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XA3S500E-4CPG132Q FPGA: High-Performance Spartan-3E Series Solution

Original price was: $20.00.Current price is: $19.00.

Product Specifications

Core Features

  • Device Family: Spartan-3E FPGA Series
  • Logic Cells: 500,000 system gates
  • Speed Grade: -4 (Commercial temperature range)
  • Package Type: 132-pin Ceramic Pin Grid Array (CPGA)
  • Part Number: XA3S500E-4CPG132Q

Technical Specifications

  • Logic Elements: 4,656 logic cells
  • Block RAM: 360 Kbits distributed in 20 blocks (18 Kbit each)
  • Distributed RAM: 73 Kbits
  • Digital Clock Managers (DCMs): 4 units
  • Maximum User I/O: 92 pins
  • Dedicated Multipliers: 20 (18×18 bit)
  • Operating Voltage: 1.2V core, 3.3V I/O
  • Power Consumption: Low power design optimized for automotive applications

Performance Characteristics

  • Maximum Frequency: Up to 250 MHz
  • Temperature Range: -40ยฐC to +125ยฐC (Automotive grade)
  • Supply Voltage Range: VCCINT: 1.14V to 1.26V, VCCO: 1.2V to 3.3V
  • Static Power: Ultra-low standby current
  • Dynamic Power: Optimized for power-sensitive applications

Pricing Information

The XA3S500E-4CPG132Q pricing varies based on quantity and supplier. Contact authorized Xilinx distributors for current pricing:

  • Sample Quantities: Contact for evaluation pricing
  • Production Quantities: Volume discounts available
  • Lead Time: Standard lead times apply, expedited options available
  • Minimum Order: Varies by distributor

Note: Prices subject to change. Contact authorized distributors for current quotes and availability.

Documents & Media

Technical Documentation

  • Datasheet: Spartan-3E FPGA Family Complete Data Sheet (DS312)
  • User Guide: Spartan-3E FPGA User Guide (UG331)
  • Package Information: 132-Pin CPGA Package Specifications
  • Pinout Diagrams: Complete pin assignment documentation
  • Application Notes: Design implementation guidelines

Development Resources

  • ISE Design Suite: Compatible development environment
  • Reference Designs: Sample projects and tutorials
  • Simulation Models: IBIS and SPICE models available
  • PCB Design Files: Footprint libraries and symbols
  • Thermal Analysis: Junction temperature calculations

Quality Documentation

  • Qualification Reports: Automotive-grade testing results
  • Reliability Data: MTBF and failure rate analysis
  • Test Procedures: Production test specifications

Related Resources

Development Tools

  • Xilinx ISE Design Suite: Complete FPGA development environment
  • ChipScope Pro: Real-time design debugging and verification
  • System Generator: MATLAB/Simulink integration tools
  • EDK (Embedded Development Kit): Embedded processor design tools

Evaluation Platforms

  • Spartan-3E Starter Kit: Complete development platform
  • Custom Evaluation Boards: Application-specific demonstration boards
  • Reference Design Kits: Pre-configured development solutions

Related Products

  • XA3S400E-4CPG132Q: Lower gate count alternative
  • XA3S1000E-4CPG132Q: Higher capacity option
  • XC3S500E-4CPG132Q: Commercial temperature grade equivalent
  • Power Management ICs: Recommended voltage regulators and supervisors

Support Resources

  • Technical Support: Xilinx customer support portal
  • Community Forums: User community and expert assistance
  • Training Materials: Online courses and webinars
  • Application Engineers: Regional technical support teams

Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliant: Lead-free and environmentally friendly
  • REACH Regulation: Compliant with EU chemical safety requirements
  • Conflict Minerals: Responsible sourcing certified
  • Green Product: Xilinx environmental sustainability program

Quality Standards

  • Automotive Grade: AEC-Q100 qualified for automotive applications
  • ISO/TS 16949: Quality management system certified
  • Temperature Cycling: -40ยฐC to +125ยฐC operational range
  • Humidity Resistance: Suitable for harsh environmental conditions

Export Classifications

  • ECCN: Export Control Classification Number available upon request
  • HTS Code: Harmonized Tariff Schedule classification
  • Country of Origin: Manufacturing location documentation
  • Export Licensing: Compliance with international trade regulations

Package Environmental Data

  • Moisture Sensitivity Level: MSL-3 classification
  • Peak Reflow Temperature: 260ยฐC maximum
  • Storage Conditions: Dry pack requirements specified
  • Handling Precautions: ESD sensitive device protocols

The XA3S500E-4CPG132Q FPGA represents Xilinx’s commitment to delivering high-performance, reliable solutions for automotive and industrial applications. With its robust feature set, automotive-grade qualification, and comprehensive development ecosystem, this FPGA provides an ideal platform for demanding embedded applications requiring both performance and reliability.

For the most current specifications, pricing, and availability information for the XA3S500E-4CPG132Q, please consult with authorized Xilinx distributors or visit the official Xilinx website.