1. Product Specifications
Core Architecture
- Logic Cells: 100,000 system gates
- CLBs (Configurable Logic Blocks): 1,200
- I/O Pins: 176 user I/O pins
- Package Type: FT256 (Fine-Pitch Ball Grid Array)
- Speed Grade: -5 (standard performance)
- Temperature Range: Industrial (-40ยฐC to +85ยฐC)
Memory Configuration
- Block RAM: 40 Kbits total
- Distributed RAM: Integrated within CLBs
- Configuration Memory: SRAM-based
Clock Management
- DLLs (Delay Locked Loops): 4 integrated DLLs
- Global Clock Networks: 4 dedicated global clock buffers
- Maximum Frequency: Up to 200 MHz (speed grade dependent)
I/O Characteristics
- I/O Standards Support: LVTTL, LVCMOS, PCI, GTL+
- Differential I/O Support: LVDS compatible
- Drive Strength: Configurable output drive strength
- Input/Output Voltage: 1.8V to 3.3V
Physical Specifications
- Package: 256-pin Fine-Pitch BGA (FT256)
- Package Size: 17mm ร 17mm
- Ball Pitch: 1.0mm
- Operating Voltage: 2.5V core, 1.8V-3.3V I/O
2. Pricing Information
XC2S100E-5FT256I pricing varies based on quantity and supplier. Contact authorized distributors for current pricing:
- Sample Quantities (1-9 units): Contact for quote
- Production Quantities (100+ units): Volume pricing available
- Engineering Samples: Available through Xilinx partners
Note: Prices are subject to change based on market conditions and availability. Contact authorized distributors such as Digi-Key, Mouser Electronics, or Arrow Electronics for real-time pricing and stock availability.
3. Documents & Media
Technical Documentation
- XC2S100E-5FT256I Datasheet: Complete electrical specifications and operating characteristics
- Spartan-II Family Data Sheet: Comprehensive family overview and feature comparison
- FT256 Package Documentation: Mechanical drawings and thermal characteristics
- Configuration Guide: Programming and configuration procedures
Design Resources
- ISE Design Suite Support: Compatible with Xilinx ISE development tools
- Reference Designs: Sample projects and application notes
- Constraint Files: UCF files for pin assignments and timing constraints
- IBIS Models: Signal integrity simulation models
Application Notes
- Power Management Guidelines: Optimizing power consumption strategies
- PCB Layout Recommendations: Best practices for FT256 package routing
- Thermal Management: Heat dissipation and cooling solutions
4. Related Resources
Development Tools
- Xilinx ISE Design Suite: Primary development environment for XC2S100E-5FT256I
- ChipScope Pro: Integrated logic analyzer for debugging
- FPGA Editor: Low-level design editing and optimization tool
Evaluation Platforms
- Spartan-II Development Boards: Reference platforms for rapid prototyping
- Third-party Development Kits: Compatible evaluation boards from various vendors
Support Resources
- Xilinx Support Portal: Technical documentation and community forums
- Application Engineering: Direct technical support for design challenges
- Training Materials: Online courses and tutorials for FPGA development
Compatible Products
- Configuration Devices: Platform Flash and serial configuration ROMs
- Clock Management: External clock generation and distribution ICs
- Interface Components: Level translators and signal conditioning circuits
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free package meets RoHS directive requirements
- REACH Compliant: Complies with EU chemical regulation standards
- Green Package: Environmentally friendly packaging materials
Operating Environment
- Temperature Range: -40ยฐC to +85ยฐC (Industrial grade)
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters operational
- Shock and Vibration: Meets IEC standards for industrial applications
Export Classifications
- ECCN (Export Control Classification Number): Check current regulations
- Country of Origin: Manufactured in authorized facilities
- REACH SVHC: Compliant with Substances of Very High Concern regulations
- Conflict Minerals: Sourced through responsible supply chain practices
Quality Standards
- ISO 9001 Manufacturing: Produced in ISO-certified facilities
- Automotive Grade: Available in automotive-qualified versions
- Military/Aerospace: Contact for extended temperature and reliability options
Reliability Specifications
- MTBF (Mean Time Between Failures): >1,000,000 hours at 55ยฐC
- Endurance: 10,000+ configuration cycles minimum
- Data Retention: >20 years at 85ยฐC
The XC2S100E-5FT256I represents a mature, reliable FPGA solution ideal for industrial applications requiring proven performance and long-term availability. Contact authorized distributors for current availability, pricing, and technical support.
