1. Product Specifications
Core Features
- Device Family: Spartan-3A Automotive
- Logic Cells: 400,000 system gates
- Speed Grade: -4 (high performance)
- Package Type: FGG400 (Fine-pitch Ball Grid Array)
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
- Total I/O Pins: 280
- Distributed RAM: 56 Kbits
- Block RAM: 360 Kbits (20 blocks x 18 Kbits)
- Dedicated Multipliers: 20 (18×18 bit)
- Digital Clock Managers (DCMs): 4
- Maximum User I/O: 280
Performance Characteristics
- Operating Voltage: 1.2V core, 3.3V I/O
- Power Consumption: Optimized for low-power applications
- Configuration Memory: Non-volatile configuration support
- Programming: JTAG boundary scan support
- Compliance: Automotive AEC-Q100 qualified
Package Details
- Package Size: 17mm x 17mm
- Ball Pitch: 0.8mm
- Pin Count: 400 pins
- Moisture Sensitivity Level: MSL 3
2. Pricing Information
Pricing for the XA3S400A-4FGG400I varies based on quantity, distribution channel, and regional availability. Contact authorized distributors for current pricing:
- Single Unit Price: Contact for quote
- Volume Pricing: Available for quantities of 100+ units
- Lead Time: Standard 12-16 weeks (subject to availability)
- Minimum Order Quantity: 1 unit
Note: Prices subject to change without notice. Contact Xilinx or authorized distributors for current pricing and availability.
3. Documents & Media
Technical Documentation
- Datasheet: Spartan-3A FPGA Family Complete Data Sheet
- User Guide: Spartan-3A FPGA User Guide
- Package Information: FGG400 Package User Guide
- PCB Design Guidelines: Spartan-3A PCB Design and Pin Planning Guide
- Thermal Guidelines: Spartan-3A Thermal Design Considerations
Design Resources
- Development Tools: ISE Design Suite compatibility
- Reference Designs: Automotive application examples
- Simulation Models: IBIS and SPICE models available
- Constraint Files: UCF templates for FGG400 package
Application Notes
- Configuration and programming guidelines
- Power management best practices
- Signal integrity considerations
- Automotive compliance documentation
4. Related Resources
Development Tools
- Xilinx ISE Design Suite: Complete design environment
- ChipScope Pro: Real-time verification and debugging
- EDK (Embedded Development Kit): Embedded processor design
- System Generator: DSP design tool
Evaluation Boards
- Spartan-3A Evaluation Kit
- Automotive-specific development platforms
- Third-party development boards with FGG400 socket
IP Cores
- MicroBlaze soft processor
- DSP cores and libraries
- Interface IP (PCIe, Ethernet, USB)
- Memory controllers
Support Resources
- Xilinx Answer Database
- Community forums and support
- Application engineering support
- Training and certification programs
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free package available
- REACH Compliance: Meets European chemical regulations
- Automotive Grade: AEC-Q100 qualified for automotive applications
- Operating Temperature: -40ยฐC to +100ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
Quality Standards
- ISO/TS 16949: Automotive quality management
- Zero Defect Program: Comprehensive quality assurance
- Reliability Testing: Extended temperature and stress testing
- Traceability: Full manufacturing traceability
Export Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.39.0001
- Country of Origin: Various (check specific part marking)
- Export Licensing: May require export license for certain destinations
Certifications
- CE marking compliance
- FCC Part 15 Class B (when properly implemented)
- Industry-specific certifications available
- Automotive functional safety considerations (ISO 26262)
Applications
The XA3S400A-4FGG400I is ideal for:
- Automotive infotainment systems
- Industrial control and automation
- Communications infrastructure
- Medical device applications
- Aerospace and defense systems
- High-reliability embedded computing
Conclusion
The XA3S400A-4FGG400I represents a premium solution for designers requiring high-performance, automotive-qualified FPGA technology. With its robust feature set, extended temperature operation, and comprehensive development ecosystem, this device enables the creation of reliable, high-performance digital systems for the most demanding applications.
For technical support, pricing information, or sample requests for the XA3S400A-4FGG400I, contact your local Xilinx representative or authorized distributor.
