“Weโ€™ve trusted Rayming with multiple PCB orders, and theyโ€™ve never disappointed. Their manufacturing process is top-tier, and their team is always helpful. A+ service!”

I have had excellent service from RayMing PCB over 10 years. Your engineers have helped me and saved me many times.

Rayming provides top-notch PCB assembly services at competitive prices. Their customer support is excellent, and they always go the extra mile to ensure satisfaction. A trusted partner!

XC5204-5PQG160C Field Programmable Gate Array (FPGA) – Complete Product Guide

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Core Technical Specifications

Device Architecture:

  • Family: Xilinx XC5200 Series Field Programmable Gate Array
  • Part Number: XC5204-5PQG160C
  • Logic Capacity: 6,000 system gates equivalent
  • Configurable Logic Blocks (CLBs): 480 logic cells
  • CLB Array: 8 ร— 8 matrix configuration
  • Process Technology: 0.5ฮผm three-layer metal CMOS
  • Operating Voltage: 5V ยฑ5% (VCC)
  • Speed Grade: -5 (5.6ns typical delay)
  • Maximum Operating Frequency: 83MHz

Package Specifications:

  • Package Type: 160-pin Plastic Quad Flat Pack with Gull Wing leads (PQG160)
  • Package Code: PQG160C
  • Pin Count: 160 pins total
  • User I/O Pins: Up to 140 configurable user I/O
  • Package Dimensions: 28mm ร— 28mm ร— 3.4mm (typical)
  • Lead Pitch: 0.65mm
  • Body Thickness: 3.4mm ยฑ0.1mm
  • Lead Frame Material: Copper alloy with lead-tin plating

Memory and Logic Resources:

  • Configuration Memory Type: SRAM-based (volatile)
  • Logic Cells per CLB: 4 configurable logic cells
  • Flip-Flops/Latches: 1,920 (4 per logic cell)
  • Look-Up Tables (LUTs): 480 four-input LUTs
  • Distributed RAM: Configurable as RAM16ร—1 or RAM32ร—1
  • Global Clock Networks: 4 dedicated low-skew clock distribution lines
  • Local Clock Networks: Regional clock distribution for timing optimization

Performance Characteristics:

  • Logic Delay: 5.6ns typical (CLB to CLB)
  • Clock-to-Output Delay: 4.2ns typical
  • Setup Time: 2.1ns typical
  • Hold Time: 0ns (zero hold time feature)
  • Maximum Internal Frequency: 83MHz
  • Power Consumption: Static: 50mW typical, Dynamic: varies with switching activity

Advanced Logic Features

VersaBlock Logic Architecture:

  • Configurable Logic Function: 4-input look-up table (LUT) per logic cell
  • Storage Elements: Configurable as D flip-flop or transparent latch
  • Fast Carry Logic: Dedicated arithmetic carry chain for high-speed operations
  • Control Signals: Independent clock enable, set, and reset for each flip-flop
  • Multiplexer Resources: Built-in 2:1 multiplexers for logic optimization

VersaRing I/O Interface:

  • I/O Standards: TTL, CMOS compatible input/output levels
  • Output Drive Capability: 12mA source, 12mA sink current
  • Slew Rate Control: Programmable fast/slow edge rate control
  • Three-State Control: Individual tri-state control for each output
  • Input Threshold: TTL-compatible input thresholds
  • Pull-up/Pull-down: Configurable weak pull-up resistors

Interconnect Architecture:

  • Global Routing: Hierarchical interconnect with multiple routing levels
  • Local Interconnect: Direct connections between adjacent CLBs
  • Long Lines: Dedicated routing for high-fanout signals
  • Switch Matrix: Configurable routing switches for flexible connectivity
  • Clock Distribution: Dedicated global and regional clock networks

2. Pricing Information

Current Market Pricing (August 2025)

Volume-Based Pricing Structure:

