XC5202-PC84 Field Programmable Gate Array | Xilinx FPGA XC5200 Family Compact Solution

Product Specifications

Core Architecture

• Family: Xilinx XC5200 Series FPGA (Entry-Level Compact)
• Gate Count: 3,000 equivalent gates
• Logic Cells: 256 configurable logic blocks (CLBs)
• CLB Count: 64 configurable logic blocks
• Process Technology: Proven 0.5µm three-layer metal CMOS
• Operating Frequency: Up to 83MHz maximum system performance
• Supply Voltage: 4.75V to 5.25V (5V nominal)

Package Specifications

• Package Type: 84-Pin Plastic Leaded Chip Carrier (PLCC)
• Package Dimensions: 29.31mm x 29.31mm ultra-compact square footprint
• Package Thickness: 5.08mm standard PLCC profile
• Temperature Grade: Commercial (0°C to +85°C TJ)
• Speed Grade: Multiple variants available (contact for specific options)
• I/O Pins: 65 user I/O pins (maximum density for compact package)
• Mounting Type: Surface mount technology with J-lead configuration
• Lead Style: PLCC J-lead for reliable PCB attachment

Performance Characteristics

• Compact Form Factor: Smallest footprint option for 3K gate capacity
• Maximum I/O Density: 65 I/O pins in minimal package size
• SRAM-based reprogrammable architecture for unlimited design iterations
• VersaBlock logic modules with essential arithmetic and logic functions
• VersaRing I/O interface optimized for compact package constraints
• Zero flip-flop hold time simplifying timing analysis and closure
• Programmable output slew-rate control for signal integrity in dense layouts
• IEEE 1149.1 boundary scan support for production testing and debugging
• Internal oscillator for configuration timing and system startup

Electrical Specifications

• Maximum Operating Frequency: 83MHz internal clock performance
• Logic Resources: 256 logic elements with efficient compact routing
• Setup/Hold Times: Relaxed timing specifications for ease of implementation
• I/O Standards: 5V CMOS/TTL compatible interfaces
• Drive Capability: 8mA source/sink current per I/O pin
• Power Consumption: Low-power CMOS design optimized for portable applications
• Thermal Performance: Excellent heat dissipation in compact package

Price

Current Market Pricing for XC5202-PC84:

Quantity	Unit Price (USD)	Extended Price	Lead Time
1-24	$14.25	Starting at $14.25	12-16 weeks
25-99	$12.50	Starting at $312	10-12 weeks
100-499	$10.75	Starting at $1,075	8-10 weeks
500-999	$9.50	Starting at $4,750	6-8 weeks
1000+	$8.75	Starting at $8,750	4-6 weeks

Pricing reflects compact package premium and space-saving value. Legacy device availability subject to distributor inventory and extended manufacturing lead times. Prototype and development quantities available with expedited processing for time-critical projects.

Compact Package Benefits:

• Minimal PCB footprint maximizes board space utilization
• Reduced assembly costs with fewer placement operations
• Portable device compatibility for handheld and mobile applications
• Cost-effective prototyping with standard PLCC socket compatibility

Documents & Media

Technical Documentation

• XC5202-PC84 Datasheet (PDF): Complete electrical specifications and package details
• XC5200 Family Architecture Guide: Logic block structure and routing resources
• 84-Pin PLCC Package Information: Mechanical drawings, thermal data, and soldering guidelines
• Pin Assignment Manual: I/O distribution, power connections, and signal mapping
• Compact Design Guidelines: PCB layout best practices for space-constrained applications

PCB Design Resources

• PLCC Footprint Libraries: Optimized land patterns for major CAD systems
• 3D Package Models: STEP files for mechanical clearance verification
• Thermal Design Guide: Heat dissipation strategies for compact layouts
• Signal Integrity Models: IBIS models for high-speed design verification
• Assembly Guidelines: Soldering profiles and handling procedures for PLCC packages

Development Tools and Software

• Xilinx ISE Design Suite: Complete development environment with XC5202 support
• Compact Design Templates: Reference implementations optimized for space constraints
• VHDL/Verilog Libraries: Entry-level IP blocks and design templates
• Pin Planning Tools: I/O assignment utilities for optimal package utilization
• Configuration Software: Programming and debugging tools for PLCC packages

Application Resources

• Compact System Examples: Reference designs for space-constrained applications
• Portable Device Implementations: Battery-powered and mobile system designs
• Educational Projects: Learning exercises optimized for breadboard compatibility
• Migration Guides: Porting designs from larger packages to compact solutions
• Cost Optimization Strategies: Design techniques for volume production

Related Resources

Compact Development Solutions

• PLCC Socket Adapters: Breadboard-compatible development interfaces
• Compact Evaluation Boards: Minimal footprint prototyping platforms
• Socket-to-DIP Converters: Educational and laboratory compatibility modules
• Portable Programming Tools: Compact JTAG interfaces for field programming
• Mobile Development Kits: Battery-powered design and test platforms

Package and Form Factor Alternatives

• XC5202-PQ100: Same logic capacity in standard 100-pin PQFP package
• XC5202-VQ100: Enhanced thermal performance in Very Thin QFP package
• XC5204-PC84: Double gate count (6K gates) in same compact PLCC package
• XC5202-PG156: Ceramic package option for harsh environment applications
• XC5202-TQ144: Extended I/O count in thin quad flat pack

Target Applications and Markets

• Portable Electronics: Handheld devices, mobile instruments, and battery-powered systems
• Space-Constrained Embedded Systems: IoT devices, sensor nodes, and compact controllers
• Educational Applications: Student projects, laboratory exercises, and learning platforms
• Prototype Development: Rapid concept validation and proof-of-concept implementations
• Cost-Sensitive Products: High-volume consumer electronics and appliances
• Legacy System Replacement: Modernization of existing compact designs

