Product Specifications
The XC5210-5PQG208C delivers superior performance with extensive connectivity options through its detailed technical specifications:
Core Logic Architecture:
- Logic cells: 10,000+ equivalent gates for complex digital implementations
- Speed grade: -5 (high-performance speed tier)
- Package type: PQG208 (208-pin Plastic Quad Flat Pack with Ground leads)
- Operating temperature: Commercial grade (0ยฐC to +70ยฐC)
- Enhanced thermal performance with ground plane integration
Advanced I/O and Memory Features:
- Maximum I/O pins: 160+ user-configurable I/O pins
- Distributed RAM architecture with flexible memory allocation
- High-speed differential I/O support for advanced signaling
- Multiple voltage standard compatibility (5V, 3.3V, 2.5V, 1.8V)
- Programmable drive strength and slew rate control
- Advanced clocking resources with low-skew distribution networks
Configuration and Development:
- In-system programmable via IEEE 1149.1 JTAG interface
- Multiple configuration modes including master/slave serial
- Reconfigurable logic architecture for iterative design optimization
- Full design tool compatibility with major FPGA development suites
- Comprehensive boundary scan support for manufacturing test
Pricing Information
The XC5210-5PQG208C provides competitive pricing for high-density FPGA applications:
Commercial Pricing Structure:
- Engineering samples: Available for design evaluation and prototyping
- Low-volume orders: Competitive pricing for 100-499 unit quantities
- Production volumes: Attractive pricing tiers for 500+ unit orders
- High-volume commitments: Significant cost reductions for 2000+ unit agreements
Supply Chain Information:
- Standard lead time: 8-12 weeks through authorized distribution channels
- Expedited delivery: Rush orders available with premium pricing
- Global availability: Stocked by major electronics distributors worldwide
- Consignment programs: Available for high-volume OEM customers
For detailed pricing quotations and volume discounts, contact authorized semiconductor distributors or manufacturer sales representatives.
Documents & Media
Technical Documentation Suite:
- Comprehensive product datasheet with complete electrical specifications
- User programming guide with detailed configuration procedures
- Package mechanical specifications and thermal design guidelines
- Complete pinout diagrams with signal descriptions and assignments
- AC/DC timing specifications and characterization data
Design Support Materials:
- Application notes covering implementation best practices
- Reference design examples for common application scenarios
- Hardware description language (HDL) code libraries and templates
- Synthesis constraint files optimized for timing closure
- Power estimation worksheets and thermal analysis tools
Quality and Compliance Documentation:
- Manufacturing test specifications and quality control procedures
- Reliability qualification reports and accelerated life test data
- Environmental compliance certificates and material declarations
- Product change notification procedures and lifecycle management
Related Resources
Development Tools Ecosystem:
- Compatible with industry-leading FPGA design software suites
- Integrated development environments with graphical design entry
- Advanced simulation and verification tools for design validation
- Hardware debugging solutions including logic analyzers
- Programming hardware and USB-JTAG interface cables
Complementary Hardware Solutions:
- Precision clock generation and jitter cleaning circuits
- Multi-rail power management units optimized for FPGA applications
- High-speed memory solutions including SRAM and SDRAM interfaces
- Communication protocol controllers (Ethernet, USB, PCIe)
- Analog front-end components for mixed-signal system integration
Technical Support Infrastructure:
- Comprehensive online knowledge base with searchable documentation
- Active technical community forums with expert participation
- Direct access to field application engineers for design consultation
- Regular technical webinars and training workshops
- Custom design services and consultation programs
Environmental & Export Classifications
Environmental Regulatory Compliance:
- RoHS Directive 2011/65/EU: Fully compliant lead-free manufacturing process
- REACH Regulation (EC 1907/2006): Conformant with chemical substance restrictions
- Conflict Minerals Reporting: Compliant with Dodd-Frank Act Section 1502
- Packaging sustainability: Recyclable materials and reduced environmental impact
- WEEE Directive compliance: Proper end-of-life disposal and recycling support
Operating Environmental Specifications:
- Operating temperature range: 0ยฐC to +70ยฐC for commercial applications
- Extended storage range: -65ยฐC to +150ยฐC for long-term storage
- Humidity specifications: 5% to 95% relative humidity, non-condensing conditions
- Altitude rating: Operational up to 2000 meters above sea level
- Vibration resistance: MIL-STD-883 compliant for mechanical stress
- ESD protection: JEDEC JESD22-A114 Human Body Model certified
Export Control and Trade Compliance:
- Export Control Classification Number (ECCN): 3A001.a.7
- Bureau of Industry and Security (BIS): Subject to Export Administration Regulations
- Country of origin marking: Required for international shipments
- Dual-use technology: May require export licenses for specific end-use applications
- International Traffic in Arms Regulations (ITAR): Not subject to ITAR restrictions
Manufacturing Quality Standards:
- ISO 9001:2015: Manufactured under certified quality management systems
- ISO 14001: Environmental management system compliance
- IATF 16949: Automotive quality standard certification available
- IPC-A-610: Electronics assembly standard compliance
- AS9100: Aerospace quality standard certification for critical applications
- Statistical process control: Continuous monitoring and improvement programs
The XC5210-5PQG208C represents the ideal solution for engineers developing sophisticated digital systems requiring extensive I/O capabilities and proven reliability. Its combination of high-density logic resources, comprehensive connectivity options, and robust support ecosystem makes it exceptionally well-suited for next-generation telecommunications equipment, advanced industrial control systems, and complex embedded applications demanding maximum performance and flexibility.
