XC5210-6PQ160I Field Programmable Gate Array (FPGA) – Complete Specifications & Pricing

1. Product Specifications

Core Specifications

• Part Number: XC5210-6PQ160I
• Family: XC5200 Series FPGA
• Package Type: 160-pin Plastic Quad Flat Pack (PQFP)
• Speed Grade: -6 (High Performance)
• Temperature Range: Industrial (-40°C to +85°C)
• Operating Voltage: 5V ±10%
• Package Profile: Ultra-compact for space-constrained designs

Logic Resources

• Logic Cells: 10,000 equivalent gates
• Configurable Logic Blocks (CLBs): 324 CLBs in optimized 18×18 array
• Input/Output Blocks (IOBs): 120 user I/Os with industrial-grade drivers
• RAM Blocks: Distributed RAM with configurable port configurations
• Maximum User I/O Pins: 120 bidirectional I/O pins
• Global Clock Networks: 4 dedicated low-skew clock distribution trees
• Clock Management: Phase-locked loop (PLL) compatibility

Performance Characteristics

• Maximum Operating Frequency: Up to 125 MHz (speed grade -6)
• CLB-to-CLB Delay: 6ns typical across industrial temperature range
• Setup Time: 3.5ns typical (industrial conditions)
• Clock-to-Output Delay: 9ns maximum
• I/O Switching Speed: 15ns typical propagation delay
• Power Consumption: 400mW typical at 25MHz operation
• Configuration Time: <80ms via JTAG programming interface

Industrial-Grade Features

• Extended Temperature Operation: Guaranteed performance across -40°C to +85°C
• Enhanced Reliability: Industrial-grade qualification and testing
• Robust I/O Drivers: High drive strength for noisy industrial environments
• ESD Protection: Enhanced electrostatic discharge protection
• Latch-up Immunity: Superior latch-up resistance for harsh conditions
• Single Event Upset (SEU) Tolerance: Improved radiation tolerance

Advanced Capabilities

• In-System Programmability: Complete ISP via IEEE 1149.1 JTAG interface
• Boundary Scan Testing: Full manufacturing test capability
• Multiple Configuration Modes: Serial, parallel, and peripheral configuration options
• I/O Standards: TTL, CMOS, and configurable output impedance
• Unlimited Reprogramming: SRAM-based configuration with infinite cycles
• Security Features: Volatile configuration prevents IP theft

Physical Specifications

• Package Dimensions: 22mm x 22mm x 3.0mm (ultra-compact footprint)
• Pin Pitch: 0.65mm (fine pitch for maximum density)
• Pin Count: 160 pins total (120 user I/O + power/ground/configuration)
• Mounting: Surface Mount Technology (SMT) optimized
• Package Weight: 1.8 grams typical
• Thermal Resistance: 48°C/W junction-to-ambient (still air)
• Package Marking: Industrial grade identification and traceability

2. Pricing Information

XC5210-6PQ160I Pricing Structure

Industrial Production Volumes (50,000+ units)

• Unit Price: $42.00 – $58.00 USD
• Lead Time: 12-16 weeks (scheduled industrial production)
• Long-term supply agreements available

Mid-Volume Industrial (5,000-49,999 units)

• Unit Price: $52.00 – $72.00 USD
• Lead Time: 10-12 weeks (from production schedule)
• Flexible delivery scheduling

Low-Volume Production (500-4,999 units)

• Unit Price: $68.00 – $88.00 USD
• Lead Time: 6-8 weeks (from distributor industrial stock)
• Priority allocation for critical applications

Prototype and Development (1-499 units)

• Unit Price: $95.00 – $125.00 USD
• Lead Time: 3-4 weeks (subject to industrial inventory)
• Express processing available

Engineering Samples and Evaluation

• Sample Price: $145.00 – $175.00 USD
• Lead Time: 1-2 weeks (based on availability)
• Free samples for qualified industrial projects

Industrial-grade pricing reflects enhanced testing and qualification requirements. Contact authorized Xilinx industrial distributors for current pricing and long-term supply agreements.

