XA3S1500-4FGG676C FPGA: High-Density Spartan-3A Commercial Grade Programmable Logic Device

Product Specifications

Logic Resources

• Device Family: Xilinx Spartan-3A
• System Gates: 1,500,000 gates
• Configurable Logic Blocks (CLBs): 13,824
• 4-Input Look-Up Tables: 27,648 LUTs
• Storage Elements: 27,648 flip-flops/latches
• Maximum Logic Utilization: 99% with advanced placement tools

Memory Architecture

• Block RAM: 1,872 Kb total (104 blocks × 18 Kb each)
• Distributed RAM: 216 Kb using LUT-based memory
• RAM Configurations: Single-port, dual-port, FIFO modes
• Memory Cascading: Support for larger memory implementations
• External Memory Interface: DDR, DDR2, SDRAM controller support

DSP and Arithmetic Resources

• Dedicated Multipliers: 104 × 18×18 bit multipliers
• DSP Performance: Up to 208 GMAC/s (Giga Multiply-Accumulates per second)
• Arithmetic Functions: Built-in carry chains for fast arithmetic
• Signal Processing: Optimized for FIR filters, FFT, and correlation functions

Package Specifications

• Package Type: FBGA (Fine-Pitch Ball Grid Array)
• Total Pins: 676 balls
• Ball Pitch: 1.0mm spacing
• Package Dimensions: 27mm × 27mm × 2.23mm
• Speed Grade: -4 (high performance)
• Temperature Grade: C (Commercial: 0°C to +85°C)

I/O and Connectivity

• User I/O Pins: 487 maximum user I/Os
• I/O Voltage Banks: 8 independent banks
• Supported I/O Standards: 3.3V, 2.5V, 1.8V, 1.5V, 1.2V LVCMOS/LVTTL
• Differential I/O: Up to 243 LVDS pairs
• SelectIO Technology: Advanced I/O capabilities with programmable drive strength

Clock Management System

• Digital Clock Managers: 8 DCMs for clock generation and distribution
• Frequency Synthesis: Clock multiplication and division
• Phase Shifting: Precise clock phase adjustment
• Clock Networks: 24 global clock lines, regional clocking
• Maximum Clock Frequency: 200+ MHz (design dependent)

Power Specifications

• Core Voltage (VCCINT): +1.2V ±5%
• I/O Voltage (VCCIO): +1.2V to +3.3V (bank dependent)
• Auxiliary Voltage (VCCAUX): +2.5V ±5%
• Power Consumption: 1.5W to 4W typical (application dependent)

Price Information

The XA3S1500-4FGG676C offers competitive pricing for commercial applications:

Current Market Pricing

• Single Unit Purchase: $120-180 USD
• Small Quantity (10-49): $100-150 USD
• Medium Volume (50-249): $85-125 USD
• Large Volume (250-999): $70-110 USD
• Production Volume (1000+): $55-95 USD

Cost Considerations

• Commercial Grade Advantage: 20-30% cost savings vs industrial grade
• Package Premium: FBGA offers better thermal performance than PQFP
• Volume Discounts: Significant savings available for large orders
• Long-term Availability: Xilinx committed support through 2030+

Regional Pricing Variations

• North America: Base pricing reference
• Europe: EUR equivalent plus 5-10% regional premium
• Asia-Pacific: Competitive pricing with local distribution
• Emerging Markets: Special pricing programs available

Pricing reflects current market conditions and may vary by distributor, lead time, and order volume. Contact authorized Xilinx partners for detailed quotations.

Documents & Media

Core Technical Documentation

• Primary Datasheet: DS529 – Spartan-3A FPGA Family Data Sheet
• Complete Data Sheet: UG331 – Comprehensive specifications and characteristics
• Package Documentation: Mechanical drawings, thermal models, assembly guidelines
• Pin Definition: Complete pinout tables with signal descriptions
• Electrical Characteristics: DC/AC parameters, timing specifications

Design Implementation Guides

• PCB Design Guide: UG333 – Layout guidelines, signal integrity considerations
• Configuration Guide: UG332 – Programming methods and configuration options
• Power Design: Application notes for power supply design and sequencing
• Thermal Management: Thermal analysis and cooling recommendations
• Signal Integrity: High-speed design practices and simulation models

Software Development Resources

• ISE Design Suite: Complete development environment documentation
• Constraint Templates: UCF file examples and timing constraints
• IP Core Documentation: Memory controllers, communication interfaces
• Simulation Models: Behavioral and timing models for major simulators
• Programming Software: iMPACT configuration tool documentation

Application Resources

• Reference Designs: Communication systems, signal processing applications
• White Papers: Architecture deep-dives and optimization techniques
• Application Notes: Specific implementation guidance and best practices
• Video Tutorials: Step-by-step design flow demonstrations
• Webinar Archives: Technical presentations and Q&A sessions

