1. Product Specifications
Core Features
- Family: Spartan-IIE 1.8V FPGA
- System Gates: 600,000 gates
- Logic Cells: 15,552 cells
- Maximum Frequency: 357MHz
- Technology Node: 0.15ฮผm CMOS process
- Supply Voltage: 1.8V
- Package Type: 676-pin Fine-pitch Ball Grid Array (FBGA)
- Package Size: 27mm x 27mm
- Ball Pitch: 1.0mm
Memory Architecture
- Block RAM: Up to 288Kb
- Distributed RAM: Up to 221,184 bits
- Total RAM: 36KB internal memory
I/O Capabilities
- User I/Os: 514 pins
- I/O Standards: 19 selectable standards including LVTTL, LVCMOS, SSTL, HSTL
- Differential I/Os: Available
- Voltage Range: 1.2V to 3.3V I/O support
Performance Specifications
- Maximum Operating Frequency: 357MHz
- Operating Temperature Range: 0ยฐC to +85ยฐC (Commercial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Logic Utilization: Up to 15,552 configurable logic blocks (CLBs)
System Features
- Delay-Locked Loops (DLLs): 4 DLLs for clock management
- In-System Programmability: Unlimited reprogramming capability
- Configuration Memory: SRAM-based
- Power Consumption: Low-power 1.8V operation
2. Pricing Information
Market Pricing (2025)
The XC2S600E-6FG676C is available through authorized distributors and independent electronic component suppliers. Current market conditions show:
- Price Range: $45 – $120 USD per unit (varies by quantity and supplier)
- Minimum Order Quantity (MOQ): Typically 1-10 pieces for sample quantities
- Volume Pricing: Available for quantities of 100+ units
- Lead Time: 2-8 weeks depending on availability
- Stock Status: Limited availability – legacy component
Authorized Distributors
- Ariat Technology Ltd
- Worldway Electronics
- IC-Components
- DigiPart
- FPGAkey
Note: As this is a legacy component marked “NOT RECOMMENDED for NEW DESIGN,” pricing may fluctuate based on remaining inventory levels.
3. Documents & Media
Technical Documentation
- Official Datasheet: DS077 – Spartan-IIE FPGA Family Data Sheet
- User Guide: Spartan-IIE FPGA User Guide
- Package Information: 676-pin FBGA Package Details
- Pin Configuration: Complete pinout documentation
- PCB Design Guidelines: Layout recommendations for optimal performance
Development Resources
- ISE Design Suite: Legacy development environment
- Reference Designs: Application notes and example projects
- Simulation Models: IBIS and SPICE models available
- Characterization Reports: Timing and power analysis data
Application Notes
- AN154: Using Spartan-IIE Block RAM
- AN175: Spartan-IIE Clock Management
- AN156: High-Speed I/O Design Techniques
4. Related Resources
Development Tools
- Software: Xilinx ISE Design Suite (legacy)
- Programming: iMPACT configuration tool
- Simulation: ModelSim integration
- Synthesis: XST synthesis tool
Compatible Components
- Configuration Devices:
- XC18V04 (4Mb configuration PROM)
- XCF04S Platform Flash
- Supporting ICs:
- Clock generators
- Voltage regulators (1.8V core, 3.3V I/O)
- Level translators
Alternative Recommendations
Since the XC2S600E-6FG676C is not recommended for new designs, consider these modern alternatives:
- Spartan-7 Series: XC7S25, XC7S50 (pin-compatible options)
- Artix-7 Series: XC7A35T, XC7A50T (enhanced performance)
- Zynq-7000: XC7Z010, XC7Z020 (ARM + FPGA integration)
Application Areas
- Legacy System Maintenance: Replacement for existing designs
- Industrial Automation: Process control and monitoring
- Communications: Protocol processing and data handling
- Test Equipment: Automated test systems
- Educational: FPGA learning and prototyping
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Non-Compliant (contains lead)
- Lead-Free Alternative: XC2S600E-6FG676I (industrial temperature)
- REACH Compliance: Compliant with current regulations
- Conflict Minerals: Compliant with Section 1502
Export Control Classifications
- ECCN: 3A001.a.7 (US Export Administration Regulations)
- HTS Code: 8542.31.0001
- Country of Origin: Various (depending on assembly location)
- Export License: May be required for certain destinations
Package & Quality Standards
- Package Material: Lead-free solder balls (Pbfree variants available)
- Moisture Sensitivity: Level 3 (168 hours at 30ยฐC/60% RH)
- Quality Grade: Commercial (0ยฐC to +85ยฐC)
- Qualification Standards: Automotive grade variants available (XC2S600E-6FG676Q)
Handling Precautions
- ESD Sensitive: Handle with proper anti-static procedures
- Storage: Store in anti-static packaging below 30ยฐC
- Soldering: Lead-free compatible soldering process required
- Thermal Management: Adequate cooling required for high-utilization designs
Important Notice: The XC2S600E-6FG676C is a legacy product not recommended for new designs. For new projects, AMD Xilinx recommends migrating to current Spartan-7 or Artix-7 families for enhanced performance, lower power consumption, and continued product support.
For technical support, documentation, and migration guidance, contact AMD Xilinx or authorized distributors. Ensure compliance with local export regulations before international shipment.
