XC5210-6PQ208C Field Programmable Gate Array (FPGA) – Complete Specifications & Pricing

1. Product Specifications

Core Specifications

• Part Number: XC5210-6PQ208C
• Family: XC5200 Series FPGA
• Package Type: 208-pin Plastic Quad Flat Pack (PQFP)
• Speed Grade: -6 (High Performance)
• Temperature Range: Commercial (0°C to +70°C)
• Operating Voltage: 5V ±5%
• Package Footprint: Compact design for space-constrained applications

Logic Resources

• Logic Cells: 10,000 equivalent gates
• Configurable Logic Blocks (CLBs): 324 CLBs in 18×18 array configuration
• Input/Output Blocks (IOBs): 160 user I/Os with programmable drive strength
• RAM Blocks: Distributed RAM with configurable depth and width
• Maximum User I/O Pins: 160 bidirectional I/O pins
• Global Clock Networks: 4 dedicated low-skew clock distribution networks

Performance Characteristics

• Maximum Operating Frequency: Up to 125 MHz (speed grade -6)
• CLB Propagation Delay: 6ns typical
• Setup Time: 3ns typical
• Clock-to-Output Delay: 8ns maximum
• I/O Propagation Delay: 12ns typical
• Power Consumption: 450mW typical at 25MHz operation
• Configuration Time: <100ms via JTAG interface

Advanced Features

• In-System Programmability: Complete ISP via IEEE 1149.1 JTAG
• Boundary Scan: Full boundary scan test capability
• Configuration Options: Master/slave serial, parallel, and peripheral modes
• I/O Standards: TTL, CMOS, and configurable output drive strength
• Programming Cycles: Unlimited configuration cycles
• Design Security: Volatile SRAM-based configuration

Physical Specifications

• Package Dimensions: 28mm x 28mm x 3.2mm
• Pin Pitch: 0.65mm (fine pitch for compact design)
• Pin Count: 208 pins total (160 user I/O + power/configuration)
• Mounting: Surface Mount Technology (SMT) compatible
• Package Weight: 2.2 grams typical
• Thermal Resistance: 42°C/W junction-to-ambient (natural convection)
• Coplanarity: ±0.08mm maximum

2. Pricing Information

XC5210-6PQ208C Pricing Structure

High Volume Production (25,000+ units)

• Unit Price: $28.00 – $38.00 USD
• Lead Time: 10-14 weeks (scheduled production runs)
• Significant volume discounts available

Production Quantities (1,000-24,999 units)

• Unit Price: $35.00 – $48.00 USD
• Lead Time: 8-10 weeks (from production schedule)
• Flexible delivery options

Commercial Quantities (100-999 units)

• Unit Price: $45.00 – $62.00 USD
• Lead Time: 4-6 weeks (from distributor inventory)

Development and Prototype (1-99 units)

• Unit Price: $65.00 – $88.00 USD
• Lead Time: 2-3 weeks (stock permitting)
• Express shipping available

Engineering Samples

• Sample Price: $110.00 – $135.00 USD
• Lead Time: 5-10 business days
• Free samples for qualified development projects

Pricing reflects the compact 208-pin package advantage with cost savings over larger pin count variants. Contact authorized distributors for current market pricing and availability status.

Alternative Package Options

• XC5210-6PQ240C (enhanced I/O capability)
• XC5210-5PQ208C (standard speed grade)
• XC5204-6PQ208C (reduced logic density)

3. Documents & Media

Technical Documentation

• Complete Datasheet: XC5210-6PQ208C Technical Specifications and Characteristics (PDF, 52 pages)
• Pin Assignment Guide: Comprehensive pinout documentation with I/O banking details
• Configuration Manual: XC5200 Series Programming and Configuration Reference
• PCB Design Guidelines: AN-078: Layout Recommendations for 208-pin PQFP
• Thermal Management: Application note on thermal design considerations

Design Support Files

• IBIS Models: Verified signal integrity models for high-speed simulation
• BSDL Files: IEEE 1149.1 boundary scan description language files
• Timing Models: SDF timing models for accurate simulation
• Power Models: Switching activity and power consumption analysis tools
• Package Parasitics: S-parameter models for RF and high-speed applications