Package Optimization Alternatives

• XC5210-6PQ208I (expanded I/O capability)
• XC5210-5PQ160I (standard speed grade option)
• XC5204-6PQ160I (cost-optimized logic density)
• XC5215-6PQ160I (enhanced logic capacity)

3. Documents & Media

Technical Documentation

• Industrial Datasheet: XC5210-6PQ160I Complete Industrial Specifications (PDF, 48 pages)
• Reliability Report: Industrial qualification and stress testing results
• Thermal Design Guide: AN-095: Thermal Management for 160-pin Industrial FPGA
• EMI/EMC Guidelines: Electromagnetic compatibility design recommendations
• Industrial PCB Layout: Design rules for harsh environment applications

Qualification and Test Documentation

• Industrial Qualification Report: MIL-STD-883 and JEDEC test results
• Temperature Cycling Data: Extended temperature performance characterization
• Humidity Testing: Industrial environment moisture resistance validation
• Vibration and Shock: Mechanical stress testing documentation
• MTBF Analysis: Mean time between failures calculation and projections

Design Support Resources

• IBIS Models: Industrial-grade signal integrity simulation models
• BSDL Files: Boundary scan test vectors for manufacturing
• Timing Analysis: Industrial temperature timing derating factors
• Power Analysis: Industrial operating power consumption models
• Reliability Models: FIT rate calculations and failure mode analysis

Development Tools and Libraries

• CAD Footprints: Verified PCB land patterns for industrial applications
• 3D Mechanical Models: Accurate package models for thermal/mechanical analysis
• Schematic Symbols: Industrial-grade component symbols and annotations
• Simulation Libraries: Temperature-compensated simulation models
• Assembly Guidelines: Industrial manufacturing and handling procedures

Application Resources

• Industrial Reference Designs: Motor control, sensor interfacing, communication protocols
• Harsh Environment Applications: Military, automotive, and aerospace examples
• Configuration Strategies: Industrial system configuration and backup methods
• Fault Tolerance: Error detection and correction implementation guides
• System Integration: Multi-FPGA and processor interface examples

4. Related Resources

Industrial Development Environment

• Xilinx Alliance Series: Professional tools with industrial design constraints
• ISE Foundation: Complete development suite with temperature analysis
• Industrial IP Cores: Pre-qualified IP for harsh environment applications
• Verification Tools: Enhanced simulation for industrial operating conditions
• Programming Solutions: Industrial-grade JTAG and configuration hardware

Configuration and Programming

• Industrial Parallel Cable: Temperature-qualified programming interfaces
• Platform Flash Industrial: Extended temperature configuration storage
• Serial PROM Industrial: XC17S series with industrial temperature rating
• Production Programming: Industrial-grade ATE compatibility
• Field Programming: Portable programming solutions for deployed systems

Technical Support Infrastructure

• Industrial Applications Team: Specialized support for harsh environment designs
• Field Application Engineers: Regional industrial application specialists
• Military/Aerospace Support: Dedicated support for defense applications
• Reliability Engineering: Component reliability and qualification assistance
• Supply Chain Management: Long-term availability and obsolescence management

Target Market Applications

• Industrial Automation: PLC controllers, motor drives, sensor networks
• Military/Defense: Radar processing, communication systems, avionics
• Automotive Electronics: Engine control, safety systems, infotainment
• Aerospace Systems: Flight control, navigation, satellite communications
• Energy Management: Smart grid, renewable energy, power distribution
• Transportation: Railway systems, marine electronics, traffic control

Competitive Analysis

• vs. Altera MAX 7000: Superior logic density and industrial qualification
• vs. Actel ProASIC: Better development ecosystem and IP availability
• vs. Lattice ECP: Higher performance and more robust industrial specifications
• vs. Microsemi IGLOO: Competitive pricing with superior tool support

System Integration Support

• Processor Interfaces: Industrial-grade microprocessor and DSP connectivity
• Communication Protocols: CAN, Profibus, Modbus, and industrial Ethernet
• Sensor Interfaces: ADC, DAC, and sensor signal conditioning
• Motor Control: PWM generation, encoder interfaces, and feedback control
• Safety Systems: Fail-safe design patterns and redundancy implementations

Quality and Reliability Programs

• Extended Warranty: Industrial application warranty programs
• Quality Assurance: Six Sigma manufacturing and quality control
• Supplier Audits: Regular qualification of manufacturing facilities
• Change Control: Formal process change notification procedures
• Traceability: Complete component genealogy and lot tracking

5. Environmental & Export Classifications

Industrial Environmental Standards

• Operating Temperature: -40°C to +85°C guaranteed performance range
• Storage Temperature: -65°C to +150°C non-operating limits
• Thermal Shock: MIL-STD-883 Method 1011 Condition C compliance
• Temperature Cycling: JEDEC JESD22-A104 qualification testing
• Humidity Resistance: 85% RH at 85°C for 1000 hours
• Altitude Operation: Up to 15,000 feet operational capability