Related Resources

Development and Evaluation Tools

• Spartan-3A Starter Kit: Complete evaluation platform with XA3S700
• Development Boards: Third-party platforms featuring XA3S1500-4FGG676C
• Programming Cables: Platform Cable USB, JTAG boundary scan tools
• Debug Tools: ChipScope Pro integrated logic analyzer

Compatible Product Family

• Lower Density Options: XA3S700-4FGG484C, XA3S1000-4FGG676C
• Higher Density: XA3S2000-4FGG676C (where available)
• Alternative Packages: XA3S1500-4FGG320C (smaller footprint option)
• Different Speed Grades: XA3S1500-5FGG676C (lower power/cost option)

Configuration and Support Devices

• Configuration Memory: XCF32P, XCF64P Platform Flash PROMs
• Serial Configuration: SPI Flash memories for cost-effective configuration
• JTAG Chain: Boundary scan test and configuration support
• Power Management: Multi-rail power solutions and sequencing controllers

Software and IP Ecosystem

• Xilinx ISE: Primary development environment (versions 12.1-14.7)
• IP Core Library: Extensive catalog of verified intellectual property
• Third-Party IP: Partner ecosystem for specialized functions
• Simulation Tools: ModelSim, ISIM, Vivado Simulator compatibility
• Synthesis Tools: XST, Synplify Pro, Precision RTL support

Application Markets

• Telecommunications: Base stations, routers, protocol processing
• Industrial Automation: Motion control, machine vision, HMI systems
• Consumer Electronics: Set-top boxes, digital cameras, gaming
• Medical Equipment: Ultrasound, patient monitoring, diagnostic imaging
• Automotive: Infotainment, ADAS, powertrain control

Training and Support Services

• Xilinx University Program: Educational resources and academic support
• Online Training: Self-paced courses and certification programs
• Technical Support: Web-based support portal and community forums
• Consulting Services: Design review, optimization, and troubleshooting
• Alliance Partners: Network of certified design service providers

Environmental & Export Classifications

Environmental Compliance Standards

• RoHS Directive: Compliant with EU Restriction of Hazardous Substances
• REACH Regulation: Meets European chemical safety requirements
• Halogen-Free: Lead-free and halogen-free package options available
• Green Manufacturing: ISO 14001 certified production facilities
• Recycling Programs: End-of-life product recycling support

Operating Environmental Conditions

• Commercial Temperature Range: 0°C to +85°C junction temperature
• Storage Temperature: -65°C to +150°C
• Relative Humidity: 5% to 85% non-condensing
• Operating Altitude: Sea level to 2000 meters
• Thermal Resistance: θJA = 25°C/W (typical with adequate airflow)

Reliability and Quality Specifications

• Quality System: ISO 9001:2015 certified manufacturing
• Reliability Standard: JEDEC JESD47 qualification testing
• MTBF Rating: >1,000,000 hours at rated conditions
• ESD Protection: Human Body Model Class 2 (≥2000V)
• Latch-up Immunity: >100mA per JEDEC standard

Package and Handling Requirements

• Moisture Sensitivity Level: MSL-3 per JEDEC J-STD-020
• Baking Requirements: 125°C for 24 hours if exposure limits exceeded
• ESD Precautions: Class 2 ESD sensitive device handling required
• Storage Conditions: <30°C, <70% RH in moisture barrier bag
• Shelf Life: 12 months in unopened moisture barrier packaging

Export Control and Trade Compliance

• Export Control Classification: ECCN 3A001.a.7 (US Commerce Control List)
• Export License Requirements: May require authorization for restricted countries
• Dual-Use Technology: Subject to international export regulations
• Country of Origin: Varies by manufacturing location and date code
• Harmonized Tariff Code: 8542.39.0001

Regulatory Certifications

• CE Marking: European Conformity for properly designed applications
• FCC Part 15: Compliant for digital device implementations
• UL Component Recognition: Available for safety-critical applications
• International Standards: IEC, ANSI, JIS compliance where applicable
• Automotive Qualification: Commercial grade suitable for Tier 2/3 applications

Supply Chain Information

• Conflict Minerals: Compliant with Dodd-Frank Section 1502
• Supplier Code of Conduct: Ethical sourcing and labor practices
• Traceability: Full lot tracking from wafer to finished device
• Quality Certifications: ISO/TS 16949 automotive quality system
• Continuous Monitoring: Ongoing compliance verification and auditing

The XA3S1500-4FGG676C represents an excellent balance of performance, features, and cost-effectiveness for commercial FPGA applications. Its comprehensive feature set, robust development ecosystem, and proven reliability make it an ideal choice for high-volume commercial products requiring advanced programmable logic capabilities.