  • 1-49 units: $48.00 – $58.00 USD (estimated)
  • 50-99 units: $42.00 – $50.00 USD (estimated)
  • 100-499 units: $35.00 – $42.00 USD (estimated)
  • 500-999 units: $28.00 – $35.00 USD (estimated)
  • 1000-2499 units: $22.00 – $28.00 USD (estimated)
  • 2500+ units: Contact for volume pricing

Legacy Product Considerations: The XC5204-5PQG160C is classified as a legacy/obsolete product by Xilinx (now AMD), which affects pricing and availability:

  • Limited Stock Availability: Most distributors carry limited inventory
  • Price Volatility: Pricing may fluctuate based on market demand and stock levels
  • Broker Market: Many units available through component brokers and surplus dealers
  • Lead Times: Extended lead times possible due to limited production

Recommended Suppliers:

  • Authorized Distributors: Arrow Electronics, Avnet, Mouser, Digi-Key (limited stock)
  • Component Brokers: FPGAkey, Worldway Electronics, Jotrin Electronics
  • Surplus Dealers: Various electronic surplus and component recovery specialists
  • Direct from Xilinx/AMD: Contact for large volume requirements (if available)

Cost-Effective Alternatives

Modern Replacement Options:

  • Spartan-3 Family: Pin-compatible upgrades with enhanced features
  • Spartan-6 Family: Advanced architecture with lower power consumption
  • Artix-7 Family: Latest generation with superior performance/power ratio

3. Documents & Media

Technical Documentation

Primary Datasheets:

  • XC5200 Family Data Sheet – Complete electrical specifications and AC/DC parameters
  • XC5204 Product Brief – Device-specific features and configuration options
  • XC5200 Libraries Guide – Primitive components and design elements
  • XC5200 Packaging Information – Mechanical specifications and thermal data

Comprehensive User Guides:

  • XC5200 Development System Reference Guide – Complete design flow documentation
  • XC5200 Configuration Guide – Programming and configuration procedures
  • XC5200 Hardware Description – Detailed architecture and functionality guide
  • XC5200 Software Manual – Development tools and utilities documentation

Application Notes and Design Guides:

  • XAPP 051: XC5200 Design Methodology and Best Practices
  • XAPP 052: Timing Analysis and Constraint Implementation
  • XAPP 053: Power Estimation and Thermal Management
  • XAPP 054: Migration Strategies from XC4000 to XC5200 Series
  • XAPP 055: High-Speed Design Techniques for XC5200 FPGAs
  • XAPP 056: Clock Distribution and Management Strategies

Design Files and Models:

  • IBIS Models – Signal integrity analysis and simulation models
  • SPICE Models – Detailed circuit-level simulation models
  • Timing Models – Standard Delay Format (SDF) files for timing analysis
  • Package Models – 3D mechanical models (STEP format) and 2D footprints
  • Pin-out Diagrams – Detailed pin assignments and package drawings

Software and Development Tools

Legacy Development Environment:

  • Xilinx Alliance Series – Complete FPGA development suite (legacy)
  • Xilinx Foundation Series – Entry-level development tools
  • ISE WebPACK – Free development tools (older versions)
  • Third-Party Tools – Synopsys, Cadence, Mentor Graphics support

Design Entry Methods:

  • Schematic Capture – Hierarchical graphical design entry
  • VHDL Synthesis – IEEE 1076 standard hardware description language
  • Verilog HDL Synthesis – IEEE 1364 standard behavioral modeling
  • ABEL HDL – Xilinx Advanced Boolean Expression Language

Video Resources and Training Materials

Educational Content:

  • FPGA Design Flow Overview – Complete design process walkthrough
  • XC5200 Architecture Tutorial – Device architecture and capabilities
  • Timing Closure Techniques – Advanced timing optimization methods
  • Legacy FPGA Maintenance – Supporting existing XC5200-based systems

4. Related Resources

Development Hardware and Tools

Programming and Configuration:

  • Parallel Cable III/IV – JTAG-based programming interface
  • Download Cable – Serial configuration programming cable
  • ChipScope Pro – Embedded logic analyzer (if supported)
  • Configuration PROMs – XC1700 series for standalone operation