Design Services and Support

• Compact PCB Design Services: Professional layout optimization for space constraints
• Package Migration Assistance: Expert guidance for form factor transitions
• Thermal Analysis Services: Heat dissipation modeling for compact applications
• Educational Support Programs: Academic resources and curriculum development
• Volume Production Planning: Supply chain optimization for high-volume applications
• Technical Consulting: Design review and optimization services

Environmental & Export Classifications

Environmental Compliance and Standards

• RoHS Compliance: Contains lead / RoHS non-compliant (legacy device with exemption)
• REACH Regulation: EU chemical safety documentation and substance declarations
• Conflict Minerals: Responsible sourcing verification and supply chain transparency
• ISO 14001: Environmental management system certified manufacturing processes
• WEEE Directive: Electronic waste management and recycling compliance
• Compact Device Recycling: Special handling procedures for small form factor components

Operating Environmental Specifications

• Junction Temperature: 0°C to +85°C (TJ) commercial grade operation
• Ambient Temperature Range: -40°C to +70°C with adequate thermal management
• Storage Temperature: -65°C to +125°C non-operating storage conditions
• Relative Humidity: 95% RH non-condensing maximum operational humidity
• Altitude Operation: Up to 2,000 meters above sea level operational
• Vibration Tolerance: Consumer electronics grade mechanical shock resistance
• Compact System Integration: Suitable for portable and mobile device environments

Export Control and Trade Classifications

• ECCN Classification: 3A991.a.2 (Export Administration Regulations)
• HTS Code: 8542.31.0001 (Harmonized Tariff Schedule classification)
• Schedule B: 8542.31.0001 (US export statistical reporting classification)
• Country of Origin: Multiple global manufacturing and assembly locations
• Portable Device Export: Simplified procedures for consumer electronics integration
• ITAR Status: Not controlled under International Traffic in Arms Regulations
• Educational Export: Special considerations for academic and research applications

Quality Assurance and Reliability

• Quality Management: ISO 9001:2015 certified production and testing processes
• Reliability Testing: Commercial grade qualification per industry standards
• Quality Grade: Entry-level commercial specifications with proven reliability
• MTBF Rating: >350,000 hours at 25°C ambient with proper thermal design
• Compact Package Reliability: Enhanced testing for space-constrained applications
• Long-term Stability: Proven performance in portable and mobile environments

Package Handling and Assembly

• MSL Rating: Moisture Sensitivity Level 3 (168 hours at 30°C/60% RH exposure)
• Baking Requirements: 125°C for 24 hours if moisture sensitivity limits exceeded
• ESD Protection: Class 1A (>1,000V Human Body Model minimum rating)
• PLCC Handling: Special procedures for J-lead package configuration
• Compact Assembly: Guidelines for high-density PCB mounting and soldering
• Storage Requirements: Dry storage in original moisture barrier packaging

Regulatory Certifications and Approvals

• Portable Electronics Certification: Compliance with mobile device standards
• UL Recognition: Component recognition program for consumer electronics
• CE Marking: European Conformity when integrated in compliant end products
• FCC Part 15: Digital device emission compliance for portable applications
• Compact Device Standards: Compliance with miniaturized electronics regulations
• Educational Safety: Suitable for supervised student laboratory environments

Supply Chain and Lifecycle Management

• Compact Component Supply: Specialized distribution for space-constrained applications
• Legacy Device Availability: Limited production for replacement and sustaining applications
• End-of-Life Planning: Migration guidance for obsolescence management
• Alternative Component Sourcing: Cross-reference options for supply continuity
• Volume Production Support: Supply chain optimization for high-volume manufacturing
• Technical Lifecycle: Limited ongoing support for existing designs only

Portable and Mobile Applications

• Battery-Powered Systems: Optimized for low-power portable applications
• Handheld Device Integration: Mechanical compatibility with compact form factors
• Mobile Communication: Suitable for wireless and communication device integration
• IoT and Sensor Applications: Space-efficient implementation for connected devices
• Wearable Technology: Form factor compatibility for body-worn electronics
• Compact Instrumentation: Laboratory and measurement device applications

Educational and Prototype Applications

• Breadboard Compatibility: Socket adapters available for educational use
• Student Project Suitability: Appropriate complexity for learning applications
• Laboratory Safety: Suitable for supervised educational environments
• Prototype Socket Support: Development-friendly with industry-standard sockets
• Academic Pricing: Special rates for educational institutions and student use
• Learning Platform Integration: Compatible with educational FPGA development boards

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Compact Solution Advantage: The XC5202-PC84 represents the optimal balance between functionality and form factor in the entry-level FPGA market, providing 3,000 gates and 65 I/O pins in the industry’s most compact package option. This space-efficient solution enables designers to implement programmable logic in applications where PCB real estate is critically limited, making it ideal for portable devices, compact embedded systems, and cost-sensitive products requiring minimal board space.

Legacy Device Notice for Compact Applications: While the XC5202-PC84 continues to serve existing compact applications and replacement needs, it represents legacy technology that is no longer recommended for new commercial product development. However, its unique combination of small footprint and adequate functionality makes it valuable for educational purposes, prototype development, and space-constrained legacy system maintenance where modern alternatives may not provide equivalent form factor benefits.

Modern Compact Alternatives: For new designs requiring similar compact form factors, consider current AMD Xilinx FPGA families that offer superior performance density, lower power consumption, modern development tools, and guaranteed long-term availability. These contemporary devices provide better performance per square millimeter while maintaining compatibility with space-constrained applications.

All specifications subject to verification through official documentation. Package dimensions and thermal characteristics critical for compact applications should be confirmed through mechanical drawings and thermal analysis. Contact authorized distributors for current availability and lead times for space-critical applications.