Product Specifications
Core Features
- Device Family: Xilinx Spartan-IIE
- Logic Cells: 600,000 system gates
- Package Type: FG456 (Fine-pitch Ball Grid Array)
- Pin Count: 456 pins
- Speed Grade: Commercial grade (-6)
- Operating Temperature: 0ยฐC to +85ยฐC
- Supply Voltage: 2.5V core, 3.3V I/O
Technical Specifications
- Configurable Logic Blocks (CLBs): 1,176
- Input/Output Blocks: 284
- Block RAM: 72 Kbits
- Dedicated Multipliers: 16 (18×18 bit)
- Digital Clock Managers (DCMs): 4
- Global Clock Networks: 8
- Maximum User I/O: 284 pins
Package Details
- Package Dimensions: 23mm x 23mm
- Ball Pitch: 1.0mm
- Mounting Type: Surface Mount
- Lead-Free: RoHS compliant
- Moisture Sensitivity Level: MSL 3
Pricing Information
Note: Pricing for the XC2S600E-FG456AG varies based on quantity, supplier, and current market conditions. For accurate pricing:
- Small Quantities (1-99 units): Contact authorized distributors
- Volume Pricing: Available for quantities of 100+ units
- Engineering Samples: May be available through Xilinx direct
- Recommended Action: Request quotes from multiple authorized Xilinx distributors for competitive pricing
Pricing is subject to change and availability. Contact your local Xilinx representative for current pricing and lead times.
Documents & Media
Technical Documentation
- Product Data Sheet: XC2S600E complete specifications and electrical characteristics
- User Guide: Spartan-IIE FPGA User Guide (UG002)
- Package Information: FG456 package specifications and PCB design guidelines
- Migration Guide: Spartan-II to Spartan-IIE migration documentation
Design Resources
- Reference Designs: Application-specific reference implementations
- Development Board Documentation: Evaluation board schematics and user guides
- Pin-out Files: IBIS models and pin constraint files
- Timing Models: Speed files and timing analysis data
Software & Tools
- ISE Design Suite: Compatible with Xilinx ISE versions 6.1i and later
- Impact Configuration Tool: For device programming and configuration
- ChipScope Pro: For embedded logic analysis and debugging
- Timing Analyzer: For comprehensive timing analysis and optimization
Related Resources
Development Platforms
- Spartan-IIE Evaluation Boards: Complete development platforms featuring the XC2S600E
- Prototyping Boards: Third-party development boards supporting FG456 package
- Custom Carrier Boards: PCB design files and reference layouts
Compatible Components
- Configuration Devices: Platform Flash PROMs and SPI Flash memories
- Power Management: Recommended voltage regulators and power sequencing solutions
- Clock Sources: Compatible oscillators and clock generation circuits
- Interface Components: Level translators and signal conditioning circuits
Application Areas
- Industrial Automation: Process control and monitoring systems
- Communications: Protocol processing and data path acceleration
- Test Equipment: Automated test systems and measurement instruments
- Automotive: Engine control units and dashboard systems
- Medical Devices: Portable diagnostic equipment and monitoring systems
Design Support
- Application Notes: Detailed implementation guides for common applications
- Community Forums: Xilinx developer community and technical support
- Training Materials: Online courses and webinars for FPGA design
- Technical Support: Direct access to Xilinx technical experts
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- REACH Compliant: Complies with EU chemical regulation requirements
- Lead-Free: Manufactured using lead-free soldering processes
- Halogen-Free: Package materials are halogen-free for environmental safety
Operating Conditions
- Operating Temperature Range: 0ยฐC to +85ยฐC (Commercial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 10% to 90% non-condensing
- Altitude: Up to 2,000 meters above sea level
Export Control Information
- ECCN Classification: 3A001.a.7 (US Export Administration Regulations)
- HTS Code: 8542.39.0001 (Harmonized Tariff Schedule)
- Country of Origin: Varies by manufacturing location
- Export Restrictions: Subject to US Department of Commerce export regulations
Quality & Reliability
- Quality Standard: ISO 9001:2015 certified manufacturing
- Reliability Testing: Comprehensive qualification per JEDEC standards
- Electrostatic Discharge: Class 1C (>1000V) ESD protection
- Mean Time Between Failures: >1,000,000 hours at 55ยฐC
Packaging & Handling
- Anti-Static Packaging: Devices shipped in conductive tubes or trays
- Moisture Sensitivity: MSL 3 – 168 hours at 30ยฐC/60% RH after bag opening
- Storage Requirements: Store in original moisture barrier bag until use
- Handling Precautions: Use proper ESD protection during handling and assembly
The XC2S600E-FG456AG represents proven FPGA technology with extensive design support and global availability. Contact your local Xilinx representative or authorized distributor for detailed technical support and purchasing information.
