Product Specifications
Core Features
- Part Number: XC5206-5VQ100I
- Device Family: XC5200 Series Industrial FPGA
- Logic Density: 6,000 system gates equivalent
- Speed Grade: -5 (standard performance)
- Package: VQ100 (100-pin Very Thin Quad Flat Pack)
- Temperature Rating: Industrial grade (-40ยฐC to +85ยฐC)
Technical Specifications
- Architecture: SRAM-based reconfigurable logic
- Configurable Logic Blocks: 196 CLBs with 4-input lookup tables
- User I/O Count: 61 bidirectional I/O pins
- Internal Storage: Distributed SelectRAM memory
- Clock Distribution: Global clock networks with low skew
- Configuration Memory: Volatile SRAM configuration cells
- Supply Voltage: 5.0V ยฑ5% single supply operation
- Typical Propagation Delay: 8.5ns for speed grade -5
- Maximum Toggle Rate: 40 MHz system performance
Package Details
- Package Type: VQFP (Very Thin Quad Flat Pack)
- Pin Count: 100 pins
- Body Size: 14mm x 14mm x 1.4mm maximum height
- Lead Pitch: 0.5mm (19.7 mil) spacing
- Coplanarity: ยฑ0.08mm maximum
- Lead Frame Material: Copper with tin-lead or lead-free finish
Price Information
XC5206-5VQ100I pricing depends on order quantities and current market availability:
- Sample/Prototype Quantities (1-9 units): Available through major distributors
- Small Production (10-99 units): Volume discount tiers apply
- Medium Volume (100-499 units): Enhanced pricing available
- Large Volume (500+ units): Direct manufacturer pricing and agreements
- Long-term Agreements: Custom pricing for multi-year commitments
Semiconductor pricing is dynamic and subject to supply chain conditions, allocation status, and global market factors. Contact authorized Xilinx distributors for current quotations and lead time information.
Documents & Media
Technical Documentation
- Device Datasheet: XC5200 Series FPGA Complete Specifications (DS015)
- Programming Guide: XC5200 Configuration and Programming Manual
- Package Specifications: VQ100 Mechanical Drawings and PCB Layout Guide
- AC/DC Characteristics: Electrical specifications and timing parameters
Design Support Materials
- Application Notes:
- XAPP045: XC5200 Performance Optimization Techniques
- XAPP038: PCB Design Guidelines for VQ100 Package
- XAPP067: Implementing Boundary Scan in XC5200 Devices
- XAPP075: Power Supply Decoupling for Compact FPGA Designs
- User Guides: XC5200 Architecture Overview and Design Methodology
- Reliability Reports: Industrial qualification test results and MTBF data
Software Resources
- Development Tools: Xilinx Foundation Series and Alliance CAD software
- Device Libraries: VHDL and Verilog simulation models
- Constraint Files: Timing and placement constraint templates
- Example Designs: Reference implementations and starter projects
- Programming Utilities: Bitstream generation and device configuration tools
Related Resources
Development Tools and Kits
- XC5206-5VQ100I Evaluation Kit: Complete development platform with example designs
- Programming Hardware: Xilinx Parallel Cable III/IV or USB Platform Cable
- Development Software: Xilinx ISE Foundation with XC5200 device support
- Debugging Tools: ChipScope Pro analyzer for in-system verification
Supporting Components
- Configuration Devices: XC1700D series serial configuration PROMs
- Power Supply ICs: Low-noise 5V regulators optimized for FPGA applications
- Clock Generation: Programmable clock generators and crystal oscillators
- Interface Devices: Voltage level translators for multi-voltage systems
- Passive Components: Recommended capacitors and inductors for power filtering
Application Markets
- Industrial Control Systems: Sensor interfaces and control logic implementation
- Embedded Processing: Custom peripheral controllers and co-processors
- Communications Equipment: Protocol processing and data path functions
- Test Instrumentation: Pattern generators and response analyzers
- Automotive Electronics: Non-safety critical control applications
- Medical Devices: Signal processing and interface control (non-implantable)
Environmental & Export Classifications
Environmental Compliance
- RoHS Directive: Compliant versions available (lead-free soldering compatible)
- WEEE Directive: Compliant with European waste electrical equipment regulations
- REACH Regulation: Full compliance with EU chemical substance restrictions
- California Proposition 65: Compliant packaging and materials
- China RoHS: Meets Chinese restriction of hazardous substances requirements
Operating Environment
- Industrial Temperature Range: -40ยฐC to +85ยฐC ambient operation
- Storage Temperature: -65ยฐC to +150ยฐC non-operating
- Relative Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters operational
- Vibration Tolerance: 10G per MIL-STD-883 Method 2007
Quality and Reliability Standards
- Manufacturing Quality: ISO 9001:2015 certified production facilities
- Device Reliability: JEDEC standard qualification per JESD47
- Package Reliability: Temperature cycling, thermal shock, and humidity testing
- Electrostatic Discharge: Class 2 ESD sensitivity (>2000V HBM)
- Latch-up Immunity: >200mA per JEDEC standard JESD78
Export Control Classifications
- Export Control Classification Number (ECCN): 3A001.a.2.a
- Harmonized System Code: 8542.31.0001 for integrated circuits
- Country of Origin: Check device package marking for manufacturing location
- Export Administration Regulations: Subject to U.S. Department of Commerce EAR
- License Requirements: Export licenses may be required for restricted destinations
Supply Chain Compliance
- Conflict Minerals: Compliant with SEC Rule 13p-1 reporting requirements
- Responsible Sourcing: Verified supply chain practices per industry standards
- Anti-Counterfeiting: Authorized distribution channels and anti-tamper packaging
- Traceability: Complete lot genealogy and manufacturing history tracking
- Supplier Audits: Regular assessment of manufacturing partner compliance
Package Handling Specifications
- Moisture Sensitivity Level: MSL-3 per JEDEC J-STD-020D
- Floor Life: 168 hours at โค30ยฐC/60% RH after bag opening
- Baking Requirements: 125ยฐC for 24 hours if moisture limits exceeded
- Tray Packaging: Anti-static JEDEC trays with moisture barrier bags
- Tape and Reel: Available for automated SMT assembly (custom order)
The XC5206-5VQ100I provides an optimal balance of functionality, size, and industrial reliability for space-constrained embedded applications. Its compact VQ100 package and extended temperature rating make it an excellent choice for harsh environment programmable logic implementations.
Keywords: XC5206-5VQ100I, compact FPGA, Xilinx XC5200, VQ100 package, industrial temperature, embedded FPGA, space-constrained design, -40ยฐC to +85ยฐC, 100-pin FPGA, programmable logic
