1. Product Specifications
Core Features
- Device Family: Xilinx Spartan-IIE
- Part Number: XC2S50E-6FT256I0750
- System Gates: 50,000
- Logic Cells: 1,728
- CLB Matrix: 24 x 24
- Maximum User I/O: 176
- Block RAM: 40 Kb total
- Distributed RAM: 27 Kb
Package Details
- Package Type: 256-ball Fine-Pitch Ball Grid Array (FTBGA)
- Package Size: 17mm x 17mm
- Pin Count: 256
- Ball Pitch: 1.0mm
- Industrial Temperature Range: -40ยฐC to +100ยฐC
Performance Specifications
- Speed Grade: -6 (indicating performance level)
- Maximum Operating Frequency: Up to 200+ MHz (design dependent)
- Power Supply: 2.5V core, 3.3V I/O
- Configuration: SRAM-based with multiple configuration options
Memory Resources
- Block SelectRAM: 8 blocks of 4K bits each
- Distributed SelectRAM: Available in CLBs
- Total Memory: Up to 40 Kb block RAM + 27 Kb distributed RAM
2. Pricing Information
Note: Pricing for the XC2S50E-6FT256I0750 varies based on quantity, distributor, and current market conditions. For accurate, up-to-date pricing:
- Volume Pricing: Contact authorized Xilinx distributors for quantity-based pricing
- Sample Availability: Engineering samples may be available for qualified projects
- Lead Time: Typically 8-16 weeks for standard orders
- Recommended Distributors: Digi-Key, Mouser Electronics, Arrow Electronics, Avnet
Contact your local Xilinx representative or authorized distributor for current pricing and availability.
3. Documents & Media
Technical Documentation
- Datasheet: XC2S50E Spartan-IIE FPGA Complete Data Sheet (DS077)
- User Guide: Spartan-IIE FPGA Family Complete Data Sheet
- Package Information: 256-ball FTBGA Package Specifications
- Configuration Guide: Spartan-IIE Configuration User Guide
- Design Considerations: PCB Design Guidelines for FTBGA Packages
Development Resources
- ISE Design Suite: Compatible with Xilinx ISE versions 6.1i through 14.7
- Reference Designs: Available through Xilinx Application Notes
- Evaluation Boards: Spartan-IIE Starter Kit and evaluation platforms
- Application Notes: XAPP notes covering implementation best practices
Package and Pinout
- Pinout Diagrams: Complete pin assignment documentation
- Package Drawings: Mechanical specifications and land patterns
- Thermal Characteristics: Junction-to-ambient thermal resistance data
4. Related Resources
Development Tools
- Xilinx ISE Design Suite: Primary development environment
- ChipScope Pro: For embedded logic analysis
- ModelSim: Supported simulation environment
- Third-party Tools: Compatible with various EDA tools
Evaluation Hardware
- Spartan-IIE Starter Kit: Complete development platform
- Evaluation Modules: Third-party development boards
- Reference Designs: Pre-built design examples and demos
Support Resources
- Xilinx Support: Technical support and documentation portal
- Community Forums: User community and peer support
- Training Materials: Online courses and webinars
- Application Engineers: Local technical support contacts
Compatible Products
- Configuration Devices: Platform Flash PROMs and serial Flash
- Power Management: Voltage regulators and power solutions
- Clocking: Crystal oscillators and clock management devices
- Interface Components: Level translators and I/O expansion
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free package options available
- REACH Regulation: Compliant with EU chemical safety requirements
- Conflict Minerals: Conflict-free sourcing certified
- ISO 14001: Manufactured in ISO 14001 certified facilities
Operating Conditions
- Operating Temperature: -40ยฐC to +100ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 85% RH non-condensing
- Altitude: Up to 2000m operational
Reliability Standards
- MTBF: > 1,000,000 hours at 55ยฐC
- ESD Protection: Class 1 (>1kV) and Class 2 (>2kV)
- Latch-up Immunity: >100mA
- Qualification: Automotive and industrial qualification available
Export Classifications
- ECCN: 3A001.a.7 (US Commerce Control List)
- HTS Code: 8542.33.0001 (Harmonized Tariff Schedule)
- Country of Origin: Varies by manufacturing location
- Export License: May require export license for certain destinations
Quality Certifications
- ISO 9001: Quality management system certified
- TS 16949: Automotive quality standards (where applicable)
- AS9100: Aerospace quality standards (where applicable)
- IPC Standards: PCB assembly and soldering standards compliance
Why Choose XC2S50E-6FT256I0750?
The XC2S50E-6FT256I0750 represents an optimal balance of performance, cost, and flexibility for mid-range FPGA applications. Its proven Spartan-IIE architecture, combined with comprehensive development tool support and extensive documentation, makes it an excellent choice for both prototype development and volume production.
Whether you’re implementing digital signal processing algorithms, creating custom interfaces, or developing embedded control systems, the XC2S50E-6FT256I0750 provides the resources and reliability needed for successful project completion.
For technical questions, design support, or to request samples of the XC2S50E-6FT256I0750, contact your local Xilinx representative or authorized distributor.
