XC5202-6PC84C – Xilinx FPGA XC5200 Family 84-Pin PLCC Field-Programmable Gate Array

1. Product Specifications

Technical Specifications – XC5202-6PC84C

Parameter	Specification
Part Number	XC5202-6PC84C
Manufacturer	Xilinx (now AMD)
Product Family	XC5200 FPGA Series
Logic Elements	256 cells (64 CLBs)
Gate Count	3,000 gates equivalent
User I/O Pins	65 I/O
Maximum Frequency	83MHz
Package	84-pin PLCC (Plastic Leaded Chip Carrier)
Package Dimensions	29.31×29.31mm
Lead Type	84-LCC (J-Lead)
Operating Voltage	5V ±5% (4.75V to 5.25V)
Temperature Grade	Commercial (0°C to +85°C TJ)
Process Technology	0.5μm CMOS, three-layer metal
Architecture	VersaBlock logic modules, VersaRing I/O interface
Configuration	SRAM-based, volatile configuration
Propagation Delay	5.6ns typical
Lead Finish	Tin/Lead (Sn85Pb15)

PLCC Package Advantages

Space-Efficient Design: The 84-pin PLCC package provides maximum I/O density in a compact 29.31×29.31mm footprint, ideal for size-constrained PCB designs.

Socket Compatibility: PLCC packages are widely compatible with standard IC sockets, enabling easy prototyping, testing, and field replacement without soldering.

Mechanical Reliability: J-lead configuration provides excellent mechanical strength and thermal cycling performance compared to fine-pitch packages.

PCB Layout Benefits: Square package format with leads on all four sides optimizes PCB routing and reduces trace length for high-speed signals.

2. Pricing Information

XC5202-6PC84C Market Pricing

The XC5202-6PC84C is available from 24 distributors globally, offering competitive pricing for this legacy FPGA component:

Current Market Pricing:

• FOB Reference Price: $16.617 – $55.147 per unit (minimum order: 1 piece)
• Volume Pricing: Bulk discounts available for quantities over 100 units
• Stock Status: Large inventory quantities available from multiple distributors

Pricing Factors:

• PLCC package typically offers cost advantage over fine-pitch alternatives
• Commercial temperature grade provides economic benefit over industrial variants
• Legacy product status with established supply chain availability
• Multiple distributor sources ensuring competitive pricing

Available Inventory:

• Heisener: 5,520 pieces in stock
• Veswin Electronics: 248 pieces available
• Multiple distributors with immediate availability
• ETD typically 5-16 days for standard quantities

Cost Comparison:

• More cost-effective than 100-pin PQFP variants
• Competitive pricing due to established manufacturing volumes
• Lower assembly costs due to PLCC socket compatibility

For current XC5202-6PC84C pricing and availability, contact distributors including Octopart, Heisener, FPGAkey, Veswin Electronics, or Kynix.

3. Documents & Media

Available Documentation for XC5202-6PC84C

Primary Technical Documentation:

• XC5200 Family Data Sheet: Complete electrical specifications and timing characteristics
• 84-Pin PLCC Pinout Diagram: Pin assignments, signal names, and package outline
• Package Mechanical Drawings: PLCC-84 dimensional specifications and tolerances
• Application Notes: Design guidelines for PLCC package implementation

Design Resources:

• Socket Selection Guide: Compatible PLCC-84 socket recommendations
• PCB Layout Guidelines: Optimal routing practices for 84-pin PLCC packages
• Thermal Management: Heat dissipation considerations for PLCC packages
• Assembly Instructions: Soldering and handling recommendations

Software Development Tools:

• Legacy Xilinx ISE: Required development environment (Vivado not supported)
• Design Entry Support: ABEL, schematic capture, VHDL, Verilog HDL synthesis
• Platform Compatibility: PC and workstation development environments
• Logic Synthesis Tools: Third-party synthesis tool compatibility

Configuration Documentation:

• Programming Guide: Bitstream generation and configuration procedures
• Configuration Memory: Compatible PROM and configuration device selection
• Programming Cables: Required programming hardware specifications

Quality Documentation:

• Reliability Data: PLCC package reliability and lifetime specifications
• Test Procedures: Quality assurance and incoming inspection guidelines
• Handling Instructions: ESD protection and storage requirements

4. Related Resources

XC5202-6PC84C Alternatives and Cross-References

Direct Family Variants:

• XC5202-6PQ100C: Same logic capacity in 100-pin PQFP package (more I/O)
• XC5202-6PC84I: Industrial temperature grade (-40°C to +85°C)
• XC5202-5PC84C: Speed grade -5 commercial variant
• XC5202-6VQ100C: Alternative in 100-pin VTQFP package

Package Alternatives – Same Logic:

• XC5202-6PQ100C: 100-pin PQFP with 81 I/O (vs 65 I/O in PLCC)
• XC5202-6PG156C: 156-pin grid array for maximum I/O count
• XC5202-6VQ64C: Smaller 64-pin VTQFP option with reduced I/O

Higher Capacity Options:

• XC5204-6PC84C: 6K gates, 480 cells in same PLCC-84 package
• XC5206-6PC84C: 10K gates option if available in PLCC package
• XC5210-6PC84C: Highest capacity XC5200 family member

Modern FPGA Alternatives:

• Intel Cyclone IV: EP4CE6E22C8N in PLCC-84 equivalent
• Lattice iCE40: Ultra-low-power alternatives in small packages
• Microchip SmartFusion: Integrated ARM Cortex-M3 with FPGA
• AMD-Xilinx Spartan-7: Modern architecture with legacy compatibility

Development and Support Resources

PLCC Socket Solutions:

• Standard PLCC-84 Sockets: Through-hole and surface-mount options
• ZIF Sockets: Zero insertion force for prototyping applications
• Test Sockets: High-reliability sockets for production testing
• Burn-in Sockets: High-temperature socket solutions

Programming Support:

• Legacy Programming Cables: Xilinx parallel cable and USB solutions
• Third-Party Programmers: Alternative programming hardware
• In-System Programming: ISP-compatible solutions for PLCC packages
• Gang Programmers: Production programming solutions

Design Services:

• PLCC to Modern Package Migration: Professional conversion services
• Legacy System Maintenance: Ongoing support for XC5200 systems
• Custom Socket Solutions: Specialized socket designs for unique applications
• PCB Design Services: PLCC-optimized board layout services

Application Support:

• Reference Designs: Proven implementations using XC5202-6PC84C
• Socket Interface Designs: Best practices for PLCC socket implementation
• Signal Integrity Guidelines: High-speed design considerations
• EMI/EMC Considerations: Electromagnetic compatibility for PLCC packages

5. Environmental & Export Classifications

Compliance and Classifications – XC5202-6PC84C

Environmental Compliance:

• RoHS Status: Not RoHS Compliant (legacy product with lead-based finish)
• Lead Content: Tin/Lead (Sn85Pb15) finish on J-leads
• REACH Regulation: Contains substances of very high concern (SVHC)
• Conflict Minerals: Not applicable for legacy semiconductor products

Package Environmental Characteristics:

• Moisture Sensitivity Level (MSL): Level 3 (168 hours at ≤30°C/60% RH)
• ESD Classification: Class 1 (≥2000V Human Body Model)
• Storage Requirements: Dry storage cabinet recommended
• Humidity Protection: Anti-static and moisture barrier packaging required

Quality and Reliability Standards:

• Temperature Cycling: Tested per JEDEC standards for PLCC packages
• Mechanical Shock: PLCC package provides superior shock resistance
• Vibration Resistance: J-lead configuration enhances mechanical integrity
• Thermal Performance: 5.08mm lead pitch optimizes heat dissipation

Export Control Classifications:

• ECCN (Export Control Classification Number): Subject to US Department of Commerce regulations
• HTS Code: Harmonized Tariff Schedule classification for international trade
• Country of Origin: Manufactured under Xilinx quality specifications
• Export License: May require specific licensing for certain destinations

Assembly and Manufacturing:

• Soldering Profile: Compatible with standard reflow and wave soldering
• Lead-Free Alternative: Not available due to legacy Sn85Pb15 finish
• Assembly Equipment: Compatible with standard PLCC placement machines
• Inspection Methods: Automated optical inspection (AOI) compatibility

Temperature and Power Characteristics

Thermal Performance:

• Operating Temperature: 0°C to +85°C junction temperature
• Storage Temperature: -65°C to +150°C ambient
• Thermal Resistance: Package-dependent θJA and θJC values
• Power Dissipation: Temperature-dependent maximum power limits

Power Supply Requirements:

• Core Voltage: 5V ±5% (4.75V to 5.25V)
• I/O Voltage: TTL/CMOS compatible levels
• Power Consumption: Speed and utilization dependent
• Decoupling: Multiple VCC/GND pin pairs for optimal performance

Important Application Notes

📦 PLCC Package Advantages: Superior mechanical reliability and socket compatibility make this ideal for prototyping and field-replaceable applications

🔌 Socket Compatibility: Wide availability of PLCC-84 sockets enables easy system integration and maintenance

⚠️ Lead Content: Contains lead-based finish – consider regulatory requirements for specific applications

🌡️ Commercial Temperature: 0°C to 85°C operation suitable for most commercial and light industrial applications

📐 Compact Footprint: 29.31×29.31mm package optimizes board space utilization

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This comprehensive product information is compiled from multiple distributor sources and technical specifications. Always verify current availability, pricing, and compliance requirements with authorized distributors before procurement decisions.