Transform your electronic designs with cutting-edge Embedded Die PCB technology that seamlessly integrates bare semiconductor dies directly into the printed circuit board substrate. This revolutionary approach eliminates traditional IC packaging, creating ultra-compact, high-performance electronic assemblies.
Key Features:
- Ultra-Miniaturization: Reduce overall device footprint by up to 40% compared to conventional surface-mount components
- Enhanced Electrical Performance: Minimize parasitic inductance and capacitance with direct die-to-trace connections
- Superior Thermal Management: Improved heat dissipation through direct substrate contact
- Increased Reliability: Eliminate wire bond failures and package-related stress points
- Design Flexibility: Enable complex 3D circuit architectures and heterogeneous integration
Technical Capabilities:
- Compatible with various die sizes from 0.5mm to 15mm
- Support for multiple die types: processors, memory, sensors, power management ICs
- Advanced cavity formation with precision depth control (ยฑ10ฮผm)
- High-density interconnect with via-in-pad technology
- Multi-layer embedding up to 20+ layers
Applications:
- Wearable electronics and IoT devices
- Aerospace and defense systems
- Medical implants and diagnostics
- High-frequency RF/microwave circuits
- Automotive electronics (ADAS, infotainment)
- Mobile devices and tablets
Manufacturing Process: Our state-of-the-art fabrication facility employs laser drilling, precision placement, and advanced lamination techniques to ensure consistent, high-yield production. Each embedded die undergoes rigorous testing and inspection to guarantee optimal performance and reliability.
Benefits:
- Reduced assembly costs and complexity
- Enhanced signal integrity and speed
- Improved electromagnetic compatibility (EMC)
- Extended operating temperature range
- Future-proof design scalability
Experience the next generation of PCB technology with our Embedded Die solutions – where innovation meets miniaturization.
