The PQ208 PQFP package offers an excellent balance of I/O density, assembly manufacturability, and cost-effectiveness. The package is well-suited for applications requiring substantial I/O capability with conventional surface-mount assembly processes.

Design Considerations: The PQFP package provides easier PCB routing and assembly compared to fine-pitch alternatives, making it suitable for applications where conventional SMT assembly capabilities are preferred over advanced packaging technologies.

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