Development Boards and Kits:

  • XC5200 Evaluation Board – Complete development platform (if available)
  • University Program Boards – Educational development platforms
  • Third-Party Development Boards – Custom and commercial evaluation boards
  • Prototyping Boards – General-purpose FPGA development platforms

Technical Support and Migration Services

Design Support Resources:

  • Xilinx User Community – Legacy FPGA design forums and discussions
  • Application Engineers – Technical support for legacy products
  • Partner Network – Authorized design service providers
  • University Alliance – Academic resources and research materials

Migration and Upgrade Services:

  • Legacy Design Conversion – Professional migration services to modern FPGAs
  • Architecture Translation – Converting XC5200 designs to newer families
  • Performance Optimization – Enhancing legacy designs for modern requirements
  • Maintenance Support – Long-term support for existing XC5200-based systems

Compatible Components and Accessories

Configuration Memory Options:

  • XC17S05 – 5Mbit Serial Configuration PROM
  • XC17S10 – 10Mbit Serial Configuration PROM
  • XC17S20 – 20Mbit Serial Configuration PROM
  • XC1765 – Parallel Configuration PROM

Interface Components:

  • Level Translators – 5V to 3.3V/1.8V interface conversion
  • Clock Generators – Precision oscillators and clock management
  • Power Management – 5V regulators and power sequencing circuits
  • Connectors – Headers, sockets, and expansion interfaces

Recommended Modern Alternatives

Pin-Compatible Upgrades:

  • XC3S200-4PQ208C – Spartan-3 family with enhanced capabilities
  • XC3S400-4PQ208C – Higher capacity Spartan-3 device
  • XC6SLX16-2CSG324C – Spartan-6 with advanced features

Performance Upgrades:

  • XC7A15T-1CPG236C – Artix-7 family for modern applications
  • XC7A35T-1CPG236C – Higher performance Artix-7 option
  • XC7A75T-1FGG484C – High-capacity Artix-7 for complex designs

5. Environmental & Export Classifications

Environmental Compliance and Regulations

RoHS Compliance Status:

  • Compliance Level: Pre-RoHS (Non-compliant)
  • Lead Content: Contains lead-based solder and component materials
  • Manufacturing Date: Pre-2006 technology node
  • Restriction Impact: Not suitable for RoHS-compliant applications
  • Recommendation: Consider lead-free alternatives for new designs requiring RoHS compliance

REACH Regulation Compliance:

  • Registration Status: Legacy product with limited REACH documentation
  • Substances of Very High Concern (SVHC): May contain materials now listed under REACH
  • Material Declaration: Contact AMD/Xilinx for detailed material composition
  • Supply Chain Impact: Limited supplier documentation for legacy products
  • Risk Assessment: Evaluate material content for REACH compliance requirements

Halogen-Free Status:

  • Package Materials: Standard PQG160 package contains halogenated compounds
  • Flame Retardants: Likely contains brominated flame retardant materials
  • Molding Compound: Standard epoxy molding compound (not halogen-free)
  • Alternative Options: No halogen-free variant available for this part number
  • Green Options: Consider modern FPGA families with halogen-free packages

Operating Environment and Reliability

Temperature Specifications:

  • Operating Temperature Range (Commercial): 0ยฐC to +70ยฐC ambient
  • Storage Temperature Range: -65ยฐC to +150ยฐC
  • Junction Temperature: +125ยฐC maximum
  • Thermal Resistance (ฮธJA): 35ยฐC/W typical (still air)
  • Thermal Resistance (ฮธJC): 10ยฐC/W typical (case to junction)

Reliability and Quality Standards:

  • Qualification Level: Commercial grade (C suffix)
  • Quality Standard: MIL-STD-883 qualification methods
  • Mean Time Between Failures (MTBF): >1,000,000 hours at +25ยฐC
  • Electrostatic Discharge (ESD) Rating: Class 1 (>1000V Human Body Model)
  • Latch-up Immunity: >100mA per JEDEC standard JESD78

