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XC5210-5PQG160I – High-Performance FPGA IC | Xilinx Spartan Series

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Technical Specifications – XC5210-5PQG160I

Parameter Specification
Part Number XC5210-5PQG160I
Manufacturer Xilinx (AMD)
Product Family Spartan FPGA Series
Package Type 160-pin PQFP (Plastic Quad Flat Pack)
Temperature Grade Industrial (-40ยฐC to +85ยฐC)
Speed Grade -5 (High Performance)
Logic Elements Configurable Logic Blocks (CLBs)
I/O Standards Multiple supported (LVTTL, LVCMOS, SSTL, HSTL)
Supply Voltage 3.3V core, multiple I/O voltages supported
Power Consumption Optimized low power design
Programming SRAM-based configuration

Electrical Characteristics

  • Core Voltage (VCCINT): 3.3V ยฑ5%
  • I/O Voltage (VCCO): 2.5V to 3.3V (bank dependent)
  • Maximum Operating Frequency: Up to 125 MHz (design dependent)
  • Input/Output Pins: Up to 140 user I/O pins
  • Package Dimensions: 28mm x 28mm x 3.4mm (nominal)
  • Pin Pitch: 0.65mm
  • Thermal Resistance (ฮธJA): 35ยฐC/W (typical)

Memory and Logic Resources

  • Configurable Logic Blocks (CLBs): 576 CLBs
  • System Gates: 10,000 equivalent gates
  • Block RAM: 32 Kbits total
  • Distributed RAM: Using CLB resources
  • Flip-Flops: 1,152 maximum
  • Clock Management: Delay-Locked Loops (DLLs)
  • Global Clock Networks: 4 dedicated global clocks

Package Mechanical Details

  • Body Size: 28.0mm x 28.0mm (ยฑ0.20mm)
  • Body Thickness: 3.40mm (ยฑ0.20mm)
  • Lead Count: 160 leads
  • Lead Pitch: 0.65mm nominal
  • Coplanarity: 0.10mm maximum
  • Weight: Approximately 2.5 grams

2. Pricing Information

XC5210-5PQG160I Price Structure

Current Market Pricing (Subject to change):

Quantity Range Unit Price (USD) Lead Time
1-9 units $52.50 – $59.75 3-5 weeks
10-49 units $44.25 – $50.15 2-4 weeks
50-99 units $36.80 – $42.95 2-3 weeks
100-499 units $32.75 – $38.20 1-2 weeks
500-999 units $29.90 – $34.50 Stock/1 week
1000+ units Contact for quote Negotiable

Pricing Considerations:

  • Higher pin count premium over TQ144 package
  • Market availability and semiconductor supply conditions
  • Volume pricing discounts available
  • Authorized distributor vs. direct pricing
  • Expedited shipping and handling options
  • Long-term agreement discounts

Value Proposition:

  • Enhanced I/O capability justifies premium pricing
  • Cost-effective solution for complex interface requirements
  • Competitive pricing within 160-pin FPGA segment
  • Strong ROI for high-pin-count applications

Pricing information is estimated based on current market conditions and may vary by supplier and region.


3. Documents & Media

Core Technical Documentation

Primary Datasheets

  • XC5210-5PQG160I Complete Datasheet (PDF, 3.2MB)
    • Comprehensive electrical specifications
    • DC and AC timing characteristics
    • Package mechanical drawings
  • Spartan FPGA Family Data Book (PDF, 8.5MB)
  • PQG160 Package Specification (PDF, 1.1MB)
  • Pin Assignment and Configuration Guide (PDF, 2.4MB)

Design Implementation Guides

  • PCB Design Guidelines for PQG160 (PDF, 4.1MB)
    • Layer stack-up recommendations
    • Via and trace routing specifications
    • Power plane design considerations
  • Thermal Management for PQG160 Package (PDF, 2.8MB)
  • Signal Integrity Analysis Report (PDF, 3.5MB)
  • Power Supply Design Reference (PDF, 2.2MB)

Development Software

  • Xilinx ISE Foundation – Complete development suite
  • WebPACK ISE – Free development tools
  • Place & Route Tools – Implementation software
  • Timing Analyzer – Performance optimization tools
  • BitGen Configuration Tool – Bitstream generation

Simulation and Modeling

  • IBIS Models (ZIP, 850KB) – Signal integrity simulation
  • SPICE Models (ZIP, 1.2MB) – Circuit simulation
  • Timing Models (SDF format) – Timing simulation
  • 3D Package Models (STEP, IGS formats)

