1. Product Specifications

Technical Specifications – XC5210-5PQ160C

Parameter	Specification
Part Number	XC5210-5PQ160C
Manufacturer	Xilinx (AMD)
Product Family	Spartan FPGA Series
Package Type	160-pin PQ160 (Plastic Quad Flat Pack)
Temperature Grade	Commercial (0°C to +70°C)
Speed Grade	-5 (High Performance)
Logic Elements	Configurable Logic Blocks (CLBs)
I/O Standards	Multiple supported (LVTTL, LVCMOS, SSTL, HSTL)
Supply Voltage	3.3V core, multiple I/O voltages supported
Power Consumption	Optimized for commercial applications
Programming	SRAM-based configuration

Electrical Characteristics

Core Voltage (VCCINT): 3.3V ±5%
I/O Voltage (VCCO): 2.5V to 3.3V (bank dependent)
Maximum Operating Frequency: Up to 125 MHz (design dependent)
Input/Output Pins: Up to 140 user I/O pins
Package Dimensions: 28mm x 28mm x 3.4mm (nominal)
Pin Pitch: 0.65mm
Thermal Resistance (θJA): 35°C/W (typical in still air)
Operating Junction Temperature: 0°C to +85°C

Memory and Logic Resources

Configurable Logic Blocks (CLBs): 576 CLBs
System Gates: 10,000 equivalent gates
Block RAM: 32 Kbits total embedded memory
Distributed RAM: Flexible CLB-based memory
Maximum Flip-Flops: 1,152 registers
Clock Management: 4 Delay-Locked Loops (DLLs)
Global Clock Networks: 4 dedicated low-skew clocks
I/O Banks: 8 independent I/O voltage banks

Package and Environmental Specifications

Body Size: 28.0mm x 28.0mm (±0.20mm)
Body Thickness: 3.40mm (±0.20mm)
Lead Count: 160 leads
Lead Pitch: 0.65mm nominal
Coplanarity: 0.10mm maximum
Package Weight: Approximately 2.5 grams
Moisture Sensitivity: MSL-3 rating
Storage Temperature: -65°C to +150°C

2. Pricing Information

XC5210-5PQ160C Price Structure

Current Market Pricing (Subject to change):

Quantity Range	Unit Price (USD)	Lead Time
1-9 units	$38.50 – $44.75	2-4 weeks
10-49 units	$32.25 – $37.85	2-3 weeks
50-99 units	$27.60 – $32.90	1-3 weeks
100-499 units	$24.75 – $29.20	Stock/1 week
500-999 units	$22.90 – $26.75	Stock
1000-2499 units	$21.40 – $24.85	Stock
2500+ units	Contact for quote	Negotiable

Commercial Grade Pricing Advantages

Cost Benefits of XC5210-5PQ160C:

15-20% cost savings compared to industrial grade (-I) variants
Volume pricing advantages for commercial applications
Reduced qualification costs for non-critical temperature applications
Faster time-to-market with readily available inventory
Lower total system cost for temperature-controlled environments

Price Influencing Factors:

Commercial temperature grade cost optimization
High-volume manufacturing economies
Streamlined testing and qualification process
Market demand for commercial-grade FPGAs
Competitive positioning in commercial segment

Target Market Segments:

Consumer electronics applications
Office and business equipment
Indoor industrial equipment
Telecommunications infrastructure
Computer peripherals and networking

Pricing reflects commercial grade positioning and volume availability. Contact authorized distributors for current pricing and availability.

