1. Product Specifications
Core Architecture
- Device Family: Spartan-3E FPGA
- Logic Cells: 500,000 system gates
- Configurable Logic Blocks (CLBs): 1,164 CLBs
- Distributed RAM: 73K bits
- Block RAM: 360K bits (20 blocks of 18K bits each)
- Dedicated Multipliers: 20 embedded 18×18 multipliers
Package & Pin Configuration
- Package Type: FT256 (Fine-Pitch Ball Grid Array)
- Pin Count: 256 pins
- Package Size: 17mm x 17mm
- Ball Pitch: 1.0mm
Performance Specifications
- Speed Grade: -4 (high performance)
- Maximum Frequency: Up to 200+ MHz
- Temperature Range: -40ยฐC to +125ยฐC (Automotive grade)
- Supply Voltage: 1.2V core, 3.3V I/O
I/O Capabilities
- User I/O Pins: 190 user I/O pins
- Differential I/O Pairs: 95 pairs
- Supported I/O Standards: LVTTL, LVCMOS, LVDS, SSTL, HSTL
- Digital Clock Manager (DCM): 4 DCMs for clock management
2. Price Information
Pricing for the XA3S500E-4FT256I varies based on quantity, supplier, and market conditions. For current pricing information, please contact authorized Xilinx distributors or check electronic component marketplaces. Typical price ranges for automotive-grade FPGAs in this category fall between $50-$150 per unit, depending on volume and sourcing.
3. Documents & Media
Technical Documentation
- Datasheet: Spartan-3E FPGA Family Complete Data Sheet
- User Guide: Spartan-3 Generation Configuration Guide
- Application Notes: Power consumption, PCB design guidelines
- Package Information: FT256 package drawings and specifications
Development Resources
- Design Tools: Xilinx ISE Design Suite compatibility
- Reference Designs: Sample projects and IP cores
- Evaluation Boards: Spartan-3E development kits
- Simulation Models: IBIS and SPICE models available
4. Related Resources
Development Tools
- Xilinx ISE WebPACK: Free design software
- ChipScope Pro: Integrated logic analyzer
- EDK (Embedded Development Kit): For embedded processor designs
- System Generator: MATLAB/Simulink integration
Compatible IP Cores
- MicroBlaze Soft Processor: 32-bit RISC processor
- Memory Controllers: DDR, DDR2, QDR SRAM controllers
- Communication Interfaces: Ethernet MAC, PCI, USB
- DSP Functions: FIR filters, FFT, DDS
Evaluation Platforms
- Spartan-3E Starter Kit: Complete development platform
- Automotive Development Board: Specialized for automotive applications
- Third-party Development Boards: Various form factors available
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free package construction
- Automotive Grade: AEC-Q100 qualified
- Operating Temperature: -40ยฐC to +125ยฐC junction temperature
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: Up to 85% relative humidity (non-condensing)
Export Classifications
- ECCN (Export Control Classification Number): 3A991.a.2
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Varies by manufacturing location
- Export License: May require export license for certain destinations
Quality & Reliability
- Qualification Level: Automotive (XA grade)
- MTBF: >1,000,000 hours at 55ยฐC
- Radiation Tolerance: Standard commercial grade
- ESD Protection: Human Body Model (HBM) Class 2
The XA3S500E-4FT256I represents an excellent choice for designers requiring robust, high-performance FPGA solutions in automotive and industrial applications. Its combination of ample logic resources, automotive-grade reliability, and comprehensive development tool support makes it suitable for a wide range of programmable logic applications requiring operation in demanding environmental conditions.
For technical support, design consultation, or procurement assistance with the XA3S500E-4FT256I, contact authorized Xilinx distributors or field application engineers.