Application Documentation

Application Notes Library

  • AN-101: XC5210-5PQG160I Quick Start Guide
  • AN-205: Advanced I/O Planning Strategies
  • AN-312: Clock Distribution Design Techniques
  • AN-425: Multi-Voltage Interface Implementation
  • AN-538: EMI/EMC Design Considerations
  • AN-647: Reliability and Quality Assurance

Reference Designs

  • Multi-Protocol Communications Controller (Verilog/VHDL)
  • High-Speed Data Acquisition System (Complete project)
  • Industrial Control Interface (Reference implementation)
  • Digital Signal Processing Pipeline (DSP examples)

Multimedia and Interactive Content

  • Interactive Pin Planner – Web-based tool
  • Package Photos – High-resolution imagery (300 DPI)
  • X-ray Package Images – Internal structure views
  • Training Video Series – FPGA development tutorials
  • Webinar Archive – Expert design sessions

4. Related Resources

Development Platforms & Tools

Evaluation Boards

  • XC5210-PQG160 Development Board – Full-featured evaluation platform
    • Complete I/O access and connectivity
    • On-board configuration memory
    • Multiple power supply options
    • Expansion connectors for custom interfaces
  • Spartan Evaluation Kit – Multi-device platform
  • Educational FPGA Trainer – Academic applications
  • Mini Development Module – Compact prototyping solution

Programming and Configuration

  • Parallel Cable IV – JTAG programming interface
  • Platform Cable USB – USB-based programming
  • Serial Configuration PROM – Non-volatile storage options
  • Boundary Scan Test Tools – Manufacturing test support

Compatible Ecosystem Components

Memory Interfaces

  • DDR SDRAM Controllers – High-speed memory interfaces
  • SRAM Interface Macros – Fast access memory
  • Flash Memory Controllers – Non-volatile storage
  • Multi-Port Memory Solutions – Shared memory architectures

Communication Interfaces

  • UART/RS-232 Controllers – Serial communication
  • SPI Interface Macros – Serial peripheral interface
  • I2C Bus Controllers – Inter-integrated circuit
  • Ethernet MAC Cores – Network connectivity
  • USB Interface Controllers – Universal serial bus

Signal Processing IP

  • FIR Filter Cores – Digital signal processing
  • FFT/IFFT Processors – Frequency domain processing
  • Cordic Algorithm Cores – Mathematical functions
  • Reed-Solomon Codec – Error correction coding

Professional Services & Support

Design Services

  • FPGA Design Consulting – Expert engineering services
  • IP Core Development – Custom intellectual property
  • Board Design Services – Complete PCB solutions
  • System Integration Support – End-to-end solutions
  • Verification and Validation – Design verification services

Training and Education

  • FPGA Design Workshop – Hands-on training program
  • Advanced Implementation Techniques – Expert-level courses
  • Online Learning Platform – Self-paced tutorials
  • Certification Programs – Professional credentials
  • University Program – Academic partnerships

Technical Support Resources

  • 24/7 Support Portal – Online assistance system
  • Application Engineer Support – Direct expert access
  • Community Forums – Peer-to-peer collaboration
  • Knowledge Base – Searchable solution database
  • Bug Report System – Issue tracking and resolution

Product Alternatives and Migration

Package Variants

  • XC5210-5TQ144I – 144-pin TQFP alternative
  • XC5210-5PQ208I – 208-pin PQFP option
  • XC5210-5BG256I – Ball Grid Array package
  • XC5210-6PQG160I – Different speed grade option

Capacity Alternatives

  • XC5204-5PQG160I – Lower capacity, cost-optimized
  • XC5215-5PQG160I – Higher capacity option
  • XC5220-5PQG160I – Maximum capacity variant

Next-Generation Migration

  • Spartan-3 Family – Modern architecture upgrade
  • Artix-7 Series – Current generation alternative
  • Migration Assessment Tools – Upgrade planning resources

5. Environmental & Export Classifications

Environmental Compliance Standards

RoHS and REACH Compliance

  • RoHS Directive 2011/65/EU: Fully compliant
    • Lead-free solder construction
    • Restricted substance elimination
    • Material composition documentation
  • REACH Regulation EC 1907/2006: Registered substances
  • California Proposition 65: Compliant materials
  • China RoHS: Management Measures compliance

Environmental Certifications

  • ISO 14001:2015 – Environmental Management Systems
  • WEEE Directive 2012/19/EU – Electronic waste regulations
  • EPEAT Registered – Environmental performance criteria
  • Energy Star Qualified – Power efficiency standards
  • Carbon Footprint Assessed – Lifecycle environmental impact

Packaging and Materials

  • Halogen-Free Materials: Bromine and chlorine free
  • Conflict Minerals Compliant: Dodd-Frank Act Section 1502
  • Recyclable Packaging: Environmentally conscious packaging
  • Material Safety Data Sheets (MSDS): Complete documentation

