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XA3S1500-4FG676I: High-Performance Spartan-3A FPGA Solution

Original price was: $20.00.Current price is: $19.00.

Product Specifications

Core Architecture

  • Device Family: Spartan-3A FPGA
  • Logic Cells: 1,500,000 system gates
  • Configurable Logic Blocks (CLBs): 13,696 slices
  • Block RAM: 1,872 Kbits total capacity
  • Distributed RAM: 216 Kbits
  • Dedicated Multipliers: 104 embedded 18×18 multipliers

Package & Pinout

  • Package Type: 676-pin Fine-Pitch Ball Grid Array (FG676)
  • Package Size: 27mm x 27mm
  • Ball Pitch: 1.0mm
  • Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
  • Speed Grade: -4 (high performance)

I/O Capabilities

  • User I/O Pins: 502 maximum
  • Differential I/O Pairs: 251 pairs
  • I/O Standards Support: LVDS, LVPECL, HSTL, SSTL, GTL+
  • Maximum I/O Frequency: Up to 622 Mbps

Memory & Processing

  • Block RAM Blocks: 104 dual-port blocks
  • FIFO Support: Hardware FIFO implementation
  • Clock Management: 8 Digital Clock Managers (DCMs)
  • Phase-Locked Loops: 8 PLLs for precise timing

Pricing Information

Quantity Unit Price (USD) Extended Price
1-9 units $485.00 Contact for quote
10-24 units $425.00 Volume discount available
25-99 units $385.00 Contact sales team
100+ units Contact sales Custom pricing

Prices subject to change. Contact authorized distributors for current pricing and availability.

Lead Time: 12-16 weeks for standard orders Minimum Order Quantity: 1 unit Payment Terms: Net 30 days for qualified customers

Documents & Media

Technical Documentation

  • XA3S1500-4FG676I Datasheet (PDF, 2.8MB)
    • Complete electrical specifications
    • Pin assignment details
    • Timing characteristics
    • Package mechanical drawings
  • Spartan-3A User Guide (PDF, 15.2MB)
    • Architecture overview
    • Configuration procedures
    • Design guidelines and best practices
  • XA3S1500-4FG676I PCB Layout Guidelines (PDF, 1.5MB)
    • Board design recommendations
    • Signal integrity considerations
    • Thermal management guidelines

Development Tools

  • ISE Design Suite Compatibility Guide
  • XA3S1500-4FG676I Constraint Files (.ucf format)
  • Reference Design Examples (Verilog/VHDL)
  • Power Estimation Spreadsheet (Excel format)

Application Notes

  • AN-001: High-Speed Digital Design with XA3S1500-4FG676I
  • AN-002: Power Optimization Techniques
  • AN-003: Clock Domain Crossing Best Practices
  • AN-004: Industrial Temperature Testing Procedures

Related Resources

Development Boards

  • Spartan-3A Evaluation Board (SP3A-EVAL-1500)
    • Pre-configured with XA3S1500-4FG676I
    • Comprehensive I/O interfaces
    • Complete development environment

Compatible IP Cores

  • MicroBlaze Soft Processor Core
  • Ethernet MAC Controller
  • PCI Express Endpoint Core
  • DDR2/DDR3 Memory Controller
  • Video Processing IP Suite

Software Tools

  • Xilinx ISE Design Suite (Version 14.7 recommended)
  • ChipScope Pro Analyzer for debugging
  • PlanAhead Design Planning Tool
  • XPower Analyzer for power analysis

Training & Support

  • Online Training Modules: FPGA design fundamentals
  • Technical Support Portal: 24/7 online assistance
  • Community Forums: Peer-to-peer support network
  • Field Application Engineers: Direct technical consultation

Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliant: Meets EU Directive 2011/65/EU requirements
  • REACH Regulation: Compliant with EC 1907/2006
  • Conflict Minerals: 3TG conflict-free certified
  • Halogen-Free: Meets IEC 61249-2-21 standards
  • Green Package: Environmentally responsible packaging materials

Operating Conditions

  • Operating Temperature Range: -40ยฐC to +100ยฐC (Industrial)
  • Storage Temperature: -65ยฐC to +150ยฐC
  • Relative Humidity: 5% to 95% non-condensing
  • Altitude: Up to 2000 meters operational
  • Vibration Resistance: MIL-STD-883 Method 2007

Quality & Reliability Standards

  • Quality Grade: Industrial (I-grade)
  • MTBF Rating: >1,000,000 hours at 25ยฐC
  • ESD Protection: Human Body Model (HBM) 2kV minimum
  • Latch-up Immunity: 200mA per JEDEC Standard JESD78

Export Control Classification

  • ECCN: 3A001.a.7 (US Export Administration Regulations)
  • HTS Code: 8542.31.0001
  • Country of Origin: Manufactured in Singapore
  • Export License: May require export license for certain destinations
  • ITAR Status: Not subject to International Traffic in Arms Regulations

Certifications

  • ISO 9001:2015: Quality management system certified
  • ISO 14001:2015: Environmental management certified
  • IATF 16949: Automotive quality standard (where applicable)
  • AS9100D: Aerospace quality standard certified

Note: The XA3S1500-4FG676I represents a mature, proven FPGA solution with extensive design-in support and long-term availability commitment. For technical inquiries, pricing requests, or application support, contact your local Xilinx representative or authorized distributor.

Last updated: August 2025