Professional PCB Repair Solutions for Critical Electronic Components
Our specialized solder joint repair service provides expert reflowing and touch-up solutions to restore the integrity and functionality of your printed circuit boards. Whether dealing with cold joints, cracked connections, or component replacement needs, our technicians deliver precision repairs that meet industry standards.
Service Overview
Reflowing Services:
- Complete BGA (Ball Grid Array) rework and reballing
- Surface-mount component removal and reinstallation
- Thermal profiling for optimal reflow temperatures
- Lead-free and leaded solder compatibility
- Multi-layer PCB reflowing with controlled heating profiles
Touch-up Repair:
- Cold solder joint remediation
- Cracked or fractured joint restoration
- Component leg and pad repair
- Flux residue cleaning and surface preparation
- Precision hand-soldering for delicate components
Key Features
Advanced Equipment: State-of-the-art reflow stations with precise temperature control, infrared heating systems, and hot air rework tools ensure consistent, reliable repairs without thermal damage to surrounding components.
Quality Assurance: Every repair undergoes visual inspection, electrical continuity testing, and thermal cycling validation to guarantee long-term reliability and performance.
Component Compatibility: Expertise with a wide range of components including microprocessors, memory modules, power management ICs, connectors, and passive components across various package types.
Fast Turnaround: Most standard repairs completed within 24-48 hours, with expedited service available for critical applications.
Applications
- Automotive electronics and ECU repair
- Industrial control systems and automation equipment
- Consumer electronics and mobile device repair
- Aerospace and defense system maintenance
- Medical device component restoration
- Telecommunications equipment servicing
Technical Specifications
- Temperature Range: 50°C to 450°C with ±2°C accuracy
- Component Size: From 01005 passive components to large BGA packages
- PCB Thickness: Up to 6.4mm multi-layer boards supported
- Minimum Pitch: 0.3mm fine-pitch component capability
- Compliance: IPC-A-610 Class 2 and Class 3 standards
Contact us today to discuss your specific solder joint repair requirements and receive a detailed quote for your project.