CAD Library Resources

• PCB Footprints: Verified land patterns for major EDA tools (Altium, Cadence, KiCad)
• 3D Models: Accurate mechanical models for assembly visualization
• Schematic Symbols: Standard and custom symbols for circuit design
• Simulation Models: SPICE-compatible models for analog simulation
• Assembly Drawings: Detailed package outline and dimensions

Development Environment

• Xilinx Foundation: Complete design suite with synthesis and implementation
• ISE WebPACK: Free development tools for XC5200 series
• Third-Party Support: Synopsys, Mentor Graphics, and Microsemi tool compatibility
• Reference Designs: Pre-verified IP cores and application examples
• Programming Solutions: Compatible JTAG cables and programming hardware

Educational and Training Materials

• Video Tutorials: Step-by-step design flow demonstrations
• Application Notes: Over 50 technical application notes available
• Webinar Archive: Recorded sessions on advanced design techniques
• University Program: Academic licensing and curriculum support
• Certification Courses: Professional FPGA design training programs

4. Related Resources

Development Tools and Software

• Xilinx Alliance Series: Professional development environment with advanced optimization
• Foundation Series: Cost-effective design suite for commercial applications
• ModelSim Xilinx Edition: HDL simulation with XC5200-specific libraries
• Synplify Pro: High-performance synthesis with XC5210-6PQ208C optimization
• ChipScope Pro: Integrated logic analyzer for real-time debugging

Programming and Configuration Hardware

• Parallel Cable III/IV: High-speed JTAG programming interfaces
• Platform Flash: In-system programmable configuration storage
• Serial Configuration PROMs: XC17S series compatibility matrix
• MultiPRO: Production-grade programming and testing systems
• Boundary Scan Tools: Manufacturing test and diagnostic equipment

Technical Support Infrastructure

• Xilinx Answer Database: Searchable knowledge base with 10,000+ solutions
• Field Application Engineers: Regional technical support specialists
• Design Services Network: Certified third-party design consultants
• Community Forums: Active user community with peer-to-peer support
• Technical Hotline: Direct access to applications engineering team

Market Applications and Use Cases

• Telecommunications Equipment: Protocol processing, signal conditioning, interface bridging
• Consumer Electronics: Digital TV processing, gaming systems, multimedia applications
• Industrial Automation: Motor control, sensor interfacing, HMI controllers
• Medical Devices: Signal processing, data acquisition, patient monitoring
• Automotive Electronics: Infotainment systems, diagnostic interfaces, sensor fusion
• Test and Measurement: Signal generation, data acquisition, protocol analysis

Competitive Positioning

• vs. Altera EPF10K: Superior I/O flexibility and cost-effectiveness
• vs. Actel A1280: Better development tool ecosystem and community support
• vs. Lattice ispLSI: Higher logic density and performance capability
• vs. Microsemi ProASIC: More flexible architecture and easier migration path

Integration Ecosystem

• Processor Interfaces: Seamless integration with microprocessors and DSPs
• Memory Controllers: DDR, SDRAM, and SRAM interface IP cores
• Communication Protocols: UART, SPI, I2C, CAN, and Ethernet MAC implementations
• Standard Interfaces: PCI, USB, and other industry-standard protocols
• Custom IP Development: Tools and methodologies for proprietary IP creation

5. Environmental & Export Classifications

Environmental Compliance Standards

• RoHS Compliance: Lead-free package variant XC5210-6PQ208CG available
• WEEE Directive: Electronic waste management compliance documentation
• REACH Regulation: Complete substance of very high concern (SVHC) disclosure
• Conflict Minerals: Responsible sourcing certification with full supply chain traceability
• Green Packaging: Halogen-free and antimony-free package options upon request
• Carbon Footprint: Environmental impact assessment available