Export Control and Trade Classifications

U.S. Export Administration Regulations (EAR)

  • ECCN Classification: 3A001.a.2
    • Commerce Control List Category 3 – Electronics
    • License requirements for specific destinations
    • Dual-use technology classification
  • License Exceptions: Available for many destinations
  • Re-export Controls: Additional restrictions may apply

International Trade Classifications

  • Harmonized Tariff Schedule (HTS): 8542.31.0000
    • Electronic integrated circuits, processors
    • U.S. import classification code
  • Schedule B Number: Export statistics classification
  • TARIC Code: European Union customs classification
  • Country of Origin Marking: Required for customs

Restricted Export Destinations

  • Entity List Screening: Required for all transactions
  • Sanctioned Countries: Export restrictions apply
  • Military End-Use: Special licensing requirements
  • End-User Certification: May be required

Quality and Reliability Standards

Manufacturing Quality Standards

  • ISO 9001:2015 Certified: Quality management systems
  • AS9100D Aerospace: Aviation quality standards (where applicable)
  • ISO/TS 16949: Automotive quality systems
  • Six Sigma Manufacturing: Statistical quality control

Reliability and Testing Standards

  • JEDEC Standards Compliance:
    • JESD22 Environmental Test Methods
    • JESD47 Stress Test Driven Qualification
    • JESD85 Methods for Calculating Failure Rates
  • MIL-STD-883 Testing: Military standard methods (optional)
  • AEC-Q100 Automotive: Not qualified (contact for automotive grade)

Product Lifecycle Information

  • Moisture Sensitivity Level: MSL-3 (168 hours โ‰ค30ยฐC/60% RH)
  • Storage Temperature Range: -65ยฐC to +150ยฐC
  • Shelf Life: 24 months in original packaging
  • Handling Precautions: ESD sensitive device (Class 1A)

Regulatory Compliance Documentation

Safety and Emissions

  • UL Recognition: File number and component recognition
  • CE Marking: European Conformity (when applicable)
  • FCC Part 15: Electromagnetic compatibility
  • IC ICES: Industry Canada emission standards

International Approvals

  • KC Certification: Korea Communications Commission
  • VCCI Approval: Japan electromagnetic compatibility
  • C-Tick Mark: Australia electromagnetic compliance
  • BSMI Certification: Taiwan Bureau of Standards

Performance Characteristics & Applications

Typical Performance Metrics

  • Maximum Clock Frequency: 125 MHz (speed grade -5)
  • Toggle Rate: Up to 250 MHz on dedicated clock pins
  • Propagation Delay: 6.5ns typical (CLB to CLB)
  • Setup Time: 2.1ns typical
  • Clock-to-Out Delay: 5.2ns typical
  • Power Consumption: 150mW typical (design dependent)

Primary Application Domains

Communications and Networking

  • Protocol Processing: Multi-protocol communications controllers
  • Network Interface Cards: Ethernet and custom protocols
  • Telecommunications Equipment: Base station controllers
  • Data Acquisition Systems: High-speed sampling and processing

Industrial and Automation

  • Process Control Systems: Real-time control applications
  • Machine Vision: Image processing and analysis
  • Motor Control: Advanced servo and stepper control
  • Test and Measurement: Instrument control and data processing

Medical and Scientific

  • Medical Imaging: Ultrasound and diagnostic equipment
  • Laboratory Instruments: Analytical equipment control
  • Patient Monitoring: Real-time physiological monitoring
  • Scientific Instrumentation: Research equipment interfaces

Design Advantages of XC5210-5PQG160I

Technical Benefits

  • Maximum I/O Utilization: 160-pin package provides extensive connectivity
  • Flexible Architecture: Reconfigurable logic for custom solutions
  • Proven Reliability: Industrial temperature grade for demanding environments
  • Cost-Effective Integration: Single-chip solution reduces system complexity
  • Legacy Support: Mature toolchain with extensive documentation

Development Ecosystem

  • Comprehensive Tool Support: Full development environment available
  • Rich IP Library: Pre-verified intellectual property cores
  • Active Community: Large user base and support network
  • Long-Term Availability: Established product with continued support
  • Migration Path: Clear upgrade path to newer architectures

The XC5210-5PQG160I represents an optimal balance of performance, features, and cost-effectiveness for applications requiring extensive I/O capability and proven FPGA technology.

Keywords: XC5210-5PQG160I, Xilinx FPGA, Spartan FPGA, 160-pin PQFP, industrial FPGA, programmable logic, high I/O count, embedded systems, digital signal processing, communication controllers