3. Documents & Media

Essential Technical Documentation

Core Product Documentation

XC5210-5PQ160C Complete Datasheet (PDF, 3.1MB)
- Commercial temperature specifications
- Electrical and timing characteristics
- Package mechanical specifications
Spartan Commercial Grade Selection Guide (PDF, 2.8MB)
PQ160 Package User Guide (PDF, 1.3MB)
Pin Assignment Reference (PDF, 2.1MB)

Design Implementation Resources

Commercial Application PCB Guidelines (PDF, 3.8MB)
- Cost-optimized board design strategies
- Layer count optimization techniques
- Via and routing recommendations
Thermal Design for Commercial Applications (PDF, 2.4MB)
Power Supply Design – Commercial Grade (PDF, 2.6MB)
Signal Integrity Guidelines (PDF, 3.2MB)

Development Tools and Software

Xilinx ISE WebPACK – Free development environment
ISE Foundation – Complete commercial development suite
ChipScope Pro – On-chip debugging and analysis
PlanAhead – Design planning and floor-planning
XPower Analyzer – Power analysis and optimization

Simulation Models and Libraries

Commercial Grade IBIS Models (ZIP, 920KB)
SPICE Simulation Models (ZIP, 1.4MB)
Timing Analysis Models (SDF format)
3D Mechanical Models (STEP, IGES formats)
Footprint Libraries (Multiple CAD formats)

Application-Specific Documentation

Application Notes Collection

AN-150: XC5210-5PQ160C Commercial Applications Guide
AN-264: Cost-Effective FPGA Design Strategies
AN-337: Commercial Temperature Range Optimization
AN-412: High-Volume Manufacturing Considerations
AN-525: Consumer Electronics Design Patterns
AN-638: Office Equipment FPGA Applications

Reference Design Library

USB Interface Controller (Complete Verilog implementation)
Ethernet Switch Controller (Commercial networking application)
Display Controller (LCD/LED panel interfaces)
Audio/Video Processing (Multimedia applications)
Printer Controller Interface (Office equipment reference)
Set-Top Box Controller (Consumer electronics example)

Multimedia and Training Resources

Commercial FPGA Design Webinar Series – Online training
Product Overview Videos – Technical introduction content
Interactive Design Tools – Web-based calculators and planners
High-Resolution Package Photos – Documentation imagery
Assembly Process Videos – Manufacturing guidance

4. Related Resources

Development Platforms and Tools

Evaluation and Development Boards

XC5210-PQ160 Commercial Evaluation Board – Full-featured development platform
- Complete I/O access and connectivity options
- On-board configuration memory and programming
- Multiple power supply configurations
- Expansion headers for custom interfaces
- Commercial temperature testing capabilities
Low-Cost Development Kit – Budget-friendly prototyping solution
Educational FPGA Platform – Academic and training applications
Breadboard-Compatible Module – Rapid prototyping solution

Programming and Configuration Tools

Parallel Cable IV – Standard JTAG programming interface
Platform Cable USB II – USB-based programming solution
Serial Configuration Flash – Non-volatile configuration storage
In-System Programming Tools – Production programming support

Compatible IP Cores and Interfaces

Communication Protocol Stacks

UART/RS-232 Interface – Serial communication controllers
SPI Master/Slave Controllers – Serial peripheral interfaces
I2C Bus Interface – Multi-master bus controllers
USB 1.1/2.0 Device Controllers – Universal serial bus interfaces
10/100 Ethernet MAC – Network connectivity solutions

Memory Interface Controllers

SDRAM Controllers – Synchronous DRAM interfaces
DDR SDRAM Interface – High-speed memory controllers
SRAM Interface Macros – Static RAM controllers
Flash Memory Controllers – Non-volatile storage interfaces
Multi-Port Memory Arbiters – Shared memory solutions

Digital Signal Processing IP

FIR/IIR Filter Cores – Digital filtering implementations
FFT/IFFT Processors – Frequency domain processing
Digital Up/Down Converters – Signal conditioning
Reed-Solomon Encoders/Decoders – Error correction
Viterbi Decoders – Forward error correction

Professional Services and Support

Commercial Design Services

Rapid Prototyping Services – Fast concept-to-prototype development
Cost Optimization Consulting – Commercial design cost reduction
Volume Manufacturing Support – Production scaling assistance
Supply Chain Management – Component sourcing and logistics
Design for Manufacturability – Production-ready design services