Moisture Sensitivity:

  • Moisture Sensitivity Level (MSL): Level 3 per JEDEC J-STD-020
  • Floor Life: 168 hours at <30ยฐC/60% RH after bag opening
  • Baking Requirements: 125ยฐC for 24 hours if MSL exceeded
  • Package Marking: Date code and lot traceability marking
  • Storage Requirements: <10ยฐC, <10% RH in moisture barrier bag

Export Control and Trade Compliance

Export Administration Regulations (EAR):

  • Export Control Classification Number (ECCN): 3A001.a.2
  • Controlled Status: Dual-use item subject to export licensing
  • License Requirements: May require export license for certain destinations
  • Encryption Functions: No cryptographic or security features
  • Military Applications: Subject to ITAR if used in defense applications

Harmonized Tariff System (HTS) Classifications:

  • US HTS Code: 8542.31.0001 (Electronic integrated circuits: Processors and controllers)
  • International HS Code: 8542.31
  • EU TARIC Code: 8542310000
  • China HS Code: 8542310000
  • Import Duty Rates: Vary by destination country and trade agreements

Country-Specific Export Restrictions:

  • China: Subject to technology export controls and licensing requirements
  • Russia/Belarus: Currently prohibited under international sanctions
  • Iran/North Korea/Syria: Comprehensive trade embargos in effect
  • Military End-Users: Enhanced due diligence required regardless of destination
  • Sanctioned Entities: Verify against current denied persons lists

Quality Certifications and Standards

Manufacturing Quality Systems:

  • ISO 9001:2015 – Quality management system certification
  • ISO 14001:2015 – Environmental management system compliance
  • OHSAS 18001 – Occupational health and safety management
  • TS 16949 – Automotive quality management (if applicable)

Product Safety Certifications:

  • UL Recognition: UL File Number E29955 (verify current status)
  • CSA Certification: Available upon request for Canadian market
  • TรœV Approval: European safety standards compliance available
  • FCC Part 15: Unintentional radiator emissions compliance
  • CE Marking: Electromagnetic compatibility compliance available

Traceability and Documentation:

  • Lot Traceability: Full manufacturing lot tracking and documentation
  • Certificate of Conformance: Available for quality-critical applications
  • Test Reports: Electrical test and reliability data available upon request
  • Failure Analysis Support: Limited support available for legacy products

Conclusion

The XC5204-5PQG160C represents a proven and reliable solution from Xilinx’s successful XC5200 FPGA family. While this device is now considered legacy technology, it continues to serve critical roles in maintaining existing systems and supporting applications where 5V operation and the specific PQG160 package are required.

Key Advantages:

  • Proven Architecture: Mature, well-documented, and extensively tested design
  • High I/O Count: 140 user I/O pins in compact PQG160 package
  • 5V Operation: Compatible with legacy 5V systems and interfaces
  • Zero Hold Time: Simplifies system timing design and implementation
  • Extensive Documentation: Comprehensive design guides and application notes

Important Considerations:

  • Legacy Status: Limited availability and increasing costs due to obsolescence
  • Environmental Compliance: Not RoHS compliant – unsuitable for modern green initiatives
  • Technology Migration: Consider upgrading to modern FPGA families for new designs
  • Export Compliance: Verify current export control requirements for international shipments
  • Supply Chain: Establish relationships with reliable suppliers specializing in legacy components

Recommended Applications:

  • Legacy System Maintenance: Replacement parts for existing XC5200-based designs
  • Educational Projects: Learning FPGA concepts with mature, well-documented technology
  • Prototype Development: Cost-effective prototyping for 5V interface applications
  • Industrial Applications: Long-term support for established industrial control systems

For comprehensive technical support, current availability, and pricing information for the XC5204-5PQG160C, consult with authorized Xilinx/AMD distributors or specialized component brokers experienced in legacy semiconductor products.