XC2S200E6PQG208C – Xilinx Spartan-IIE FPGA | High-Performance Programmable Logic Device

1. Product Specifications

Core Architecture

• Device Family: Xilinx Spartan-IIE
• System Gates: 200,000
• Logic Cells: 5,292 equivalent
• CLB Array: 56 x 56
• Total CLBs: 1,176
• Speed Grade: -6 (industrial grade)

Memory and Storage

• Block RAM: 56 blocks (4,608 bits each)
• Total Block RAM: 258,048 bits
• Distributed RAM: 67,584 bits

I/O Capabilities

• Package Type: PQ208 (Plastic Quad Flat Pack)
• Maximum User I/Os: 146
• I/O Standards: LVTTL, LVCMOS, PCI, GTL+, HSTL, SSTL
• Differential I/O Pairs: Available

Performance Specifications

• Operating Voltage: 2.5V core, 3.3V I/O
• Operating Temperature: Commercial (0°C to +85°C)
• Maximum Frequency: Up to 200 MHz
• Power Consumption: Low static power

Physical Characteristics

• Package Dimensions: 28mm x 28mm
• Pin Count: 208 pins
• Lead Pitch: 0.5mm
• Weight: Approximately 2.5 grams

2. Price Information

The XC2S200E6PQG208C pricing varies based on quantity, supplier, and current market conditions. For the most accurate and up-to-date pricing information:

• Sample Quantities: Contact authorized Xilinx distributors
• Production Volumes: Request quote for volume pricing
• Lead Time: Typically 4-12 weeks depending on availability
• Minimum Order Quantity: Varies by supplier

Note: Prices are subject to change based on market conditions and availability. Contact authorized distributors for current pricing.

3. Documents & Media

Technical Documentation

• Product Data Sheet: Comprehensive specifications and electrical characteristics
• User Guide: Detailed implementation guidelines and best practices
• Configuration Guide: Programming and configuration procedures
• Package Information: Mechanical drawings and thermal specifications
• Errata Sheet: Known issues and workarounds

Design Resources

• Reference Designs: Application-specific implementation examples
• IP Core Library: Pre-verified intellectual property blocks
• Constraint Files: Timing and placement constraint templates
• Simulation Models: VHDL and Verilog behavioral models

Software Tools

• ISE Design Suite: Complete development environment
• WebPACK: Free development tools for Spartan devices
• ChipScope Pro: Advanced debugging and analysis tools

4. Related Resources

Development Boards

• Spartan-IIE Starter Kit: Complete evaluation and development platform
• Custom Development Boards: Third-party solutions available

Complementary Products

• XC2S100E: Lower-density option in same family
• XC2S300E: Higher-density alternative
• Configuration Devices: Platform Flash and other configuration solutions

Application Notes

• Digital Signal Processing: Implementation guidelines for DSP applications
• Interface Design: Best practices for I/O implementation
• Power Management: Techniques for optimizing power consumption
• Timing Closure: Strategies for meeting timing requirements

Technical Support

• Xilinx Support Forums: Community-driven technical discussions
• Application Engineering: Direct support from Xilinx experts
• Training Courses: Online and in-person FPGA design training
• Webinars: Regular technical presentations and updates

5. Environmental & Export Classifications

RoHS Compliance

• Status: RoHS Compliant (Lead-free)
• Compliance Date: Meets current RoHS directives
• Material Declaration: Available upon request

Environmental Specifications

• Operating Temperature Range: 0°C to +85°C (Commercial grade)
• Storage Temperature Range: -65°C to +150°C
• Humidity: 5% to 95% non-condensing
• Thermal Resistance: θJA = 32°C/W (typical)

Export Control Classifications

• ECCN: 3A001.a.2 (US Export Control)
• HTS Code: 8542.31.0001
• Country of Origin: Varies by manufacturing location
• Export License: May require export license for certain destinations

Quality and Reliability

• Quality Grade: Industrial standard
• MTBF: >1,000,000 hours at 25°C
• Package Qualification: Meets JEDEC standards
• ESD Rating: Class 1C (>1000V)

Manufacturing Information

• Lead Finish: Matte tin (Pb-free)
• Package Material: Plastic molding compound
• Die Attach: Eutectic gold-silicon
• Wire Bond: Gold wire, 25μm diameter

The XC2S200E6PQG208C represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based designs. Its proven architecture and comprehensive development ecosystem make it suitable for a wide range of applications from prototyping to production deployment.