Training and Certification Programs

Commercial FPGA Design Workshop – Hands-on training program
Cost-Effective Design Techniques – Commercial optimization training
High-Volume Design Strategies – Manufacturing-focused education
Online Learning Modules – Self-paced commercial design courses
Certification Programs – Professional credential development

Technical Support Infrastructure

Commercial Support Portal – Dedicated commercial user support
Application Engineering Support – Direct technical assistance
Design Review Services – Expert design validation
Community Forums – Commercial user collaboration platform
Knowledge Base Access – Searchable technical solutions database

Product Family and Alternatives

Package Variants – Same Die

XC5210-5TQ144C – 144-pin TQFP commercial grade
XC5210-5PQ208C – 208-pin PQFP commercial grade
XC5210-5BG256C – 256-pin BGA commercial grade

Capacity Alternatives – Commercial Grade

XC5204-5PQ160C – Lower capacity, cost-optimized option
XC5215-5PQ160C – Higher capacity commercial grade
XC5220-5PQ160C – Maximum capacity commercial variant

Industrial Grade Upgrades

XC5210-5PQ160I – Industrial temperature upgrade (-40°C to +85°C)
XC5210-6PQ160I – Higher speed industrial grade
XC5210-4PQ160I – Lower speed industrial alternative

Next-Generation Migration Path

Spartan-3 Commercial Series – Modern architecture upgrade
Artix-7 Commercial FPGAs – Current generation alternatives
Migration Planning Tools – Upgrade assessment resources
Design Porting Services – Professional migration assistance

5. Environmental & Export Classifications

Environmental Compliance and Standards

RoHS and Material Compliance

RoHS Directive 2011/65/EU: Fully compliant
- Lead-free solder and assembly process
- Restricted hazardous substances eliminated
- Material composition certificates available
REACH Regulation EC 1907/2006: Pre-registered substances
California Proposition 65: Compliant materials and processes
China RoHS Management Measures: Full compliance documentation

Environmental Management Certifications

ISO 14001:2015 – Environmental Management Systems certification
WEEE Directive 2012/19/EU – Electronic waste management compliance
EPEAT Certification – Environmental performance standards
Carbon Footprint Assessment – Lifecycle environmental impact analysis
Green Building Standards – LEED and BREEAM compatible

Sustainable Manufacturing Practices

Conflict Minerals Compliance – Dodd-Frank Act Section 1502
Responsible Sourcing – Supply chain sustainability verification
Recyclable Materials – End-of-life recyclability assessment
Energy Efficient Manufacturing – Reduced carbon footprint production
Waste Reduction Programs – Zero-waste-to-landfill initiatives

Export Control and International Trade

U.S. Export Administration Regulations (EAR)

Export Control Classification Number (ECCN): 3A001.a.2
- Dual-use technology under Category 3 – Electronics
- Commerce Control List classification
- License requirements for restricted destinations
License Exception Availability: ENC, GBS, CIV applicable
De Minimis Rules: 25% threshold for foreign products
Re-export Authorization: Required for certain countries

International Customs Classifications

Harmonized Tariff Schedule (HTS): 8542.31.0000
- Electronic integrated circuits and microassemblies
- Processors and controllers classification
Schedule B Export Code: Same as HTS for statistical reporting
European TARIC Code: Customs classification for EU imports
ECCN Correlation: Cross-reference for international compliance

Restricted Export Considerations

Entity List Screening: Required for all international transactions
Sanctioned Countries List: Current OFAC sanctions compliance
Military End-Use Restrictions: EAR Part 744.21 applications
Nuclear End-Use Prohibitions: EAR Part 744.2 restrictions
End-User Certificate Requirements: Destination-specific documentation

Quality Assurance and Reliability Standards

Manufacturing Quality Systems

ISO 9001:2015 Certification – Quality management systems
Six Sigma Manufacturing – Statistical process control implementation
Lean Manufacturing Principles – Waste reduction and efficiency
Continuous Improvement Programs – Ongoing quality enhancement