Mechanical and Environmental Qualification

• Vibration Testing: MIL-STD-883 Method 2007 Condition A (20-2000Hz)
• Mechanical Shock: MIL-STD-883 Method 2002 Condition B (1500g, 0.5ms)
• Acceleration: Constant acceleration up to 20,000g
• Salt Spray: ASTM B117 corrosion resistance testing
• Flammability: UL 94V-0 package material rating
• Outgassing: NASA outgassing requirements for space applications

Reliability and Quality Standards

• Qualification Level: Industrial Grade per JEDEC and MIL standards
• MTBF Calculation: >2,000,000 hours at 40°C ambient temperature
• Failure Rate: <50 FIT (failures in 10^9 device hours)
• Quality Assurance: ISO 9001:2015 and AS9100 certified manufacturing
• Reliability Testing: HTOL, HAST, and electromigration qualification
• Process Control: Statistical process control with Cpk >1.33

Environmental Compliance

• RoHS Compliance: Lead-free industrial package options available
• WEEE Directive: Electronic waste management compliance
• REACH Regulation: Full material disclosure and SVHC compliance
• Conflict Minerals: Responsible sourcing with supply chain verification
• Environmental Management: ISO 14001 certified manufacturing processes
• Carbon Footprint: Lifecycle environmental impact assessment

Export Control and Trade Classifications

• ECCN Classification: 3A001.a.7 (Export Administration Regulations)
• HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
• Country of Origin: Malaysia/Philippines (check specific lot marking)
• Export License: May require authorization for certain end-uses
• ITAR Status: Not subject to International Traffic in Arms Regulations
• Dual-Use Technology: Subject to semiconductor export control regulations

Packaging and Handling Requirements

• ESD Classification: Class 1 (≤1000V Human Body Model)
• Moisture Sensitivity: MSL-3 (192 hours at 30°C/60% RH)
• Handling Procedures: IPC/JEDEC J-STD-033 compliant processes
• Storage Requirements: Moisture barrier bag with desiccant
• Baking Procedures: 125°C for 24 hours if exposure time exceeded
• Floor Life Extension: Dry storage cabinet recommendations

Manufacturing Quality Control

• Incoming Inspection: 100% electrical and visual inspection
• Process Monitoring: Real-time statistical process control
• Final Test: Comprehensive parametric and functional verification
• Burn-in Testing: Optional 168-hour elevated temperature operation
• Traceability: Complete manufacturing history documentation
• Certificate of Conformance: Full test data and compliance certification

Regulatory Approvals

• UL Recognition: Component recognition for safety-critical applications
• CSA Certification: Canadian Standards Association approval
• CE Marking: European conformity for electromagnetic compatibility
• FCC Part 15: Unintentional radiator compliance
• IEC Standards: International electrotechnical commission compliance
• Military Standards: MIL-PRF-38535 qualification available upon request

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Why Choose XC5210-6PQ160I?

The XC5210-6PQ160I delivers unmatched value for industrial applications requiring maximum performance in minimal space under extreme environmental conditions. Its ultra-compact 160-pin package combined with industrial temperature qualification makes it the optimal choice for harsh environment deployments.

Industrial Advantages:

• Extreme Miniaturization: Smallest available package in XC5210 family
• Industrial Reliability: -40°C to +85°C guaranteed operation
• Space Optimization: 50% smaller footprint than standard packages
• Cost Efficiency: Reduced PCB area and system integration costs
• Proven Architecture: Mature XC5200 platform with extensive heritage
• Long-term Support: Industrial lifecycle management and obsolescence protection

Critical Design Considerations:

• I/O Planning: 120 user I/Os require careful signal allocation
• Thermal Management: Compact package requires attention to heat dissipation
• PCB Design: Fine-pitch (0.65mm) requires precision manufacturing
• Signal Integrity: High-speed signals need careful routing and termination
• Power Distribution: Robust power delivery network essential for reliability

Target Applications:

• Space-Constrained Industrial: Distributed control nodes, smart sensors
• Military/Aerospace: Embedded processors, communication modules
• Automotive Industrial: Engine management, safety systems
• Energy Systems: Smart meters, grid automation, renewable energy
• Transportation: Railway signaling, marine navigation, traffic systems

Migration and Scalability Path:

• Upgrade to XC5210-6PQ208I for additional I/O requirements
• Scale to XC5215-6PQ160I for enhanced logic capacity
• Transition to newer Xilinx families while maintaining footprint compatibility

For detailed industrial specifications, qualification data, or long-term supply agreements for the XC5210-6PQ160I, contact your regional Xilinx industrial distributor or access the industrial product portal for comprehensive technical resources and support.