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XC2S600E-7FGG456I: High-Performance Spartan-II FPGA for Advanced Digital Design

Original price was: $20.00.Current price is: $19.00.

Product Specifications

Core Architecture

  • Device Family: Spartan-II E (XC2S600E)
  • System Gates: 600,000 gates
  • Logic Cells: 13,824 equivalent logic cells
  • Speed Grade: -7 (high-performance)
  • Package Type: FGG456 (Fine Pitch Ball Grid Array)
  • Temperature Grade: Industrial (-40ยฐC to +85ยฐC)

Memory and Storage

  • Block RAM: 72 Kbits total distributed RAM
  • Distributed RAM: 26,624 bits
  • Configuration Memory: SRAM-based
  • User I/O Pins: 333 maximum user I/O

Performance Characteristics

  • Maximum Operating Frequency: Up to 200 MHz (design dependent)
  • Propagation Delay: Optimized for speed grade -7
  • Power Consumption: Low-power CMOS technology
  • Supply Voltage: 2.5V core, 3.3V/2.5V I/O compatible

Package Details

  • Package: 456-pin Fine Pitch Ball Grid Array (FGG456)
  • Pitch: 1.0mm ball pitch
  • Dimensions: 23mm x 23mm
  • Pin Count: 456 total pins
  • Industrial Temperature Range: -40ยฐC to +85ยฐC

Pricing Information

Note: Pricing for the XC2S600E-7FGG456I varies based on quantity, distributor, and current market conditions. For accurate, up-to-date pricing:

  • Small Quantities (1-99 units): Contact authorized distributors
  • Volume Pricing (100+ units): Request quote from Xilinx or authorized partners
  • Production Quantities (1000+ units): Significant volume discounts available

Recommended Actions:

  • Contact Xilinx sales representatives for current pricing
  • Check with authorized distributors like Digi-Key, Mouser, or Arrow
  • Consider long-term supply agreements for production volumes

Documents & Media

Technical Documentation

  • XC2S600E Datasheet: Complete electrical and timing specifications
  • Spartan-II E User Guide: Comprehensive design and implementation guide
  • Package and Pinout Information: FGG456 package specifications and pin assignments
  • Design Constraints File: Timing and placement constraints for design tools

Development Resources

  • ISE Design Suite: Xilinx integrated development environment
  • Application Notes: Design best practices and implementation examples
  • Reference Designs: Sample projects and code examples
  • Evaluation Boards: Development platforms featuring the XC2S600E

Software and Tools

  • ISE WebPACK: Free development software (legacy support)
  • ModelSim Simulator: Logic simulation and verification tools
  • ChipScope Pro: On-chip debugging and analysis
  • Timing Analyzer: Static timing analysis tools

Related Resources

Compatible Development Boards

  • Spartan-II E Starter Kit: Entry-level development platform
  • Custom Evaluation Boards: Third-party development solutions
  • Prototyping Boards: Various form factors for proof-of-concept designs

Complementary Products

  • Configuration Devices: Platform Flash PROMs and serial Flash
  • Power Management: Voltage regulators and power sequencing solutions
  • Oscillators and Clocks: Precision timing sources
  • Interface Components: Level translators and signal conditioning

Design Services

  • Xilinx Alliance Partners: Certified design service providers
  • Training and Education: FPGA design courses and workshops
  • Technical Support: Application engineering assistance
  • IP Cores: Pre-verified intellectual property modules

Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliant: Lead-free and environmentally friendly
  • REACH Compliant: European chemical regulation compliance
  • Conflict Minerals: Responsible sourcing certification
  • ISO 14001: Environmental management system certified

Export Control Information

  • ECCN (Export Control Classification Number): 3A001.a.7
  • Country of Origin: Manufactured in various Xilinx facilities
  • Export License: May require export license for certain destinations
  • Dual-Use Technology: Subject to export administration regulations

Quality and Reliability

  • Automotive Grade: AEC-Q100 qualified versions available
  • Military/Aerospace: Extended temperature and radiation-hardened variants
  • Quality Standards: ISO 9001 certified manufacturing
  • Reliability Testing: Comprehensive qualification and stress testing

Package and Shipping

  • Moisture Sensitivity Level: MSL 3 (standard handling procedures)
  • ESD Classification: Class 1 (>2000V HBM)
  • Packaging Options: Tape and reel, trays, or anti-static tubes
  • Lead Time: Varies by market conditions and order quantity

Applications and Use Cases

The XC2S600E-7FGG456I excels in diverse applications including digital signal processing, communications infrastructure, industrial control systems, and prototype development. Its balanced combination of logic capacity, I/O flexibility, and cost-effectiveness makes it suitable for both high-volume production and specialized custom applications.

Key Benefits:

  • High logic density with 600,000 system gates
  • Industrial temperature range operation
  • Extensive I/O capabilities with 333 user pins
  • Proven Spartan-II E architecture reliability
  • Cost-effective solution for volume production

For detailed technical specifications, design resources, and purchasing information, consult the official Xilinx documentation or contact authorized distributors.