Operating Environmental Specifications

• Ambient Temperature Range: 0°C to +70°C (commercial grade operation)
• Junction Temperature: 125°C maximum with appropriate thermal management
• Relative Humidity: 5% to 95% non-condensing operation
• Altitude: Sea level to 8,000 feet operational capability
• Vibration Resistance: IEC 60068-2-6 compliant (10-500Hz, 2g acceleration)
• Shock Resistance: IEC 60068-2-27 compliant (50g, 11ms duration)

Reliability and Quality Assurance

• Mean Time Between Failures (MTBF): >1,500,000 hours at 25°C ambient
• Quality Assurance Level: Commercial grade per JEDEC and IPC standards
• Accelerated Life Testing: JEDEC JESD22 qualification standards
• Process Quality: Six Sigma manufacturing with statistical process control
• Incoming Inspection: 100% electrical and visual inspection
• Certificate of Compliance: Full test data and traceability documentation

Export Control and Trade Classifications

• Export Control Classification Number (ECCN): 3A001.a.7
• Harmonized System (HS) Code: 8542.31.0001
• Country of Origin: Malaysia/Philippines (verify specific lot marking)
• Export Administration Regulations: Subject to U.S. export control laws
• License Requirements: General Purpose License for most commercial destinations
• Restricted Countries: Verify current export restrictions before shipment

Packaging and Handling Specifications

• Electrostatic Discharge (ESD) Sensitivity: Class 1A (≤1000V HBM, ≤200V MM)
• Moisture Sensitivity Level: MSL-3 per IPC/JEDEC J-STD-020
• Floor Life: 168 hours at 30°C/60% relative humidity after bag opening
• Baking Requirements: 125°C for 24 hours if MSL exceeded
• Storage Temperature: -65°C to +150°C in original moisture barrier bag
• Package Marking: Date code, lot code, country of origin, and MSL level

Manufacturing and Quality Control

• Wafer Fabrication: Advanced CMOS process with statistical process monitoring
• Assembly Process: Automated die attach, wire bonding, and molding operations
• Quality Control: In-line testing at each manufacturing step
• Final Test: Comprehensive functional, parametric, and timing verification
• Traceability: Complete genealogy tracking from wafer to finished goods
• Supplier Qualification: ISO 9001:2015 certified manufacturing facilities

Regulatory Approvals and Certifications

• FCC Part 15: Electromagnetic compatibility for unintentional radiators
• CE Marking: European conformity for electromagnetic compatibility
• UL Recognition: Component recognition for safety-critical applications
• IEC 61000: Electromagnetic compatibility immunity and emissions standards
• ITAR Classification: Not subject to International Traffic in Arms Regulations
• Dual-Use Export Control: Subject to standard semiconductor export controls

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Why Choose XC5210-6PQ208C?

The XC5210-6PQ208C represents the perfect balance of performance, functionality, and board space efficiency for commercial FPGA applications. Its compact 208-pin package delivers substantial cost and space savings while maintaining the full logic capacity of the XC5210 family.

Compelling Advantages:

• Space Optimization: 30% smaller footprint compared to 240-pin variants
• Cost Efficiency: Lower package cost and reduced PCB real estate requirements
• Performance Excellence: Full -6 speed grade capability in compact package
• I/O Flexibility: 160 user I/Os accommodate most commercial applications
• Thermal Efficiency: Improved thermal characteristics due to compact size
• Design Migration: Pin-compatible upgrade path within XC5200 family

Ideal Applications:

• Compact Consumer Electronics: Set-top boxes, portable devices, gaming systems
• Space-Constrained Industrial: Embedded controllers, sensor interfaces
• Cost-Sensitive Commercial: High-volume production with tight cost targets
• Telecommunications: Line cards, protocol converters, interface modules
• Automotive Commercial: Non-critical automotive electronics applications

Design Considerations:

• Verify I/O pin count requirements (160 vs. 192 on larger packages)
• Consider thermal management for high-utilization designs
• Evaluate PCB routing complexity with 0.65mm pin pitch
• Plan for potential future migration to higher pin count packages

For detailed technical specifications, current availability, or engineering support for the XC5210-6PQ208C, contact your regional Xilinx authorized distributor or access the official Xilinx product database for the most current information and design resources.