“We’ve trusted Rayming with multiple PCB orders, and they’ve never disappointed. Their manufacturing process is top-tier, and their team is always helpful. A+ service!”

I have had excellent service from RayMing PCB over 10 years. Your engineers have helped me and saved me many times.

Rayming provides top-notch PCB assembly services at competitive prices. Their customer support is excellent, and they always go the extra mile to ensure satisfaction. A trusted partner!

RAYMING Reballing Services – BGA Ball Replacement

Original price was: $40.00.Current price is: $27.00.

Restore your electronic devices to peak performance with our expert BGA (Ball Grid Array) reballing services. Our skilled technicians specialize in precise ball replacement for graphics cards, motherboards, gaming consoles, and other critical electronic components.

What We Offer

Our comprehensive reballing service addresses failed solder connections by completely replacing the ball grid array underneath BGA chips. Using professional-grade equipment and lead-free solder balls, we restore proper electrical connections between your device’s processor, GPU, or chipset and the main board.

Why Choose Our Reballing Service?

Professional Equipment: We utilize industrial reballing stations with precise temperature control and alignment systems to ensure accurate ball placement and optimal solder joint formation.

Quality Materials: Only high-grade, lead-free solder balls meeting industry specifications are used for maximum reliability and longevity.

Experienced Technicians: Our certified repair specialists have extensive experience with various BGA chip types, from laptop GPUs to gaming console processors.

Comprehensive Testing: Every reballed component undergoes thorough functionality testing before return to ensure complete restoration of performance.

Common Applications

  • Graphics card GPU reballing (NVIDIA, AMD)
  • Laptop motherboard chipset repair
  • Gaming console processor restoration (PlayStation, Xbox)
  • Mobile device CPU/GPU repair
  • Server and workstation component restoration

Service Process

Our systematic approach begins with comprehensive diagnostic testing to confirm BGA failure. We then carefully remove the faulty chip, clean the contact surfaces, apply fresh solder balls with precision placement, and perform controlled reflow soldering. Each repair concludes with extensive quality assurance testing.

Turnaround Time: 3-5 business days Warranty: 90-day service guarantee on all reballing work

Transform your failed electronics back to working condition with our professional BGA reballing expertise. Contact us today for a diagnostic evaluation and service quote.