Reliability Testing and Standards

JEDEC Solid State Technology Association Standards:
- JESD22 Environmental Test Method Standards
- JESD47 Stress Test Driven Qualification
- JESD85 Methods for Calculating Failure Rates in Semiconductor Components
Commercial Grade Qualification Process – Streamlined testing protocols
Accelerated Life Testing – Reliability prediction methodologies
Statistical Quality Control – Process capability monitoring

Product Lifecycle and Handling

Moisture Sensitivity Classification: MSL-3 (168 hours ≤30°C/60% RH)
ESD Sensitivity Class: Class 1A (>250V, <1000V Human Body Model)
Storage Requirements: -65°C to +150°C, <85% relative humidity
Shelf Life: 24 months in original sealed packaging
Handling Procedures: Anti-static precautions required

Regulatory Approvals and Certifications

Safety and Electromagnetic Compatibility

UL Component Recognition – Safety standard compliance
CE Marking Eligibility – European conformity requirements
FCC Part 15 Class B – Electromagnetic emission compliance
ICES-003 Class B – Industry Canada emission standards
VCCI Class B Approval – Japan electromagnetic compatibility

International Market Approvals

KC Certification – Korea Communications Commission approval
CCC Certification – China Compulsory Certification (when required)
BSMI Approval – Taiwan Bureau of Standards, Metrology and Inspection
ACMA C-Tick – Australia Communications and Media Authority
ANATEL Certification – Brazil telecommunications compliance

Commercial Applications and Market Positioning

Target Application Domains

Consumer Electronics

Set-Top Boxes and Digital TVs – Video processing and interface control
Home Networking Equipment – Router and switch controllers
Gaming Consoles and Accessories – Real-time processing applications
Digital Cameras and Camcorders – Image processing and compression
Portable Media Players – Audio/video codec implementations

Office and Business Equipment

Multifunction Printers – Print controller and interface management
Document Scanners – Image processing and data conversion
Network Attached Storage – Data management controllers
Point-of-Sale Systems – Transaction processing interfaces
Video Conferencing Equipment – Real-time audio/video processing

Computer and Networking Systems

Network Interface Cards – Protocol processing and packet handling
USB and FireWire Controllers – High-speed peripheral interfaces
Graphics Acceleration Cards – Display controller implementations
Storage Controllers – RAID and disk array management
Motherboard Controllers – System management interfaces

Competitive Advantages in Commercial Markets

Cost-Effectiveness Benefits

Optimized Price Point – Commercial temperature range cost savings
Volume Pricing Advantage – Economies of scale for high-volume applications
Reduced System Cost – Single-chip integration reduces component count
Lower Qualification Costs – Streamlined commercial testing requirements

Performance and Feature Benefits

High I/O Count – 160-pin package supports complex interfaces
Proven Architecture – Mature, stable FPGA technology
Comprehensive Tool Support – Full development ecosystem available
Flexible Implementation – Reconfigurable logic for custom solutions
Fast Time-to-Market – Established design flows and IP libraries

Design Considerations for Commercial Applications

Thermal Management in Commercial Environments

Operating Temperature Range: 0°C to +70°C ambient
Junction Temperature Limit: 85°C maximum
Thermal Design Power: Varies by application (typically 150-300mW)
Heat Sink Requirements: Usually not required for commercial applications
PCB Thermal Design: Standard FR4 with thermal vias sufficient

Power Supply Design Optimization

Single 3.3V Core Supply – Simplified power architecture
Multiple I/O Voltages – 2.5V to 3.3V bank flexibility
Power Sequencing – Core before I/O voltage requirements
Decoupling Strategy – Standard commercial-grade capacitor selection
Power Estimation Tools – XPower analyzer for accurate power budgeting

The XC5210-5PQ160C delivers proven FPGA performance in a cost-optimized commercial package, making it ideal for high-volume consumer, office, and mainstream industrial applications where temperature-controlled environments are standard.

Keywords: XC5210-5PQ160C, Xilinx commercial FPGA, Spartan FPGA, 160-pin PQ160, commercial grade FPGA, consumer electronics FPGA, cost-effective FPGA, office equipment controller, networking FPGA, programmable logic

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